Le mishini isebenzisa isakhiwo somnyango wangaphambili oqondile kanye nokwakheka kweqoqo. Ingafakelwa imithombo yokuhwamuka kwezinsimbi nezinto ezahlukahlukene eziphilayo, futhi ingahwamukisa ama-wafer e-silicon anezincazelo ezahlukene. Ifakwe uhlelo lokuqondanisa ngokunembile, i-coating izinzile futhi i-coating iyakwazi ukuphindeka kahle.
Imishini yokumboza ye-GX600 ingakwazi ukuhwamukisa izinto ezikhipha ukukhanya kwemvelo noma izinto zensimbi ngokunembile, ngokulinganayo nangokulawulayo ziye ku-substrate. Inezinzuzo zokwakheka kwefilimu okulula, ubumsulwa obuphezulu kanye nokubumbana okuphezulu. Uhlelo lokuqapha lwefilimu oluzenzakalelayo oluphelele ngesikhathi sangempela lungaqinisekisa ukuphindaphindeka kanye nokuqina kwenqubo. Ifakwe umsebenzi wokuzincibilikisa ukuze kuncishiswe ukuncika kumakhono omqhubi.
Imishini ingasetshenziswa ku-Cu, Al, Co, Cr, Au, Ag, Ni, Ti nezinye izinto zensimbi, futhi ingambozwa ngefilimu yensimbi, ifilimu yesendlalelo se-dielectric, ifilimu ye-IMD, njll. Isetshenziswa kakhulu embonini ye-semiconductor, njengamadivayisi kagesi, i-semiconductor yangemuva yokumboza i-substrate, njll.
| I-GX600 | I-GX900 |
| φ600*800(mm) | φ900*H1050(mm) |