Ezi zixhobo zisebenzisa ulwakhiwo oluthe nkqo lomnyango wangaphambili kunye noyilo lweqela. Zinokuxhotyiswa ngemithombo yokufuma yesinyithi kunye nezinto ezahlukeneyo zendalo, kwaye zinokukhupha ii-silicon wafers zeenkcukacha ezahlukeneyo. Zixhotyiswe ngenkqubo yokulungelelanisa ngokuchanekileyo, uphahla luzinzile kwaye uphahla lunokuphindaphindwa kakuhle.
Izixhobo zokugquma ze-GX600 zinokukhupha ngokuchanekileyo, ngokulinganayo nangokulawulekayo izinto ezikhupha ukukhanya okanye izinto zesinyithi ezisebenzisa ukukhanya kwendalo kwi-substrate. Zineengenelo zokwenziwa kwefilimu elula, ubunyulu obuphezulu kunye nokuxinana okuphezulu. Inkqubo yokujonga ubungqingqwa befilimu ezenzekelayo ngexesha langempela inokuqinisekisa ukuphindaphindwa kunye nokuzinza kwenkqubo. Ixhotyiswe ngomsebenzi wokuzinyibilikisa ukuze kuncitshiswe ukuxhomekeka kwizakhono zomqhubi.
Izixhobo zingasetyenziswa kwiCu, Al, Co, Cr, Au, Ag, Ni, Ti kunye nezinye izinto zesinyithi, kwaye zinokugqunywa ngefilimu yesinyithi, ifilimu yomaleko we-dielectric, ifilimu ye-IMD, njl. Isetyenziswa kakhulu kwishishini le-semiconductor, njengezixhobo zamandla, i-semiconductor ngasemva yokugquma i-substrate, njl.
| GX600 | GX900 |
| φ600*800(mm) | φ900*H1050(mm) |