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ʻO ka hoʻoheheʻe ʻana o Magnetron a me ka ʻenehana hoʻohuihui hoʻohuihui ʻana i ka ʻenehana multi-arc ion coating

Kumu ʻatikala:Zhenhua vacuum
Heluhelu:10
Paʻi ʻia: 22-11-08

Hiki ke hana kaʻawale a me ka manawa like nā mea hoʻopili hoʻohuihui o ka magnetron sputtering a me ka cathodic multi-arc ion coating;hiki ke waiho ʻia a hoʻomākaukau ʻia ke kiʻiʻoniʻoni metala maʻemaʻe, kiʻiʻoniʻoni hui metala a i ʻole kiʻi ʻoniʻoni hui;hiki ke lilo i hoʻokahi papa kiʻiʻoniʻoni a me kahi kiʻiʻoniʻoni multi-layer composite.

ʻO kāna mau pōmaikaʻi penei:
ʻAʻole ia e hoʻohui wale i nā pono o nā ʻāpana ion like ʻole a noʻonoʻo i ka hoʻomākaukau ʻana a me ka waiho ʻana o nā kiʻi ʻoniʻoni lahilahi no nā ʻano o ka noi, akā hiki nō hoʻi i ka waiho ʻana a me ka hoʻomākaukau ʻana i nā kiʻiʻoniʻoni monolithic multi-layer a i ʻole nā ​​​​kiʻi ʻoniʻoni multi-layer composite i loko o ka pahu like. keena uhi i ka manawa hookahi.
Hoʻohana nui ʻia nā noi o nā papa kiʻiʻoniʻoni i waiho ʻia i kāna ʻenehana i nā ʻano like ʻole, nā ʻano maʻamau e like me kēia:
(1) Ka hui o ka non-equilibrium magnetron sputtering a cathodic ion plating ʻenehana.
Hōʻike ʻia kāna mea hana penei.ʻO ia kahi mea hoʻopili hoʻohuihui o ka pahu magnetron columnar a me ka planar cathodic arc ion coating, i kūpono no nā mea hana ʻelua hoʻohuihui kiʻiʻoniʻoni a me ka uhi kiʻiʻoniʻoni hoʻonaninani.No ka mea hoʻopili mea hana, hoʻohana mua ʻia ka cathodic arc ion coating no ka uhi ʻana o ke kumu, a laila hoʻohana ʻia ke kolamu magnetron target no ka waiho ʻana o ka nitride a me nā papa kiʻiʻoniʻoni ʻē aʻe e kiʻi i kahi kiʻiʻoniʻoni kiʻekiʻe.
No ka uhi ʻana, hiki ke waiho ʻia nā kiʻi ʻoniʻoni ʻoniʻoni ʻo TiN a me ZrN e ka cathodic arc coating ma mua, a laila doped me ka metala me ka hoʻohana ʻana i nā pahu magnetron, a maikaʻi loa ka hopena doping.

(2) Ka hui o ka māhoe mokulele māhoe a me ka kolamu cathode arc ion ʻenehana uhi.Hōʻike ʻia ka hāmeʻa e like me kēia.Hoʻohana ʻia ia i ka ʻenehana pahuhopu māhoe kiʻekiʻe, i ka wā e hoʻopili ʻia ai ʻelua mau ʻaoʻao māhoe ʻaoʻao i ka mana alapine alapine, ʻaʻole ia e lanakila wale i ka make ʻana o ka DC sputtering, ke ahi a me nā drawbacks ʻē aʻe;a hiki ke waiho iā Al203, SiO2 oxide kiʻiʻoniʻoni maikaʻi, no laila ua hoʻonui a hoʻomaikaʻi ʻia ka pale ʻana o ka oxidation o nā ʻāpana i uhi ʻia.Columnar multi-arc pahu hopu i hoʻokomo 'ia i loko o ke kikowaena o ka vacuum keena, i ka pahu hopu mea hiki ke hoʻohana 'ia Ti a me Zr, 'aʻole wale no ka malama ana i ka pono o kiʻekiʻe multi-arc dissociation rate, deposition rate, akā, hiki no hoi e hoemi pono i "droplets" ma. ke kaʻina hana o ka mokulele liʻiliʻi multi-arc target deposition, hiki ke waiho a hoʻomākaukau i kahi porosity haʻahaʻa o nā kiʻiʻoniʻoni metala, nā kiʻiʻoniʻoni hui.Inā hoʻohana ʻia ʻo Al a me Si ma ke ʻano he mea i hoʻopaʻa ʻia no ka māhoe planar magnetron target i hoʻokomo ʻia ma ka ʻaoʻao, hiki ke waiho ʻia a hoʻomākaukau ʻia nā kiʻi ʻoniʻoni metala-ceramic Al203 a i ʻole Si0.Eia kekahi, hiki ke hoʻokomo ʻia nā mokulele liʻiliʻi he nui o ka multi-arc evaporation source ma ka ʻaoʻao, a ʻo kāna mea i hoʻopaʻa ʻia e hiki ke Cr a i ʻole Ni, a hiki ke waiho ʻia a hoʻomākaukau ʻia nā kiʻi ʻoniʻoni metala a me nā kiʻi ʻoniʻoni multilayer.No laila, ʻo kēia ʻenehana hoʻopili hoʻohuihui he ʻenehana hoʻopili hoʻohui me nā noi he nui.


Ka manawa hoʻouna: Nov-08-2022