Lubtxheej nqus tsevCov txheej txheem tshuab tau muab faib ua: txheej txheej nqus tsev evaporation, txheej txheej nqus tsev sputtering thiab txheej txheej nqus tsev ion.
1, Lub tshuab nqus tsev evaporation txheej
Nyob rau hauv lub tshuab nqus tsev, ua kom cov khoom siv evaporated, xws li hlau, hlau alloy, thiab lwm yam. ces tso rau ntawm qhov chaw substrate, txoj kev evaporation txheej txheem feem ntau siv cua sov tiv thaiv, thiab tom qab ntawd electron beam bombardment ntawm cov khoom txheej txheem, ua rau lawv evaporated rau hauv theem roj, ces tso rau ntawm qhov chaw substrate. Keeb kwm, vacuum vapor deposition yog cov thev naus laus zis siv ua ntej hauv PVD txoj kev.
2, Sputtering txheej
Cov roj raug rau qhov tso tawm ntawm lub teeb ci hauv qab (Ar)-filled vacuum conditions. Lub sijhawm no cov argon (Ar) atoms ion rau hauv nitrogen ions (Ar), Cov ions raug nrawm los ntawm lub zog ntawm lub zog hluav taws xob, thiab bombard lub cathode target uas yog ua los ntawm cov khoom siv txheej, lub hom phiaj yuav raug sputtered tawm thiab tso rau ntawm qhov chaw substrate. Incident ions hauv sputtering coating, feem ntau tau los ntawm kev tso tawm ntawm lub teeb ci, yog nyob rau hauv qhov ntau ntawm 10-2pa txog 10Pa, Yog li cov khoom tawg yooj yim sib tsoo nrog cov roj molecules hauv lub tshuab nqus tsev thaum ya mus rau lub substrate, ua rau kev taw qhia txav mus los random thiab cov zaj duab xis tso yooj yim kom sib xws.
3, Ion txheej
Nyob rau hauv lub tshuab nqus tsev, Nyob rau hauv lub tshuab nqus tsev, Siv ib qho plasma ionisation txheej txheem los ua ib feem ionise cov khoom siv txheej rau hauv ions. Tib lub sijhawm ntau lub zog siab tsis muaj zog atoms yog tsim, uas yog negatively biased rau ntawm lub substrate. Nyob rau hauv txoj kev no, ions yog tso rau ntawm lub substrate nto nyob rau hauv ib tug tob negative bias tsim ib tug nyias zaj duab xis.
Lub sijhawm tshaj tawm: Lub Peb Hlis-23-2023