Ion ukutyabekaumatshini yavela kwithiyori ecetywayo nguDM Mattox ngeminyaka yoo-1960, kunye novavanyo oluhambelanayo lwaqala ngelo xesha; Kuze kube yi-1971, i-Chambers kunye nabanye bapapasha iteknoloji ye-electron beam ion plating; I-teknoloji ye-reactive evaporation plating (ARE) yachazwa kwingxelo ye-Bunshah kwi-1972, xa iintlobo zefilimu ezinzima kakhulu ezifana ne-TiC kunye ne-TiN zaveliswa; Kwakhona ngo-1972, uSmith noMolley bamkela itekhnoloji yecathode engenanto kwinkqubo yokwaleka. Ngeminyaka yoo-1980, i-ion plating e-China yayide yafikelela kwinqanaba losetyenziso lwemizi-mveliso, kwaye iinkqubo zokugquma ezifana ne-vacuum multi-arc ion plating kunye ne-arc-discharge ion plating ziye zavela ngokulandelelanayo.
Yonke inkqubo yokusebenza ye-vacuum ion plating imi ngolu hlobo lulandelayo: okokuqala,impompoigumbi lokucoca, kwaye emva kokoyimaUxinzelelo lwevacuum ukuya ku-4X10 ⁻ ³ Paokanye ngcono, kuyimfuneko ukudibanisa amandla ombane aphezulu kunye nokwakha indawo yokushisa ephantsi yeplasma yegesi ephantsi yokukhutshwa kwegesi phakathi kwe-substrate kunye ne-evaporator. Qhagamshela i-electrode engaphantsi kunye ne-5000V DC yombane ophezulu ongalunganga ukwenza ukukhutshwa okukhanyayo kwe-cathode. Iiyoni zerhasi engasebenziyo ziveliswa kufutshane nendawo yokukhanya okubi. Bangena kwindawo emnyama ye-cathode kwaye bakhawuleziswa yintsimi yombane kwaye babhobhoze ubuso be-substrate. Le yinkqubo yokucoca, kwaye emva koko faka inkqubo yokwaleka. Ngempembelelo yokufudumeza ibhombu, ezinye izinto zokufaka umphunga ziye zibe ngumphunga. Indawo ye-plasma ingena kwiiprotoni, idibene nee-electron kunye ne-ioni yegesi ye-inert, kunye nenxalenye encinci yazo i-ionized, Ezi ionized ionized kunye namandla aphezulu ziya kubhobhoza umphezulu wefilimu kwaye ziphucule umgangatho wefilimu ukuya kwinqanaba elithile.
Umgaqo we-vacuum ion plating ngulo: kwigumbi lokufunxa, usebenzisa i-gas discharge phenomenon okanye i-ionized part of the vaporized material, phantsi kwebhombu yeeyoni zezinto ezinomphunga okanye ii-ion zegesi, ngaxeshanye zifake ezi zinto zibe ngumphunga okanye ii-reactants zazo kwi-substrate ukufumana ifilimu encinci. Ukwaleka ionumatshiniidibanisa i-vacuum evaporation, iteknoloji yeplasma kunye nokukhutshwa kokukhanya kwegesi, okungaphuculi nje kuphela umgangatho wefilimu, kodwa kwandise uluhlu lwesicelo sefilimu. Iingenelo zale nkqubo zi-diffraction enamandla, ukubambelela kakuhle kwefilimu, kunye nezixhobo ezahlukeneyo zokugquma. Umgaqo we-ion plating waqala wacetywa nguDM Mattox. Kukho iintlobo ezininzi ze-ion plating. Olona hlobo luqhelekileyo lufudumeza umphunga, kubandakanywa ukufudumeza ukuxhathisa, ukufudumeza kwe-electron beam, i-plasma electron beam heat, i-high-frequency induction heat kunye nezinye iindlela zokufudumeza.
Ixesha lokuposa: Feb-14-2023