Sezvo machipisi nemidziyo yemagetsi zvichiramba zvichichinja kuita kuti zvinhu zvidiki zvisanganisike uye zvisanganisike zvakanyanya, kugadzirwa kwedunhu chete pamusoro pezvinhu zveceramic hakuchakwanisi kusangana nezvinodiwa zvekubatanidza nekufambisa zvinhu. Saka maMicrovia anodiwa kubatanidza mativi ekumberi nekumashure echikamu nemagetsi, kupfupisa nzira dzekubatanidza zvinhu uye kuwedzera huwandu hwezvinhu. Nekuda kweizvozvo, DPC (Direct Plated Copper) kuburikidza netekinoroji yesimbi yakashandiswa zvakanyanya mukushandiswa kunosanganisira maLED, lasers, optical communications, RF devices, uye power electronics.
Zvisinei, zvinhu zveceramic zvinodzivirira ngura nemagetsi. Kungogadzira zvinhu zve microvia kuburikidza ne substrate hakuiti kuti magetsi arambe aripo pakati pemativi maviri. Dambudziko guru nderekugadzira simbi inotenderera uye yakavimbika pamadziro emukati me microvia.
1. Kuenderera mberi kweMagetsi Kunosimbiswa Sei Kuburikidza neCeramic Microvias?
DPC kuburikidza nesimbi inowanzo tanga nekuboorera nelaser kuti igadzire ma microvias mu ceramic substrate, kazhinji muchimiro chemaburi akatetepa kana akatwasuka. Microvias ne substrate pamusoro zvinozocheneswa zvakanaka uye zvinobviswa utsi kuti zvibvise zvasara zvekuboorera, hunyoro, nezvimwe zvinosvibisa. Maitiro ekuputira vacuum anoshandiswa kuisa Ti adhesion layer, inowanzova 50–200 nm ukobvu, ichiteverwa neCu conductive seed layer, inowanzova 0.5–2 μm ukobvu, pamusoro pe substrate uye pamadziro emukati me microvias.
Chigadziko cheTi chinoshanda sechikamu chekunamatira kuti chiwedzere simba rekubatanidza pakati pefirimu resimbi nesimbi yeceramic, nepo chikamu chembeu yeCu chichipa hwaro hwekufambisa hunogara huripo hwekushandisa magetsi anotevera. Chigadziko chemhangura chinobva chawedzerwa nekushandisa magetsi, kazhinji kusvika paukobvu hwe5–20 μm, zvichizogadzira kuenderera mberi kwemagetsi pakati pemasekete ari kumberi nekumashure kuburikidza nemavias esimbi. Muchidimbu, kuputira vacuum kunopa hwaro hwekufambisa, nepo chikamu chemagetsi chinotevera chichivaka ukobvu hwemhangura, nokudaro zvichideredza kuburikidza nekuramba uye kuvandudza kuvimbika kwekubatanidza.
Kunyange hazvo maitiro acho achiita seari nyore, kuvimbika kuburikidza nekubatanidza kunoenderana nechimwe chinhu chakakosha: Ti/Cu seed layer inofanira kufukidza zvizere uye nguva dzose pamusoro pe substrate uye rusvingo rwese rwemukati rwe microvia yega yega.
2. Matambudziko Mana Akakosha Ekushandisa Vacuum Sputtering Ti/Cu Seed Layers yeDPC Vias
Kugadzira jira rembeu rinogara riripo mukati mema microvia madiki hakusi nyore. Zvasara zviri mukati mema vias zvinogona kukanganisa kunamira kwefirimu, nepo ma microvia geometry zvichiita kuti kufukidzwa kwemativi emadziro kuve kwakaoma. Kusaenderera mberi kwenzvimbo mujira rembeu kunogona kukanganisa electroplating inotevera, nepo kusiyana pakati penzvimbo dzakasiyana dze substrate nemabheti ekugadzira kunogona kukanganisa kugadzikana kwese kwese kwemaitiro. Matambudziko makuru e vacuum sputtering yeDPC kuburikidza ne metallization anogona kupfupikiswa munzvimbo ina.
1. Zvisaririra Zviri Mukati Memavhisi Zvinogona Kukanganisa Kunamira Kwemafirimu
Mushure mekucherwa nelaser, ceramic substrates dzinogona kunge dziine ceramic particles, zvinhu zvakagadziriswazve, marara ekucherwa, uye hunyoro hwakanyungudutswa mukati me microvias. Kune microvias dzine dhayamita diki uye high aspect ratios, masara aya anowanzo kuve akaoma kubvisa kupfuura kusvibiswa kwepamusoro. Kana kuchenesa nekubvisa gasi zvisina kukwana, Ti adhesion layer inogona kusaumba chisungo chakasimba uye chakavimbika ne ceramic sidewall. Zvikanganiso zvakadaro zvingasaonekwa pakarepo mushure mekuputirwa, asi zvinogona kukura zvishoma nezvishoma kuita blister uye delamination panguva inotevera electroplating, soldering, kana high-temperature operation.
2. Zviyero Zvakakwirira Zvinoita Kuti Kufukidza Mativi Kuome
Kuoma kwekusvetukira kwe microvia hakugone kuongororwa nekudzika kwayo chete; chiyero chiri pakati pekudzika nedhayamita—chiyero cheaspect—chakakosha zvakaenzana. Semuenzaniso, via ine dhayamita ye60 μm uye kudzika kwe300 μm ine chiyero cheaspect che5:1. Sezvo chiyero cheaspect chichiwedzera, via entrance inogadzira mumvuri wakakura wezvikamu zvakasvetukira, zvichideredza huwandu hwezvikamu zvinogona kusvika pakati pechikamu chedivi. Izvi zvinogona kukonzera mafirimu akakora pamusoro pe substrate uye pedyo nekuvhurwa kwe via, nepo chikamu chepakati chedivi re via chichitetepa zvakanyanya kana kutorega.
3. Mbeu Isina Kukwana Inogona Kudzivirira Kuvimbika Nekubatana
Chinodiwa chikuru cheDPC kuburikidza nesimbi hachisi chekuti mhangura iripo pamadziro esimbi, asi kuti jira rembeu reTi/Cu rinogona kuramba richienderera mberi kubva kumberi kwesubstrate, richitevedza divi rese, kusvika kudivi rekumashure. Kunyangwe kusagadzikana kudiki mujira rembeu kunogona kukanganisa nzira yekufambisa inodiwa pakushandisa magetsi. Saka, mhando yejira rembeu haigone kuongororwa chete nekuonekwa kwepamusoro kana ukobvu hwefirimu. Kunyanya kutarisisa kunofanirwa kupihwa kuchikamu chakatetepa chedivi resimbi uye kana kufambisa magetsi kunoenderera mberi kuchichengetwa munzira yese yesimbi.
4. Kupasa Muenzaniso Mumwe Chete Hazvivimbise Kugadzikana KweBatch-to-Batch
Kuwana ukobvu hwepamusoro hwefirimu pamuenzaniso mumwe chete hazvirevi hazvo kuti maitiro acho agadzirira kugadzirwa kwehuwandu. Kugadzirwa kweDPC kunodawo kudzora kwakasimba kwekufanana kwekuvhara pakati penzvimbo dzepamberi nedzekumashure, pakati penzvimbo dzepakati nedzemucheto dzesubstrate, munzvimbo dzakasiyana dzekugadzirisa, uye kubva pabatch kuenda kune batch. Kune substrates dzeceramic dzine huwandu hwakawanda hwe microvias, kuongororwa kwemaitiro hakufanirwe kungotarisa paavhareji yeukobvu hwefirimu chete. Chinonyanya kukosha ndechekuti, nzvimbo yakatetepa ye via sidewall inofanira kugara ichichengetedza kufambisa kwemagetsi kunodiwa pa electroplating inotevera.
3. Chii Chinoitika Kana Mbeu Isina Kuiswa Zvakanaka?
Rutivi rwembeu rweTi/Cu runopa hwaro hwekufambisa hunodiwa pakuiswa kwemagetsi mushure mezvo. Kana rutivi rwembeu ruri padivi pemugwagwa rwakatetepa, rusina kuvharwa zvakakwana, kana kuti rusina kuvharwa, simba remagetsi harigone kufambiswa nguva dzose parutivi pemugwagwa, uye maion emhangura haagone kuderedzwa zvakanaka uye kuiswa panzvimbo dzisina kunaka. Sezvo kuiswa kwemagetsi kuchiwedzera uye rutivi rwemhangura ruchiungana, pakutanga nzvimbo diki dzisina kuvharwa zvakakwana dzinogona kukura kuita maburi emhangura, kushomeka kweukobvu, kana kuvharwa kwemagetsi mukati memugwagwa.
Zvikanganiso izvi zvinokanganisa zvakananga kunaka kwekubatana kwemasekete ari kumberi nekumashure kwepasi pevhu receramic. Muzviitiko zvisina kuoma, zvinogona kukonzera kuwedzera kwesimba remagetsi, kugadzirwa kwekupisa munzvimbo, uye kushanduka-shanduka kwekushanda kwemagetsi. Muzviitiko zvakakomba, masekete ari kumativi maviri anogona kutadza kuwana kuenderera mberi kwemagetsi. Munguva yekusungirirwa kwemagetsi kunotevera, kukwegura kwekupisa kwakanyanya, kana kushanduka kwekupisa, nzvimbo dzisina kunaka dzinogona kuwedzera kusviba, kucheka, kana kutsemuka kwesekete, zvichideredza goho rezvigadzirwa uye kuvimbika kwenguva refu uye zvinogona kukonzera kutadza kwemuchina.
4. Mhinduro yeZhenhua Vacuum yeKugadzira Zvinhu Zvikuru zveCeramic Substrate Via Metallization — DPC Ceramic Substrate Vacuum Coating Production Line
Zvakanakira Midziyo:
Kuzvigadzira otomatiki: Sisitimu yekuisa machira otomatiki uye yekufambisa zvinhu inoderedza kupindira nemaoko uku ichivandudza kushanda zvakanaka kwekugadzira uye ichipfupisa nguva yekutenderera kwese.
Kuburikidza: Inotsigira substrates dze 120 mm × 120 mm dzine simba rekugadzira rinosvika 288 pcs paawa.
Kushanda: Kunovandudza kufambiswa kwemagetsi ukuwo kuchivandudza kushanda kwekuparadza kupisa kwesimbi yeceramic.
Kuburikidza neMetallization: Kugadziriswa kwemagineti kwakagadziridzwa kunoita kuti kufukidza kwakafanana uye kwakanaka mukati mema microvias kushande zvakanaka.
Maitiro: Inotsigira kuputira mativi maviri kuti ivandudze kufanana kweukobvu hwefirimu uye kuenderana kwekuputira.
Mashandisirwo:
Midziyo iyi inogona kuisa mafirimu akasiyana-siyana esimbi, anosanganisira Ti, Cu, Al, Sn, Cr, Ag, naNi, uye yakashandiswa zvakanyanya mumaindasitiri e semiconductor ne electronic component kumashandisirwo akadai se ceramic substrates, ceramic capacitors, uye LED ceramic package/supports.
5. Mhedziso
Zhenhua Vacuum inotarisa pakugadzira DPC. Nekuvandudza kufukidza mativi e microvia uye kusanganisa tekinoroji yekuvhara mativi maviri nekugadzira otomatiki, mhinduro iyi inopa mbeu dzeTi/Cu dzakagadzikana dzekubatanidza electroplating uye dzakavimbika kuburikidza nekubatanidza. Izvi zvinobatsira vatengi kuti vagadzire huwandu hwakawanda nguva dzose vachitsigira kushandiswa kwakakura kweDPC ceramic substrates muma semiconductor nema elekthronikhi epamusoro.
-Chinyorwa ichi chakabudiswa na mugadziri wemidziyo yekuputira vacuumZhenhua Vacuum
Nguva yekutumira: Nyamavhuvhu-27-2026