Pamene ma chips ndi zipangizo zamagetsi zikupitilira kusintha kukhala zazing'ono komanso kuphatikiza kwakukulu, kupanga ma circuit okha pamwamba pa ma ceramic substrates sikungathenso kukwaniritsa zofunikira zolumikizirana ndi routing. Chifukwa chake, ma microvia amafunika kulumikiza mbali zakutsogolo ndi zakumbuyo za substrate ndi magetsi, kufupikitsa njira zolumikizirana ndikuwonjezera kuchuluka kwa ma circuit. Zotsatira zake, DPC (Direct Plated Copper) kudzera muukadaulo wa metallization yagwiritsidwa ntchito kwambiri m'magwiritsidwe ntchito kuphatikiza ma LED, ma laser, kulumikizana kwa optical, zida za RF, ndi zamagetsi zamagetsi.
Komabe, zinthu zopangidwa ndi ceramic zimateteza magetsi mwachibadwa. Kungopanga ma microvia kudzera mu substrate sikupangitsa kuti magetsi aziyenda bwino pakati pa mbali ziwirizi. Vuto lenileni ndikupanga gawo losalekeza komanso lodalirika la mbewu zachitsulo m'makoma amkati mwa ma microvia.
1. Kodi Kupitiriza kwa Magetsi Kumakhazikitsidwa Bwanji Kudzera mu Ma Microvia a Ceramic?
DPC kudzera mu metallization nthawi zambiri imayamba ndi kuboola pogwiritsa ntchito laser kuti ipange ma microvias mu ceramic substrate, nthawi zambiri mu mawonekedwe a mabowo opindika kapena owongoka. Kenako ma microvias ndi pamwamba pa substrate amatsukidwa bwino ndikuchotsedwa mpweya kuti achotse zotsalira za kuboola, chinyezi, ndi zina zodetsa. Njira yothira vacuum imagwiritsidwa ntchito pambuyo pake kuyika gawo lomatira la Ti, lomwe nthawi zambiri limakhala la makulidwe a 50–200 nm, kutsatiridwa ndi gawo la Cu conductive seed, lomwe nthawi zambiri limakhala la makulidwe a 0.5–2 μm, pamwamba pa substrate komanso m'makoma amkati a microvias.
Gawo la Ti limagwira ntchito ngati gawo lolumikizirana kuti liwongolere mphamvu yolumikizirana pakati pa filimu yachitsulo ndi gawo la ceramic, pomwe gawo la mbewu ya Cu limapereka maziko oyendetsera magetsi opitilira patsogolo. Gawo la mkuwa limapangidwanso ndi electroplating, nthawi zambiri mpaka makulidwe a 5-20 μm, zomwe zimapangitsa kuti magetsi aziyenda bwino pakati pa ma circuits kutsogolo ndi kumbuyo kudzera mu ma vias achitsulo. Mwachidule, vacuum sputtering imapereka maziko oyendetsera magetsi, pomwe electroplating yotsatira imamanga makulidwe a mkuwa, motero imachepetsa kukana ndikuwonjezera kudalirika kwa kulumikizana.
Ngakhale kuti njirayi ikuwoneka yosavuta, kulumikizana kodalirika kumadalira chinthu chimodzi chofunikira kwambiri: gawo la mbewu ya Ti/Cu liyenera kuphimba pamwamba pa nthaka yonse ndi khoma lonse lamkati la microvia iliyonse.
2. Mavuto Anayi Ofunika Kwambiri a Vacuum Sputtering Ti/Cu Seed Layers for DPC Vias
Kupanga gawo losalekeza la mbewu mkati mwa ma microvias opapatiza sikophweka. Zotsalira zomwe zimatsala mkati mwa ma vias zimatha kusokoneza kumatirira kwa filimu, pomwe mawonekedwe a microvia amapangitsa kuti kuphimba kwa mbali kukhale kovuta kwambiri. Kusakhazikika kwa malo mu gawo la mbewu kumatha kusokoneza kuyika kwa electroplating pambuyo pake, pomwe kusiyana pakati pa malo osiyanasiyana a substrate ndi magulu opanga kungakhudze kukhazikika kwa njira yonse. Mavuto akuluakulu a vacuum sputtering ya DPC kudzera mu metallization akhoza kufotokozedwa m'magawo anayi.
1. Zotsalira Zomwe Zili M'kati mwa Ma Vias Zingathe Kusokoneza Kumatira kwa Filimu
Pambuyo pobowola pogwiritsa ntchito laser, zinthu zadothi zimatha kukhala ndi tinthu tadothi, zinthu zokonzedwanso, zinyalala zobowola, ndi chinyezi chobisika mkati mwa ma microvia. Kwa ma microvia okhala ndi mainchesi ang'onoang'ono komanso ma aspect ratios apamwamba, zotsalira izi nthawi zambiri zimakhala zovuta kwambiri kuchotsa kuposa kuipitsidwa pamwamba. Ngati kuyeretsa ndi kuchotsa mpweya sikukwanira, gawo lomatira la Ti silingapange mgwirizano wolimba komanso wodalirika ndi khoma ladothi ladothi. Zolakwika zotere sizingawonekere nthawi yomweyo mutapaka utoto, koma pang'onopang'ono zimatha kukhala matuza ndi disamination panthawi yogwiritsa ntchito ma electroplating, soldering, kapena kutentha kwambiri.
2. Kuchuluka kwa Mawonekedwe Abwino Kumapangitsa Kuti Kuphimba M'mbali Kukhale Kovuta Kwambiri
Kuvuta kwa kupopera kwa microvia sikungayesedwe kokha ndi kuya kwake; chiŵerengero pakati pa kuya ndi dayamita—chiŵerengero cha mbali—ndi chofunikira kwambiri. Mwachitsanzo, dayamita yokhala ndi dayamita ya 60 μm ndi kuya kwa 300 μm ili ndi chiŵerengero cha mbali cha 5:1. Pamene chiŵerengero cha mbali chikuwonjezeka, khomo lolowera kudzera limapanga mthunzi waukulu wa tinthu topopera, kuchepetsa chiwerengero cha tinthu tomwe tingafike pakati pa khoma la m'mbali. Izi zingayambitse mafilimu okhuthala pamwamba pa substrate ndi pafupi ndi kutsegula kwa dayamita, pomwe gawo lapakati la khoma la m'mbali la m'mbali limakhala lochepa kwambiri kapena losapitirira.
3. Mbeu Yosakwanira Ingalepheretse Kulumikizana Kodalirika
Chofunika kwambiri cha DPC kudzera mu metallization si kungoyang'ana ngati mkuwa uli pakhoma la via, koma ngati gawo la mbewu ya Ti/Cu lingathe kufalikira mosalekeza kuchokera kutsogolo kwa substrate, kudutsa mbali yonse ya khoma, mpaka kumbuyo. Ngakhale kusagwirizana pang'ono mu gawo la mbewu kungasokoneze njira yoyendetsera yomwe ikufunika kuti magetsi azitha kuyikidwa pambuyo pake. Chifukwa chake, ubwino wa gawo la mbewu sungayesedwe kokha ndi mawonekedwe a pamwamba kapena makulidwe apakati a filimu. Chisamaliro chapadera chiyenera kuperekedwa ku gawo lopyapyala kwambiri la khoma la via komanso ngati magetsi opitilira amasungidwa munjira yonse yachitsulo.
4. Kupereka Chitsanzo Chimodzi Sichitsimikizira Kukhazikika kwa Batch-to-Batch
Kukwaniritsa makulidwe ofunikira a filimu ya pamwamba pa chitsanzo chimodzi sikutanthauza kuti njirayi yakonzeka kupanga zinthu zambiri. Kupanga DPC kumafunanso kuwongolera bwino kufanana kwa utoto pakati pa malo akutsogolo ndi akumbuyo, pakati pa madera apakati ndi m'mphepete mwa substrate, m'malo osiyanasiyana ogwirira ntchito, komanso kuchokera ku gulu kupita ku gulu. Pazinthu zadothi zokhala ndi ma microvia ambiri, kuwunika kwa njira sikuyenera kungoyang'ana pa makulidwe apakati a filimu. Chofunika kwambiri, dera lopyapyala kwambiri la m'mbali mwa msewu liyenera kusunga nthawi zonse magetsi ofunikira kuti magetsi azitha kupangidwa pambuyo pake.
3. Kodi chimachitika n’chiyani ngati gawo la mbewu silinaikidwe bwino?
Gawo la mbewu la Ti/Cu limapereka maziko oyendetsera magetsi ofunikira pakupangira magetsi pambuyo pake. Ngati gawo la mbewu lomwe lili pa khoma la m'mbali mwa msewu ndi lochepa kwambiri, losaphimbidwa mokwanira, kapena lili ndi ma discontinuities, mphamvu yamagetsi singathe kusamutsidwa mosalekeza m'mbali mwa msewu, ndipo ma ions amkuwa sangachepe bwino ndikuyikidwa pamalo olakwika. Pamene magetsi amagetsi akupitirira ndipo gawo la mkuwa likuwonjezeka, poyamba madera ang'onoang'ono osakwanira amatha kukhala ma voids a mkuwa, kusowa kwa makulidwe komweko, kapena ma discontinuous plating mkati mwa msewu.
Zolakwika zimenezi zimakhudza mwachindunji ubwino wa ma circuits omwe ali kutsogolo ndi kumbuyo kwa ceramic substrate. Muzochitika zosaopsa kwambiri, zimatha kubweretsa kuwonjezeka kudzera mu kukana, kutentha komwe kumachitika m'deralo, komanso kusinthasintha kwa magwiridwe antchito amagetsi. Muzochitika zoopsa kwambiri, ma circuits omwe ali mbali ziwirizi angalephere kukwaniritsa kupitilira kwa magetsi. Pakatha kusungunuka, kutentha kwambiri, kapena kutentha kwambiri, malo olakwika amatha kukhala ndi matuza, disamination, kapena ming'alu ya ma circuits, kuchepetsa kukolola kwa zinthu ndi kudalirika kwa nthawi yayitali ndipo zitha kuchititsa kuti chipangizocho chilephereke.
4. Yankho Lopanga Zhenhua Vacuum la Ceramic Substrate Via Metallization — DPC Ceramic Substrate Vacuum Coating Production Line
Ubwino wa Zipangizo:
Makina Odzichitira Okha: Makina odzaza okha komanso onyamula zinthu zogwirira ntchito amachepetsa kugwiritsa ntchito zinthu ndi manja pomwe akukweza magwiridwe antchito komanso kuchepetsa nthawi yonse yogwirira ntchito.
Kugwira Ntchito: Kumathandizira ma substrates a 120 mm × 120 mm okhala ndi mphamvu yopangira mpaka ma PC 288 pa ola limodzi.
Magwiridwe antchito: Amawongolera kuyendetsa magetsi pamene akuwonjezera mphamvu yotaya kutentha kwa ceramic substrate.
Kudzera mu Metallization: Kapangidwe kabwino ka maginito kamapangitsa kuti kuphimba bwino komanso kofanana mkati mwa ma microvias kukhale koyenera komanso kofanana.
Njira: Imathandizira kupaka utoto mbali zonse ziwiri kuti ipangitse kuti makulidwe onse a filimu akhale ofanana komanso kuti ikhale yolimba.
Mapulogalamu:
Zipangizozi zimatha kuyika mafilimu osiyanasiyana achitsulo, kuphatikizapo Ti, Cu, Al, Sn, Cr, Ag, ndi Ni, ndipo zakhala zikugwiritsidwa ntchito kwambiri m'mafakitale a semiconductor ndi electronic component pazinthu monga ceramic substrates, ceramic capacitors, ndi LED ceramic package/supports.
5. Mapeto
Zhenhua Vacuum imayang'ana kwambiri njira yotulutsira mpweya wa vacuum kutsogolo kwa DPC. Mwa kukulitsa kuphimba kwa mbali za microvia ndikuphatikiza ukadaulo wokutira mbali ziwiri ndi kupanga zokha, yankho limapereka zigawo zokhazikika za mbewu za Ti/Cu kuti zigwiritsidwe ntchito ndi ma electroplating pambuyo pake komanso zodalirika kudzera mu kulumikizana. Izi zimathandiza makasitomala kupanga zinthu zambiri nthawi zonse pomwe akuthandizira kugwiritsa ntchito kwambiri ma DPC ceramic substrates mu semiconductor ndi mapulogalamu apamwamba amagetsi.
-Nkhaniyi yasindikizidwa ndi wopanga zida zophikira vacuumZhenhua Vacuum
Nthawi yotumizira: Ogasiti-27-2026