Kubera ko uduce duto n'ibikoresho by'ikoranabuhanga bikomeje gutera imbere mu buryo buciriritse no gushyira hamwe neza, gukora imiyoboro gusa ku buso bw'ibice bya ceramic ntibishobora kongera guhaza ibisabwa byo guhuza no gukoresha inzira. Bityo, imiyoboro mito irasabwa guhuza impande z'imbere n'inyuma z'ibice, bigagabanya inzira zo guhuza no kongera ubucucike bw'imiyoboro. Kubera iyo mpamvu, DPC (Direct Plated Copper) binyuze mu ikoranabuhanga rya metallization yakoreshejwe cyane mu bikorwa birimo LED, laser, itumanaho rya optique, ibikoresho bya RF, n'ibikoresho by'ikoranabuhanga bikoresha ingufu.
Ariko, substrates za ceramic zirinda ubushyuhe mu buryo bw'amashanyarazi. Gukora microvias binyuze muri substrate ntabwo bitanga amashanyarazi ahoraho hagati y'impande zombi. Ikibazo nyacyo ni ugukora urwego rw'imbuto z'icyuma ruhoraho kandi rwizewe ku nkuta z'imbere za microvias.
1. Ni gute amashanyarazi ahoraho ashyirwaho binyuze muri microvia za Ceramic?
DPC binyuze mu gucukura ibyuma akenshi bitangirana no gucukura hakoreshejwe laser kugira ngo habeho microvias mu gice cya ceramic, muri rusange mu buryo bw'imyobo ipfundikiye cyangwa igororotse. Hanyuma microvias n'ubuso bwa substrate bisukurwa neza kandi bigakurwamo imyuka kugira ngo hakureho ibisigazwa byo gucukura, ubushuhe, n'ibindi bihumanya. Nyuma yaho, inzira yo gucukura ikoreshwa mu gushyiramo urwego rwa Ti adhesion, ubusanzwe rufite ubugari bwa nanometero 50–200, hagakurikiraho urwego rwa Cu conductive seed, ubusanzwe rufite ubugari bwa 0.5–2 μm, ku buso bwa substrate no ku nkuta z'imbere za microvias.
Urupapuro rwa Ti rukora nk'urwego rwo gufatana kugira ngo rwongere imbaraga zo gufatana hagati y'icyuma n'ubutaka bwa ceramic, mu gihe urupapuro rw'imbuto za Cu rutanga urufatiro ruhoraho rwo gufatana mu buryo bukurikira. Urupapuro rw'umuringa rukomeza kubakwa hakoreshejwe electroplating, akenshi kugeza ku bugari bwa 5–20 μm, amaherezo bigashyiraho uburyo bwizewe bwo kugumana amashanyarazi hagati y'imiyoboro y'amashanyarazi ku mpande z'imbere n'inyuma binyuze mu byuma byakozwe mu cyuma. Mu magambo make, gukoresha amashanyarazi mu buryo bw'umwuka bitanga urufatiro rwo gufatana mu cyuma, mu gihe gukoresha electroplating mu buryo bukurikiraho byongera ubunini bw'umuringa, bityo bigabanura uburyo bwo guhangana no kongera ubwizigame bw'imiyoboro y'amashanyarazi.
Nubwo inzira isa n'iyoroshye, kwizerwa binyuze mu guhuza biterwa n'ikintu kimwe cy'ingenzi: urwego rw'imbuto za Ti/Cu rugomba gutwikira neza kandi buri gihe ubuso bw'ubutaka n'urukuta rwose rw'imbere rwa buri microvia.
2. Imbogamizi enye z'ingenzi zo gukoresha icyuma gitera amazi cya Ti/Cu mu gusukura imirasire y'izuba kuri DPC Vias
Gukora urwego rw'imbuto ruhoraho muri microvia nto ntabwo byoroshye na gato. Ibisigazwa bisigaye muri microvia bishobora kwangiza uburyo firime ifatana, mu gihe imiterere ya microvia ituma uruziga rw'impande zirushaho kugorana. Kutagira aho bihurira mu rundi rwego rw'imbuto bishobora guhagarika amashanyarazi akurikiraho, mu gihe itandukaniro riri hagati y'ahantu hatandukanye h'ubutaka n'ibyiciro by'umusaruro rishobora kugira ingaruka ku buryo buhoraho muri rusange. Imbogamizi z'ingenzi zo gukoresha vacuum sputtering kuri DPC binyuze mu gukora metallization zishobora kuvugwa mu bice bine.
1. Ibisigazwa biri muri Vias bishobora kwangiza uburyo firime ifatanwa
Nyuma yo gucukura hakoreshejwe laser, ibintu bya ceramic bishobora kuba birimo uduce twa ceramic, ibikoresho byongeye guhindurwa, imyanda yo gucukura, n'ubushuhe burimo amazi muri microvia. Ku microvia zifite uburebure buto n'ibipimo byinshi, ibi bisigazwa akenshi biragoye kubikuraho kuruta kwanduza ubuso. Niba gusukura no gukuramo imyuka bidahagije, urwego rwa Ti adhesion rushobora kutagira isano ikomeye kandi yizewe n'urukuta rwa ceramic. Inenge nk'izo zishobora kudahita zigaragara nyuma yo gusiga, ariko zishobora kugenda zihinduka udusebe no gutandukana mu gihe cyo gucukura electroplating, soldering, cyangwa gukora ubushyuhe bwinshi.
2. Ibipimo by'ubuso bwinshi bituma uburyo bwo gupima impande burushaho kugorana
Uburemere bw'imikorobe ntibushobora gupimwa gusa n'ubujyakuzimu bwayo; igipimo kiri hagati y'ubujyakuzimu n'ubujyakuzimu—igipimo cy'ubujyakuzimu—ni ingenzi cyane. Urugero, umuyoboro ufite umurambararo wa 60 μm n'ubujyakuzimu bwa 300 μm ufite igipimo cy'ubujyakuzimu cya 5:1. Uko igipimo cy'ubujyakuzimu kigenda cyiyongera, umuyoboro w'ubujyakuzimu utuma uduce duto duto duto duhinduka cyane, bigabanya umubare w'uduce dushobora kugera mu gice cyo hagati cy'urukuta. Ibi bishobora gutuma habaho uduce twinshi ku buso bw'urukuta no hafi y'umwobo w'ubujyakuzimu, mu gihe igice cyo hagati cy'urukuta rw'ubujyakuzimu gihinduka gito cyane cyangwa kidakomeza.
3. Urupapuro rw'imbuto rutuzuye rushobora gukumira imikoranire y'abantu neza binyuze mu guhuza
Igisabwa cy'ibanze cya DPC binyuze mu gukora metallization si ukumenya niba umuringa uri ku rukuta rwa via gusa, ahubwo ni ukumenya niba urwego rw'imbuto za Ti/Cu rushobora kwaguka ubudasiba kuva ku ruhande rw'imbere rw'ubutaka, ku ruhande rwose binyuze mu mpande, kugera ku ruhande rw'inyuma. Ndetse no kutagira aho bihurira gato mu urwego rw'imbuto bishobora guhagarika inzira ikoreshwa mu gukora amashanyarazi isabwa kugira ngo habeho electroplating. Kubwibyo, ubwiza bw'urwego rw'imbuto ntibushobora gupimwa gusa hakurikijwe uko ubuso bumeze cyangwa ubunini bw'icyuma. Hagomba kwitabwaho cyane igice gito cyane cy'urukuta rwa via no kumenya niba amashanyarazi ahoraho agumana amashanyarazi mu nzira ya icyuma.
4. Gutanga icyitegererezo kimwe ntabwo bitanga icyizere cy'uko ibintu bizahora bihagaze neza
Kugera ku bugari bwa firime y'ubuso bukenewe ku rugero rumwe ntibisobanura ko inzira iba yiteguye gukorwa ku bwinshi. Ikorwa rya DPC risaba kandi kugenzura neza uburinganire bw'ibirahure hagati y'ubuso bw'imbere n'inyuma, hagati y'uturere two hagati n'inkombe z'ubutaka, mu myanya itandukanye yo gufatisha, no kuva ku itsinda rimwe kugeza ku rindi. Ku bikoresho bya ceramic birimo umubare munini wa microvias, isuzuma ry'imikorere ntirigomba kwibanda gusa ku bugari bwa firime. Icy'ingenzi kurushaho, agace gato cyane k'urukuta rw'impande kagomba guhora gafite amashanyarazi akenewe kugira ngo habeho amashanyarazi akurikiraho.
3. Ni iki kibaho iyo urwego rw'imbuto rudashyizwe neza?
Urupapuro rw'imbuto rwa Ti/Cu rutanga urufatiro rukenewe mu gukwirakwiza amashanyarazi nyuma. Niba urupapuro rw'imbuto ruri ku ruhande rw'uruziga ari ruto cyane, rudapfundikiye neza, cyangwa rufite aho ruhagarara, umuriro w'amashanyarazi ntushobora kwimurirwa mu ruziga ku rundi ruhande, kandi iyoni z'umuringa ntizishobora kugabanuka neza no gushyirwa ahantu hadafite inenge. Uko gukwirakwiza amashanyarazi bigenda kandi urwego rw'umuringa rukiyongera, mu ntangiriro uduce duto tudahagije dushobora guhinduka icyuho cy'urupapuro rw'umuringa, ubucucike butari mu gace runaka, cyangwa gukwirakwiza amashanyarazi mu ruziga.
Izi nenge zigira ingaruka zitaziguye ku mikorere y’insinga ku mpande z’imbere n’inyuma z’insinga ya ceramic. Mu bihe bidakomeye cyane, zishobora kwiyongera binyuze mu kudashobora guhagarara, gutanga ubushyuhe mu gace runaka, no guhinduka k’imikorere y’amashanyarazi. Mu bihe bikomeye cyane, insinga ku mpande zombi zishobora kunanirwa kugera ku mikorere y’amashanyarazi. Mu gihe cyo gusoda nyuma yaho, gusaza kw’ubushyuhe bwinshi, cyangwa guhindagurika k’ubushyuhe, ahantu hafite inenge hashobora kongera kugaragara ibibyimba, gutandukana kw’insinga, cyangwa gucika kw’insinga, bigagabanya umusaruro w’ibicuruzwa no kwizerwa igihe kirekire, kandi bishobora no gutuma igikoresho kinanirwa.
4. Umuti wo gukora imashini ya Zhenhua Vacuum mu buryo bwinshi bwo gukora imashini ya Ceramic Substrate binyuze mu gukora imashini ya Metallization — DPC Ceramic Substrate Vacuum Coating Line
Ibyiza by'Ibikoresho:
Kwikora: Sisitemu y’ubwikorezi ikoresha ikoranabuhanga ryikora kandi itwara ibikoresho igabanya uburyo bwo gukora n’intoki, mu gihe yongera umusaruro kandi ikagabanya igihe cy’imikorere muri rusange.
Umusaruro: Ishyigikira substrates za mm 120 × 120 mm zifite ubushobozi bwo gukora kugeza ku bice 288 ku isaha.
Imikorere: Yongera ubushobozi bwo gutwara amashanyarazi mu buryo butuma ubushyuhe bugabanuka mu buryo butuma ibintu bicukurwa mu bumba.
Binyuze mu gushushanya: Imiterere myiza ya rukuruzi ituma habaho uburyo bwo gutwikira neza kandi bungana muri mikorobe.
Uburyo: Ishyigikira irangi ry’impande ebyiri kugira ngo inoze ubugari bwa filime muri rusange no kugira imiterere ihamye.
Porogaramu:
Ibikoresho bishobora gushyiramo filime zitandukanye z’icyuma, harimo Ti, Cu, Al, Sn, Cr, Ag, na Ni, kandi byakoreshejwe cyane mu nganda zikora ibikoresho bya semiconductor na elegitoroniki mu bikorwa nka substrates za ceramic, capacitors za ceramic, na paki/supports za ceramic za LED.
5. Umwanzuro
Zhenhua Vacuum yibanda ku buryo bwo gukwirakwiza ibyuma bivamo umwuka imbere mu nganda za DPC. Mu kongera uburyo bwo gutwikira imiyoboro ya microvia no guhuza ikoranabuhanga ryo gusiga irangi ku mpande ebyiri n'umusaruro wikora, igisubizo gitanga imbuto za Ti/Cu zihamye zo gusiga amashanyarazi nyuma yaho kandi zikizewe binyuze mu guhuza. Ibi bifasha abakiriya kugera ku musaruro uhoraho mu buryo bufatika, binashyigikira ikoreshwa rya DPC mu bikoresho bya semiconductor na electronic zigezweho.
-Iyi nkuru yasohotse na uruganda rukora ibikoresho byo gusiga irangi ry'umwukaZhenhua Vacuum
Igihe cyo kohereza: Kanama-27-2026