Raws li cov chips thiab cov khoom siv hluav taws xob txuas ntxiv mus rau qhov miniaturization thiab kev koom ua ke siab dua, kev tsim hluav taws xob tsuas yog nyob rau ntawm qhov chaw ntawm cov khoom siv ceramic tsis tuaj yeem ua tau raws li qhov xav tau ntawm kev sib txuas thiab kev xa xov. Yog li ntawd, Microvias yuav tsum tau txuas hluav taws xob rau sab pem hauv ntej thiab sab nraub qaum ntawm lub substrate, ua kom luv txoj kev sib txuas thiab ua rau lub voj voog ceev. Yog li ntawd, DPC (Direct Plated Copper) ntawm kev siv tshuab metallization tau siv dav hauv cov ntawv thov suav nrog LEDs, lasers, kev sib txuas lus optical, RF devices, thiab hluav taws xob hluav taws xob.
Txawm li cas los xij, cov khoom siv ceramic yog cov khoom siv hluav taws xob rwb thaiv tsev. Tsuas yog tsim cov microvias los ntawm cov khoom siv tsis tsim kom muaj kev sib txuas hluav taws xob ntawm ob sab. Qhov kev sib tw tiag tiag yog tsim kom muaj cov txheej txheem hlau txuas ntxiv thiab txhim khu kev qha raws phab ntsa sab hauv ntawm cov microvias.
1. Kev Txuas Ntxiv Hluav Taws Xob Tau Tsim Los Ntawm Ceramic Microvias Li Cas?
DPC ntawm metallization feem ntau pib nrog laser drilling los tsim microvias nyob rau hauv lub ceramic substrate, feem ntau nyob rau hauv daim ntawv ntawm tapered lossis ncaj-los ntawm qhov. Lub microvias thiab substrate nto ces ntxuav kom huv si thiab degassed kom tshem tawm cov drilling residues, noo noo, thiab lwm yam kab mob. Ib tug lub tshuab nqus tsev sputtering txheej txheem tom qab ntawd siv los tso ib tug Ti adhesion txheej, feem ntau 50-200 nm tuab, ua raws li ib tug Cu conductive noob txheej, feem ntau 0.5-2 μm tuab, nyob rau hauv lub substrate nto thiab raws phab ntsa sab hauv ntawm microvias.
Cov txheej Ti ua haujlwm ua ib txheej nplaum los txhim kho lub zog sib txuas ntawm cov hlau zaj duab xis thiab cov khoom siv ceramic, thaum cov txheej Cu noob muab lub hauv paus conductive rau kev electroplating tom qab. Cov txheej tooj liab tom qab ntawd raug tsim los ntawm electroplating, feem ntau mus rau qhov tuab ntawm 5-20 μm, thaum kawg tsim kom muaj kev sib txuas hluav taws xob txhim khu kev qha ntawm cov voj voog ntawm sab pem hauv ntej thiab sab nraub qaum los ntawm cov hlau vias. Hauv cov lus yooj yim, lub tshuab nqus tsev sputtering muab lub hauv paus conductive, thaum cov electroplating tom qab ntawd tsim cov tuab tooj liab, yog li txo qhov tsis kam ntawm via thiab txhim kho kev ntseeg siab ntawm kev sib txuas.
Txawm hais tias cov txheej txheem zoo li yooj yim, kev ntseeg tau ntawm kev sib txuas lus nyob ntawm ib qho tseem ceeb ua ntej: Ti / Cu noob txheej yuav tsum npog tag nrho thiab txuas ntxiv mus rau qhov chaw substrate thiab tag nrho sab hauv phab ntsa ntawm txhua lub microvia.
2. Plaub Qhov Kev Sib Tw Tseem Ceeb ntawm Kev Siv Lub Tshuab Nqus Tsev Ti / Cu Noob Txheej rau DPC Vias
Kev tsim cov noob txheej txuas ntxiv mus rau hauv cov microvias nqaim tsis yooj yim. Cov seem seem uas tseem nyob hauv cov vias tuaj yeem ua rau cov zaj duab xis lo rau, thaum cov qauv microvia ua rau kev npog ntawm phab ntsa nyuaj zuj zus. Cov kev tsis sib xws hauv zos hauv cov noob txheej tuaj yeem cuam tshuam kev siv hluav taws xob tom qab, thaum qhov sib txawv ntawm cov chaw sib txawv thiab cov khoom tsim tawm tuaj yeem cuam tshuam rau kev ruaj khov ntawm cov txheej txheem. Cov teeb meem tseem ceeb ntawm kev siv lub tshuab nqus tsev rau DPC ntawm kev ua hlau tuaj yeem sau ua plaub qhov chaw.
1. Cov Khoom seem sab hauv Vias tuaj yeem ua rau zaj duab xis lo rau tsis zoo
Tom qab laser drilling, cov khoom siv ceramic substrates yuav muaj cov khoom siv ceramic, cov khoom siv rov ua dua, cov khib nyiab drilling, thiab cov dej noo uas nqus tau hauv microvias. Rau microvias nrog cov kab uas me me thiab cov piv ntawm cov yam ntxwv siab, cov seem no feem ntau nyuaj rau tshem tawm dua li qhov ua rau muaj kuab paug ntawm qhov chaw. Yog tias kev ntxuav thiab degassing tsis txaus, cov txheej nplaum Ti yuav tsis tsim kom muaj kev sib txuas zoo thiab txhim khu kev qha nrog cov phab ntsa ceramic. Cov qhov tsis zoo no yuav tsis pom tseeb tam sim ntawd tom qab txheej, tab sis tuaj yeem maj mam tsim mus rau hauv blistering thiab delamination thaum lub sijhawm electroplating, soldering, lossis kev ua haujlwm kub siab tom qab.
2. Qhov sib piv ntawm cov ces kaum siab dua ua rau kev npog ntawm phab ntsa nyuaj dua
Qhov nyuaj ntawm kev tawg ntawm microvia tsis tuaj yeem ntsuas los ntawm nws qhov tob xwb; qhov sib piv ntawm qhov tob ntawm qhov thiab qhov txoj kab uas hla ntawm qhov - qhov sib piv ntawm qhov sib piv - kuj tseem ceeb ib yam. Piv txwv li, qhov ntawm qhov nrog txoj kab uas hla ntawm 60 μm thiab qhov tob ntawm 300 μm muaj qhov sib piv ntawm 5: 1. Thaum qhov sib piv ntawm qhov sib piv nce ntxiv, qhov nkag ntawm qhov ntawm qhov tsim cov duab ntxoov ntxoo ntawm cov khoom tawg ntau dua, txo cov khoom me me uas tuaj yeem ncav cuag qhov nruab nrab ntawm phab ntsa. Qhov no tuaj yeem ua rau cov yeeb yaj kiab tuab ntawm qhov chaw substrate thiab ze ntawm qhov qhib ntawm qhov, thaum qhov nruab nrab ntawm qhov ...
3. Ib txheej noob tsis tiav tuaj yeem tiv thaiv kev sib txuas ntawm kev ntseeg tau
Qhov yuav tsum tau ua ntawm DPC ntawm metallization tsis yog tsuas yog seb tooj liab puas muaj nyob rau ntawm phab ntsa via, tab sis seb Ti / Cu noob txheej tuaj yeem txuas ntxiv mus tas li ntawm sab pem hauv ntej ntawm lub substrate, raws tag nrho via sidewall, mus rau sab nraub qaum. Txawm tias qhov me me tsis sib xws hauv cov noob txheej tuaj yeem cuam tshuam txoj kev conductive uas xav tau rau electroplating tom qab. Yog li ntawd, qhov zoo ntawm cov noob txheej tsis tuaj yeem ntsuas tau los ntawm qhov tsos ntawm qhov chaw lossis qhov nruab nrab zaj duab xis tuab. Yuav tsum tau them sai sai rau qhov seem nyias tshaj plaws ntawm via sidewall thiab seb puas muaj kev ua hluav taws xob txuas ntxiv mus thoob plaws hauv txoj kev metallized.
4. Kev dhau ib qho qauv tsis lav qhov ruaj khov ntawm pawg mus rau pawg
Kev ua tiav qhov tuab ntawm zaj duab xis ntawm ib qho qauv tsis tas txhais tau tias cov txheej txheem npaj txhij rau kev tsim khoom loj. Kev tsim khoom DPC kuj tseem xav tau kev tswj hwm nruj ntawm kev sib npaug ntawm cov txheej txheem ntawm pem hauv ntej thiab nraub qaum, ntawm qhov chaw nruab nrab thiab ntug ntawm cov substrate, hla ntau qhov chaw sib txawv, thiab los ntawm ib pawg mus rau ib pawg. Rau cov khoom siv ceramic uas muaj ntau tus microvias, kev ntsuam xyuas cov txheej txheem yuav tsum tsis txhob tsom mus rau qhov nruab nrab ntawm zaj duab xis tuab. Qhov tseem ceeb tshaj plaws, thaj chaw nyias tshaj plaws ntawm phab ntsa ntawm txoj kev yuav tsum tswj hwm cov hluav taws xob conductivity uas xav tau rau electroplating tom qab.
3. Yuav ua li cas thaum cov noob tsis tau muab tso rau hauv av kom raug?
Cov txheej noob Ti/Cu muab lub hauv paus conductive uas xav tau rau electroplating tom qab. Yog tias cov txheej noob ntawm sab ntawm txoj kab nyias dhau, tsis tau npog tag, lossis muaj cov kev tsis sib txuas, cov hluav taws xob electroplating tam sim no tsis tuaj yeem hloov pauv mus tas li ntawm sab ntawm txoj kab, thiab cov ions tooj liab tsis tuaj yeem txo qis thiab tso rau ntawm qhov chaw tsis zoo. Thaum electroplating txuas ntxiv mus thiab cov txheej tooj liab tsim, thaum xub thawj cov cheeb tsam me me ntawm kev npog tsis txaus tuaj yeem tsim mus rau hauv cov txheej tooj liab, qhov tsis txaus ntawm qhov tuab, lossis kev plating tsis sib txuas hauv txoj kab.
Cov teeb meem no cuam tshuam ncaj qha rau qhov zoo ntawm kev sib txuas ntawm cov circuits ntawm sab pem hauv ntej thiab sab nraub qaum ntawm cov ceramic substrate. Hauv cov xwm txheej tsis hnyav heev, lawv tuaj yeem ua rau muaj kev tiv thaiv ntau ntxiv, kev tsim cua sov hauv zos, thiab kev hloov pauv ntawm kev ua haujlwm hluav taws xob. Hauv cov xwm txheej hnyav dua, cov circuits ntawm ob sab yuav ua tsis tau qhov txuas ntxiv hluav taws xob. Thaum lub sijhawm tom qab soldering, kev laus ntawm qhov kub siab, lossis kev hloov pauv thermal, cov chaw tsis zoo yuav tsim cov blistering, delamination, lossis circuit cracking, txo cov khoom tsim tawm thiab kev ntseeg siab mus sij hawm ntev thiab ua rau lub cuab yeej tsis ua haujlwm.
4. Zhenhua Vacuum txoj kev daws teeb meem loj rau cov khoom siv ceramic los ntawm kev ua metallization — DPC Ceramic Substrate Vacuum Coating Production Line
Cov Khoom Siv Zoo:
Kev siv tshuab ua haujlwm: Lub tshuab txheej txheem thiab kev hloov pauv workpiece-carrier uas ua haujlwm tsis siv neeg ua rau txo qhov kev cuam tshuam tes thaum txhim kho kev ua haujlwm zoo thiab luv lub sijhawm ua haujlwm tag nrho.
Kev Ua Haujlwm: Txhawb nqa 120 hli × 120 hli substrates nrog lub peev xwm tsim khoom txog li 288 pcs ib teev.
Kev Ua Tau Zoo: Txhim kho kev ua hluav taws xob thaum txhim kho kev ua haujlwm ntawm cov khoom siv ceramic.
Ntawm Metallization: Kev teeb tsa magnetic-field zoo tshaj plaws ua rau muaj kev tiv thaiv zoo thiab sib xws hauv microvias.
Cov Txheej Txheem: Txhawb nqa ob sab txheej kom txhim kho qhov sib npaug ntawm cov zaj duab xis thiab cov txheej txheem sib xws.
Cov ntawv thov:
Cov khoom siv tuaj yeem tso ntau yam yeeb yaj kiab hlau, suav nrog Ti, Cu, Al, Sn, Cr, Ag, thiab Ni, thiab tau siv dav hauv kev lag luam semiconductor thiab cov khoom siv hluav taws xob rau cov ntawv thov xws li cov khoom siv ceramic, cov capacitors ceramic, thiab cov pob khoom / kev txhawb nqa LED ceramic.
5. Xaus Lus
Zhenhua Vacuum tsom mus rau cov txheej txheem nqus tsev pem hauv ntej rau kev tsim khoom DPC. Los ntawm kev txhim kho microvia sidewall kev npog thiab kev sib txuas ob sab txheej txheem nrog kev tsim khoom tsis siv neeg, cov kev daws teeb meem muab cov txheej txheem Ti / Cu ruaj khov rau kev electroplating tom qab thiab txhim khu kev qha ntawm kev sib txuas. Qhov no pab cov neeg siv khoom ua tiav kev tsim khoom loj sib xws thaum txhawb nqa kev siv dav dav ntawm DPC ceramic substrates hauv semiconductor thiab cov ntawv thov hluav taws xob siab heev.
- Tsab xov xwm no tau luam tawm los ntawm Chaw tsim khoom siv nqus tsev txheejZhenhua Nqus Tsev
Lub sijhawm tshaj tawm: Lub Yim Hli-27-2026