Uma kuqhathaniswa ne-evaporation plating kanye ne-sputtering plating, isici esibaluleke kakhulu se-ion plating ukuthi ama-ion anamandla ahlasela i-substrate kanye nesendlalelo sefilimu ngenkathi kufakwa. Ukuqhunyiswa kwama-ion ashajiwe kukhiqiza uchungechunge lwemiphumela, ikakhulukazi kanje.
① Amandla okubopha ulwelwesi/isisekelo (ukunamathela) aqinile, ungqimba lwefilimu akulula ukuwa ngenxa yokuqhuma kwama-ion kwe-substrate okubangelwa umphumela wokuphalaza, ukuze i-substrate ihlanzwe, isebenze futhi ifudumale, hhayi nje ukususa ukumuncwa kwegesi ebusweni be-substrate kanye nongqimba olungcolile, kodwa futhi nokususa ubuso bama-oxide e-substrate. Ukuqhuma kwama-ion kokushisa kanye nokukhubazeka kungabangelwa umphumela wokusabalala othuthukisiwe we-substrate, kokubili ukuthuthukisa izakhiwo zekristalu zenhlangano yengqimba yobuso be-substrate, kodwa futhi kunikeza izimo zokwakheka kwezigaba ze-alloy; kanye nokuqhuma kwama-ion kwamandla aphezulu, kodwa futhi kukhiqiza inani elithile lokufakelwa kwama-ion kanye nomphumela wokuxuba ama-ion.
② Ukwembozwa kwe-ion ngenxa yokukhiqiza imisebe emihle yokudlula esimweni sokucindezela okuphezulu (okukhulu kune-1Pa noma okulingana ne-1Pa) yi-ion yomhwamuko noma ama-molecule ohambweni lwayo oluya ku-substrate ngaphambi kokuba ama-molecule egesi ahlangane nokushayisana okuningana, ngakho-ke izinhlayiya zefilimu zingahlakazeka zizungeze i-substrate, ngaleyo ndlela kuthuthukiswe ukumbozwa kwengqimba yefilimu; futhi izinhlayiya zefilimu ezi-ionized nazo zizobekwa ngaphansi kwesenzo sensimu kagesi ebusweni be-substrate ene-voltage engemihle Noma yisiphi isikhundla ebusweni be-substrate ene-voltage engemihle, okungenakufezwa ngokufaka i-evaporation plating.
–Lesi sihloko sikhishwe yi-umenzi womshini wokumboza nge-vacuumI-Guangdong Zhenhua
Isikhathi sokuthunyelwe: Jan-12-2024