Nā ʻano o ka uhi ʻana o ka Ion a me ka hoʻohana ʻana - Mokuna 1

Ke hoʻohālikelike ʻia me ka plating evaporation a me ka sputtering plating, ʻo ka hiʻohiʻona koʻikoʻi o ka ion plating ʻo ia ka hoʻouka ʻana o nā ions ikaika i ka substrate a me ka papa kiʻiʻoniʻoni i ka wā e waiho ʻia ai. ʻO ka hoʻouka ʻana o nā ions i hoʻopiʻi ʻia e hana i kahi moʻo o nā hopena, ʻo ia hoʻi penei.

① ʻO ka ikaika o ka membrane / base bonding (adhesion), ʻaʻole maʻalahi ka hāʻule ʻana o ka papa kiʻiʻoniʻoni ma muli o ka ion bombardment o ka substrate i hana ʻia e ka hopena sputtering, i hoʻomaʻemaʻe ʻia, hoʻāla ʻia a hoʻomehana ʻia ka substrate, ʻaʻole wale e wehe i ka adsorption o ke kinoea ma luna o ka substrate a me ka papa haumia, akā e wehe pū i ka ʻili o nā oxides substrate. Hiki ke hana ʻia ka Ion bombardment o ka hoʻomehana a me nā hemahema e ka hopena diffusion i hoʻonui ʻia o ka substrate, ʻelua e hoʻomaikaʻi i nā waiwai crystalline o ka hoʻonohonoho ʻana o ka papa ʻili substrate, akā hāʻawi pū i nā kūlana no ka hoʻokumu ʻana o nā pae alloy; a me ka ikehu kiʻekiʻe o ka ion bombardment, akā hana pū kekahi i kahi nui o ka ion implantation a me ka hopena hui ʻana o ka ion beam.

② Ma muli o ka uhi ʻana o ka ion, e hana ana i ka radiation bypassing maikaʻi i ke ʻano o ke kaomi kiʻekiʻe (ʻoi aku ka nui ma mua o 1Pa a i ʻole like me) ʻo ia nā ion mahu ionized a i ʻole nā ​​​​mole i kona huakaʻi i ka substrate ma mua o ka hālāwai ʻana o nā mole kinoea i kekahi mau collisions, no laila hiki ke hoʻopuehu ʻia nā ʻāpana kiʻiʻoniʻoni a puni ka substrate, a pēlā e hoʻomaikaʻi ai i ka uhi ʻana o ka papa kiʻiʻoniʻoni; a e waiho ʻia nā ʻāpana kiʻiʻoniʻoni ionized ma lalo o ka hana o ke kahua uila ma luna o ka substrate me ka voltage maikaʻi ʻole i kēlā me kēia kūlana ma ka ʻili o ka substrate me ka voltage maikaʻi ʻole, ʻaʻole hiki ke hoʻokō ʻia e ka plating evaporation.

–Ua hoʻokuʻu ʻia kēia ʻatikala emea hana mīkini uhi hakahakaGuangdong Zhenhua