Uma kuqhathaniswa ne-evaporation plating kanye ne-sputtering plating, isici esibaluleke kakhulu se-ion plating ukuthi ama-ion anamandla abhomba i-substrate kanye nongqimba lwefilimu ngenkathi ukufakwa kwenzeka. Ukuqhunyiswa kwamabhomu kwama-ion ashajiwe kukhiqiza uchungechunge lwemiphumela, ikakhulukazi ngale ndlela elandelayo.
① I-Membrane / base bonding force (adhesion) iqinile, ungqimba lwefilimu akulula ukuwa ngenxa ye-ion bombardment ye-substrate ekhiqizwa umphumela wokufafaza, ukuze i-substrate ihlanzwe, isebenze futhi ifudunyezwe, hhayi nje ukususa i-adsorption yegesi ebusweni be-substrate kanye nongqimba olungcolisiwe, kodwa futhi lususe ungqimba lwe-substrate. I-ion bombardment yokushisa nokukhubazeka ingabangelwa umphumela wokusabalalisa othuthukisiwe we-substrate, kokubili ukuthuthukisa izakhiwo zekristalu zenhlangano ye-substrate surface layer, kodwa futhi inikeza izimo zokwakheka kwezigaba ze-alloy; kanye ne-ion bombardment yamandla aphakeme, kodwa futhi ikhiqiza inani elithile lokufakelwa kwe-ion kanye nomphumela wokuxuba i-ion beam.
② I-ion enamathela ngenxa yokukhiqiza imisebe emihle edlulayo esimweni sokucindezela okuphezulu (okukhulu noma okulingana no-1Pa) kuyi-ionized ionized vapor ion noma ama-molecule ohambweni lwawo oluya endaweni engaphansi ngaphambi kokuba ama-molecule egesi ahlangabezane nenani lokushayisana, ukuze izinhlayiya zefilimu zihlakazeke nxazonke ze-substrate, ngaleyo ndlela zithuthukise ukumbozwa kwefilimu; futhi izinhlayiya zefilimu e-ionized nazo zizofakwa ngaphansi kwesenzo senkambu kagesi ebusweni be-substrate ene-voltage engalungile Noma iyiphi indawo ebusweni be-substrate ene-voltage engalungile, engenakufinyelelwa nge-evaporation plating.
-Le ndatshana ikhishwe nguumenzi womshini we-vacuum coatingI-Guangdong Zhenhua
Isikhathi sokuthumela: Jan-12-2024