Xa kuthelekiswa neplating ephuphumayo kunye ne-sputtering plating, olona phawu lubalulekileyo lwe-ion plating kukuba ii-ion zamandla zibhobhoza i-substrate kunye nomaleko wefilimu ngelixa ukubekwa kusenzeka. Ukuqhushumba kweeyoni ezihlawuliswayo kuvelisa uluhlu lweziphumo, ngakumbi ngolu hlobo lulandelayo.
① I-Membrane / isiseko se-bonding force (i-adhesion) yomelele, umaleko wefilimu akulula ukuwa ngenxa ye-ion bombardment ye-substrate eveliswa yimpembelelo yokutshiza, ukuze i-substrate icocwe, isebenze kwaye ifudunyezwe, kungekhona nje ukususa i-adsorption yegesi kumphezulu we-substrate kunye ne-substrate ye-substrate, kodwa iphinde isuse i-substrate ye-substrate. I-ion bombardment yokufudumeza kunye neziphene inokubangelwa yimpembelelo yokusasazwa okuphuculweyo kwe-substrate, zombini ukuphucula iimpawu ze-crystalline zombutho we-substrate surface layer, kodwa zibonelela ngeemeko zokubunjwa kwezigaba ze-alloy; kunye ne-ion bombardment yamandla aphezulu, kodwa ikwavelisa isixa esithile sofakelo lwe-ion kunye nesiphumo sokuxuba i-ion beam.
② Ukwaleka kwe-Ion ngenxa yokuvelisa i-radiation edlulayo elungileyo kwimeko yoxinzelelo oluphezulu (olukhulu okanye olulingana ne-1Pa) yi-ionized ionized vapour okanye iimolekyuli kuhambo lwayo ukuya kwi-substrate ngaphambi kokuba iimolekyuli zegesi zihlangane nenani lokungqubana, ngoko ke amasuntswana efilimu angasasazwa ajikeleze i-substrate, ngaloo ndlela iphucula ukugubungela ifilimu; kunye neengqungquthela zefilimu ye-ionized nazo ziya kufakwa phantsi kwesenzo sentsimi yombane kumphezulu we-substrate ene-voltage engalunganga Nasiphi na isikhundla phezu kwe-substrate ene-voltage engalunganga, engenako ukufezekiswa nge-evaporation plating.
–Eli nqaku likhutshwa nguumenzi womatshini wokugqumaGuangdong Zhenhua
Ixesha lokuposa: Jan-12-2024