Ha ho bapisoa le mouoane plating le sputtering plating, tšobotsi ea bohlokoa ka ho fetisisa ea ion plating ke hore li-ion tse matla li bomola karoloana le lera la filimi ha ho etsoa deposition. Ho phatloha ha li-ion tse chesitsoeng ho hlahisa letoto la litlamorao, haholo-holo ka tsela e latelang.
① Membrane / base bonding force (adhesion) e matla, lera la filimi ha le bonolo ho oa ka lebaka la ion bombardment ea substrate e hlahisoang ke phello ea sputtering, e le hore substrate e hloekisoe, e sebetse le ho futhumala, eseng feela ho tlosa khase e ka holim'a substrate le sebaka se silafetseng, empa hape le ho tlosa oxide e silafetseng. Ion bombardment ea ho futhumatsa le mefokolo e ka bakoa ke phello e ntlafetseng ea phallo ea substrate, ka bobeli ho ntlafatsa thepa ea kristale ea mokhatlo oa substrate surface layer, empa hape e fana ka maemo a ho thehoa ha mekhahlelo ea alloy; le matla a phahameng a ion bombardment, empa hape e hlahisa palo e itseng ea ho kenngoa ha ion le phello ea ho kopanya ion beam.
② Ho roala ha ion ka lebaka la ho hlahisa mahlaseli a mangata ha ho e-na le khatello e phahameng (e kholo ho feta kapa e lekanang le 1Pa) ke ionized mouoane kapa limolek'hule leetong la eona la ho ea substrate pele limolek'hule tsa khase li kopana le likhohlano tse ngata, kahoo likaroloana tsa filimi li ka hasana ho pota-pota substrate, kahoo li ntlafatsa tšireletso ea filimi; le likaroloana tsa filimi ea ionized li tla boela li behoe tlas'a ts'ebetso ea sebaka sa motlakase holim'a substrate e nang le voltage e mpe Boemo leha e le bofe holim'a substrate e nang le voltage e mpe, e ke keng ea finyelloa ka ho cheka mouoane.
-Sengoliloeng sena se lokolloa kemoetsi oa mochine oa vacuum coatingGuangdong Zhenhua
Nako ea poso: Jan-12-2024