Marka la barbar dhigo dahaadhinta uumiga iyo xajinta xajinta, sifada ugu muhiimsan ee xayndaabka ion waa in ions tamartu ay duqeeyaan substrate-ka iyo lakabka filimka inta meel dhigista ay dhacayso. Duqeymaha ions ee la soo rogay waxay soo saartaa saameyno isdaba joog ah, badi sida soo socota.
① Membrane / saldhiga isku xidhka (adhesion) xoog leh, lakabka filimku ma fududa in uu dhaco sababtoo ah bamka ion ee substrate-ka ee ka soo baxa saameynta xajinta, si substrate loo nadiifiyo, loo dhaqo oo loo kululeeyo, ma aha oo kaliya in laga saaro adsorption gaaska dusha sare ee substrate iyo lakabka wasakhaysan, laakiin sidoo kale in laga saaro substrate-ka. Duminta Ion ee kuleylinta iyo cilladaha waxaa sababi kara saameynta faafinta ee la xoojiyay ee substrate-ka, labadaba si loo hagaajiyo sifooyinka crystalline ee ururka lakabka substrate, laakiin sidoo kale waxay bixisaa shuruudaha samaynta wejiyada daawaha; iyo tamarta sare ee ion bombardment, laakiin sidoo kale waxay soo saartaa qadar go'an oo ah implantation ion iyo saamaynta isku dhafka ah ee ion.
② ion daahan ay sabab u tahay soo saari shucaaca bypassing wanaagsan in ay dhacdo cadaadis sare (ka weyn ama la mid ah 1Pa) waa ionized uumiga ions ama molecules in ay safarka si substrate ka hor molecules gaaska la kulmi doonaa tiro ka mid ah isku dhacyada, sidaas qaybaha filimka waxaa lagu kala firdhi karaa agagaarka substrate ah, sidaas hagaajinaysaa daboolka lakabka filimka; iyo qaybaha filimka ionized ayaa sidoo kale lagu dhejin doonaa ficilka korantada korantada ee dusha sare ee substrate oo leh koronto taban Meel kasta oo dusha sare ee substrate leh koronto taban, taas oo aan lagu gaari karin uumiga.
–Maqaalkan waxa soo saaraysoo saaraha mashiinka daahan vacuumGuangdong Zhenhua
Waqtiga boostada: Jan-12-2024