E jiri ya tụnyere evaporation plating na sputtering plating, akụkụ kacha mkpa nke ion plating bụ na ion ike na-atụ bọmbụ na mkpụrụ osisi na oyi akwa ihe nkiri mgbe ntinye na-ewere ọnọdụ. Mkpesa nke ion ebubo na-emepụta usoro mmetụta, tumadi dị ka ndị a.
① Membrane / base bonding force (adhesion) siri ike, ihe nkiri oyi akwa adịghị mfe ịdapụ n'ihi ion bombardment nke mkpụrụ sitere na mmetụta sputtering, nke mere na mkpụrụ na-ehicha, na-arụ ọrụ na kpụ ọkụ n'ọnụ, ọ bụghị nanị iji wepụ adsorption nke gas n'elu nke substrate na mmeru oyi akwa, kamakwa iji wepụ oxides n'elu. Ion bombardment nke kpo oku na ntụpọ nwere ike mere site enwekwukwa mgbasa mmetụta nke mkpụrụ, ma ka mma crystalline Njirimara nke mkpụrụ n'elu Layer nzukọ, ma na-enye ọnọdụ maka guzobe alloy n'ụzọ; na elu ume ion bombu, ma na-arụpụtakwa ụfọdụ ego nke ion implantation na ion beam mix mmetụta.
② ion mkpuchi n'ihi na-emepụta ọma bypassing radieshon na ikpe nke elu mgbali (karịa ma ọ bụ hà 1Pa) bụ ionized vapor ion ma ọ bụ ụmụ irighiri ihe na ya njem na mkpụrụ tupu gas ụmụ irighiri ga-ezute a ọnụ ọgụgụ nke collisions, otú film ahụ nwere ike gbasasịa gburugburu substrate, si otú ahụ na-emeziwanye mkpuchi nke ihe nkiri oyi akwa; na ihe nkiri ionized ga-echekwaba n'okpuru ọrụ nke ọkụ eletrik n'elu ala nke mkpụrụ na voltaji na-adịghị mma Ọnọdụ ọ bụla dị n'elu nke mkpụrụ ahụ na voltaji na-adịghị mma, nke na-enweghị ike ime ya site na ikpochapu evaporation.
–E wepụtara akụkọ aonye na-emepụta igwe mkpuchi ikukuGuangdong Zhenhua
Oge nzipu: Jan-12-2024