I ka hoʻohālikelike ʻia me ka evaporation plating a me ka sputtering plating, ʻo ka hiʻohiʻona koʻikoʻi o ka hoʻoheheʻe ʻana i ka ion ʻo ia ka hoʻopaʻa ʻana o nā ion ikaika i ka substrate a me ka papa kiʻiʻoniʻoni i ka wā e hoʻopaʻa ʻia ai. ʻO ka pahū ʻana o nā ion i hoʻopaʻa ʻia e hoʻopuka i nā hopena, ʻoi aku ka nui o kēia.
① Membrane / base hoʻopaʻa ikaika (adhesion) ikaika, ʻaʻole maʻalahi ka hāʻule ʻana o ke kiʻiʻoniʻoni ma muli o ka pahū ʻana o ka ion o ka substrate i hana ʻia e ka hopena sputtering, no laila e hoʻomaʻemaʻe ʻia ka substrate, hoʻāla a wela, ʻaʻole wale e wehe i ka adsorption o ke kinoea ma ka ʻili o ka substrate a me ka papa lepo o ka substrate, akā e wehe pū i ka ʻili o ka substrate. Hiki ke hoʻonui ʻia ka hopena diffusion o ka substrate, e hoʻomaikaʻi i nā waiwai crystalline o ka hui ʻana o ka substrate surface layer, akā hāʻawi pū kekahi i nā kūlana no ka hoʻokumu ʻana i nā pae alloy; a ʻoi aku ka nui o ka ikehu ion bombardment, akā hoʻopuka pū kekahi i ka nui o ka implantation ion a me ka hopena hui ʻana o ka ion beam.
② ʻO ka uhi ʻana o ka Ion ma muli o ka hana ʻana i ka radiation bypassing maikaʻi i ke ʻano o ke kaomi kiʻekiʻe (ʻoi aku ka nui a i ʻole like me 1Pa) he ionized vapor ion a i ʻole nā molekole i kāna huakaʻi i ka substrate ma mua o ka loaʻa ʻana o nā molekole kinoea i nā hui ʻana, no laila hiki ke hoʻopuehu ʻia nā ʻāpana kiʻi a puni ka substrate, pēlā e hoʻomaikaʻi ai i ka uhi o ka papa kiʻiʻoniʻoni; a e waiho pū ʻia nā ʻāpana kiʻiʻoniʻoni ionized ma lalo o ka hana o ke kahua uila ma luna o ka ʻili o ka substrate me ka uila maikaʻi ʻole ʻO kēlā me kēia kūlana ma ka ʻili o ka substrate me ka uila maikaʻi ʻole, ʻaʻole hiki ke hoʻokō ʻia e ka evaporation plating.
-Ua hoʻokuʻu ʻia kēia ʻatikala emea hana mīkini hoʻopaʻa haʻahaʻaGuangdong Zhenhua
Ka manawa hoʻouna: Jan-12-2024