1, Izici zokumboza nge-sputter
Uma kuqhathaniswa ne-vacuum evaporation evamile, i-sputtering enamathelayo inezici ezilandelayo:
(1) Noma iyiphi into ingakhishwa amathe, ikakhulukazi indawo yokuncibilika ephezulu, izakhi zomfutho womoya ophansi kanye nama-compound. Uma nje iyinto eqinile, kungakhathaliseki ukuthi iyinsimbi, i-semiconductor, i-insulator, i-compound kanye nengxube, njll., kungakhathaliseki ukuthi iyibhulokhi, izinto ezihlanganisiwe zingasetshenziswa njengezinto eziqondiwe. Njengoba ukubola okuncane kanye nokuhlukaniswa kwenzeka lapho kukhishwa izinto ezivikelayo kanye nama-alloy afana nama-oxide, angasetshenziswa ukulungiselela amafilimu amancane namafilimu e-alloy anezingxenye ezifanayo ezifana nezezinto eziqondiwe, ngisho namafilimu aqhuba kakhulu anezinhlanganisela eziyinkimbinkimbi. Ngaphezu kwalokho, indlela yokuphuma amathe ingasetshenziswa futhi ukukhiqiza amafilimu ama-compound ahluke ngokuphelele ezintweni eziqondiwe, njenge-oxides, nitrides, carbides kanye nama-silicides.
(2) Ukunamathelana okuhle phakathi kwefilimu eqhumayo kanye ne-substrate. Njengoba amandla ama-athomu aqhumayo ephakeme ngama-oda angu-1-2 kunama-athomu aqhumayo, ukuguqulwa kwamandla kwezinhlayiya zamandla aphezulu ezibekwe ku-substrate kukhiqiza amandla aphezulu okushisa, okuthuthukisa ukunamathela kwama-athomu aqhumayo ku-substrate. Ingxenye yama-athomu aqhumayo anamandla aphezulu izofakwa ngamazinga ahlukahlukene, yakha ungqimba olubizwa ngokuthi ukusabalalisa okungama-pseudo ku-substrate lapho ama-athomu aqhumayo kanye nama-athomu ezinto ze-substrate "kuxubana" khona. Ngaphezu kwalokho, ngesikhathi sokuqhuma kwezinhlayiya eziqhumayo, i-substrate ihlala ihlanzwa futhi isebenze endaweni ye-plasma, esusa ama-athomu aqhumayo anganamatheli kahle, ihlanze futhi isebenze ubuso be-substrate. Ngenxa yalokho, ukunamathela kwengqimba yefilimu eqhumayo ku-substrate kukhuliswa kakhulu.
(3) Ubuningi obukhulu bokumbozwa kwe-sputter, imigodi emincane, kanye nobumsulwa obukhulu bengqimba yefilimu ngoba akukho ukungcola okubangelwa ukubola, okungenakugwenywa ekufakweni komphunga we-vacuum ngesikhathi senqubo yokumbozwa kwe-sputter.
(4) Ukulawulwa okuhle kanye nokuphindaphindwa kobukhulu befilimu. Njengoba ugesi okhishwayo kanye nogesi oqondiwe kungalawulwa ngokwehlukana ngesikhathi sokumbozwa kwe-sputter, ukuqina kwefilimu kungalawulwa ngokulawula ugesi oqondiwe, ngakho-ke, ukulawulwa kobukhulu befilimu kanye nokuphindaphindwa kobukhulu befilimu ngokumpompa okuningi kwe-sputter coating kuhle, futhi ifilimu yobukhulu obunqunyiwe ingambozwa ngempumelelo. Ngaphezu kwalokho, ukuhlanganiswa kwe-sputter kungathola ukuqina kwefilimu okufanayo endaweni enkulu. Kodwa-ke, ngobuchwepheshe bokumboza i-sputter obujwayelekile (ikakhulukazi i-dipole sputtering), imishini iyinkimbinkimbi futhi idinga idivayisi yokucindezela okuphezulu; isivinini sokwakheka kwefilimu sokumboza i-sputter siphansi, izinga lokufakwa kwe-vacuum evaporation lingu-0.1 ~ 5nm/min, kuyilapho izinga lokufakwa kwe-sputter lingu-0.01 ~ 0.5nm/min; ukukhuphuka kwezinga lokushisa le-substrate kuphezulu futhi kusengozini yegesi yokungcola, njll. Kodwa-ke, ngenxa yentuthuko yobuchwepheshe bokumpompa i-RF kanye ne-magnetron sputtering, kutholakale intuthuko enkulu ekufinyeleleni ukufakwa kwe-sputter okusheshayo kanye nokunciphisa izinga lokushisa le-substrate. Ngaphezu kwalokho, eminyakeni yamuva nje, izindlela ezintsha zokumboza i-sputter ziyaphenywa - ngokusekelwe ekuqhumeni kwe-planar magnetron - ukunciphisa ingcindezi yomoya eqhumayo kuze kube yilapho i-sputter ye-zero-pressure lapho ingcindezi yegesi yokungenisa ngesikhathi sokuqhumisa izoba yi-zero.
Isikhathi sokuthunyelwe: Novemba-08-2022