Kev siv tshuab txheej sputtering

1, Cov yam ntxwv ntawm sputter txheej
Piv nrog rau cov txheej txheem nqus tsev evaporation, sputtering txheej muaj cov yam ntxwv hauv qab no:
(1) Txhua yam khoom siv tau sputtering, tshwj xeeb tshaj yog cov khoom uas yaj sai sai, cov khoom uas muaj pa tsawg thiab cov tshuaj sib xyaw. Tsuav yog nws yog cov khoom khov, txawm tias nws yog hlau, semiconductor, insulator, compound thiab sib tov, thiab lwm yam, txawm tias nws yog ib lub thaiv, cov khoom siv granular tuaj yeem siv ua cov khoom siv lub hom phiaj. Vim tias muaj kev puas tsuaj me ntsis thiab kev faib ua feem thaum sputtering cov khoom siv insulating thiab alloys xws li oxides, lawv tuaj yeem siv los npaj cov yeeb yaj kiab nyias thiab cov yeeb yaj kiab alloy nrog cov khoom sib xws zoo ib yam li cov khoom siv lub hom phiaj, thiab txawm tias cov yeeb yaj kiab superconducting nrog cov khoom sib xyaw ua ke. Tsis tas li ntawd, txoj kev reactive sputtering kuj tseem siv tau los tsim cov yeeb yaj kiab ntawm cov tshuaj sib txawv kiag li ntawm cov khoom siv lub hom phiaj, xws li oxides, nitrides, carbides thiab silicides.
(2) Kev nplaum zoo ntawm cov zaj duab xis sputtered thiab lub substrate. Vim tias lub zog ntawm cov atoms sputtered yog 1-2 qhov kev txiav txim siab siab dua li ntawm cov atoms evaporated, kev hloov pauv lub zog ntawm cov khoom me me muaj zog siab tso rau ntawm lub substrate tsim cov zog thermal siab dua, uas ua rau kom muaj kev nplaum ntawm cov atoms sputtered rau lub substrate. Ib feem ntawm cov atoms sputtered muaj zog siab yuav raug txhaj rau ntau qib, tsim ib txheej hu ua pseudo-diffusion ntawm lub substrate qhov twg cov atoms sputtered thiab cov atoms ntawm cov khoom siv substrate "miscible" nrog ib leeg. Tsis tas li ntawd, thaum lub sijhawm foob pob ntawm cov khoom me me sputtering, lub substrate ib txwm ntxuav thiab ua haujlwm hauv thaj chaw plasma, uas tshem tawm cov atoms precipitated tsis zoo, ntxuav thiab ua haujlwm rau qhov chaw substrate. Yog li ntawd, qhov kev nplaum ntawm cov zaj duab xis sputtered rau lub substrate yog txhim kho zoo heev.
(3) Qhov ceev ntawm cov txheej sputter, tsawg dua qhov pinholes, thiab qhov huv dua ntawm cov txheej zaj duab xis vim tias tsis muaj kev sib kis crucible, uas yog qhov tsis zam tau hauv cov pa nqus tsev vacuum thaum lub sijhawm txheej txheem sputter.
(4) Kev tswj tau zoo thiab rov ua dua ntawm cov tuab zaj duab xis. Vim tias cov tam sim no tawm thiab cov hom phiaj tam sim no tuaj yeem tswj tau sib cais thaum lub sijhawm sputtering, cov tuab zaj duab xis tuaj yeem tswj tau los ntawm kev tswj cov hom phiaj tam sim no, yog li, kev tswj tau ntawm cov tuab zaj duab xis thiab kev rov ua dua ntawm cov tuab zaj duab xis los ntawm ntau lub sputtering ntawm sputter txheej yog qhov zoo, thiab cov zaj duab xis ntawm cov tuab uas tau teem tseg tuaj yeem ua tau zoo coated. Tsis tas li ntawd, sputter txheej tuaj yeem tau txais cov tuab zaj duab xis sib xws thoob plaws thaj chaw loj. Txawm li cas los xij, rau cov thev naus laus zis sputter txheej dav dav (feem ntau yog dipole sputtering), cov khoom siv yog qhov nyuaj thiab xav tau cov cuab yeej siab siab; qhov ceev ntawm kev tsim zaj duab xis ntawm sputter deposition yog qis, qhov nqus tsev evaporation deposition tus nqi yog 0.1 ~ 5nm / min, thaum qhov nqi sputtering yog 0.01 ~ 0.5nm / min; qhov kub ntawm substrate nce siab thiab yooj yim rau cov pa roj impurity, thiab lwm yam. Txawm li cas los xij, vim yog kev txhim kho ntawm RF sputtering thiab magnetron sputtering thev naus laus zis, kev vam meej zoo tau txais hauv kev ua tiav cov sputtering deposition sai thiab txo qhov kub ntawm substrate. Ntxiv mus, nyob rau xyoo tas los no, cov txheej txheem tshiab sputtering raug tshawb nrhiav - raws li planar magnetron sputtering - kom txo qhov siab ntawm huab cua sputtering kom txog thaum xoom-siab sputtering qhov twg qhov siab ntawm cov roj nkag thaum lub sijhawm sputtering yuav xoom.