ʻenehana uhi ʻana i ka sputtering

1, Nā hiʻohiʻona o ka uhi ʻana i ka sputter
Ke hoʻohālikelike ʻia me ka uhi hoʻoheheʻe maʻamau, loaʻa i ka uhi sputtering nā hiʻohiʻona penei:
(1) Hiki ke pīpī ʻia kekahi mea, ʻoiai ke kiko heheʻe kiʻekiʻe, nā mea haʻahaʻa haʻahaʻa a me nā hui. Inā he mea paʻa ia, inā he metala, semiconductor, insulator, hui a me ka hui ʻana, a pēlā aku, inā he poloka ia, hiki ke hoʻohana ʻia ka mea granular ma ke ʻano he mea i manaʻo ʻia. ʻOiai he liʻiliʻi ka decomposition a me ka fractionation i ka wā e pīpī ai i nā mea insulating a me nā alloys e like me nā oxides, hiki ke hoʻohana ʻia e hoʻomākaukau i nā kiʻiʻoniʻoni lahilahi a me nā kiʻiʻoniʻoni alloy me nā ʻāpana like e like me nā mea i manaʻo ʻia, a hiki i nā kiʻiʻoniʻoni superconducting me nā ʻano paʻakikī.´ Eia kekahi, hiki ke hoʻohana ʻia ke ʻano sputtering reactive e hana i nā kiʻiʻoniʻoni o nā hui i ʻokoʻa loa mai ka mea i manaʻo ʻia, e like me nā oxides, nitrides, carbides a me silicides.
(2) Hoʻopili maikaʻi ma waena o ke kiʻiʻoniʻoni sputtered a me ke substrate. ʻOiai ʻo ka ikehu o nā ʻātoma sputtered he 1-2 mau kauoha o ka nui i ʻoi aku ma mua o nā ʻātoma i hoʻoheheʻe ʻia, ʻo ka hoʻololi ʻana o ka ikehu o nā ʻāpana ikehu kiʻekiʻe i waiho ʻia ma ka substrate e hoʻoulu ai i ka ikehu wela kiʻekiʻe, kahi e hoʻonui ai i ka hoʻopili ʻana o nā ʻātoma sputtered i ka substrate. E hoʻokomo ʻia kahi hapa o nā ʻātoma sputtered ikehu kiʻekiʻe i nā kekelē like ʻole, e hana ana i kahi papa pseudo-diffusion i kapa ʻia ma ka substrate kahi e "hui pū" ai nā ʻātoma sputtered a me nā ʻātoma o ka mea substrate me kekahi i kekahi. Eia kekahi, i ka wā o ka hoʻouka ʻana o nā ʻāpana sputtering, hoʻomaʻemaʻe mau ʻia a hoʻāla ʻia ka substrate ma ka ʻāpana plasma, kahi e wehe ai i nā ʻātoma precipitated i hoʻopili maikaʻi ʻole ʻia, hoʻomaʻemaʻe a hoʻāla i ka ʻili substrate. ʻO ka hopena, ua hoʻonui nui ʻia ka hoʻopili ʻana o ka papa kiʻiʻoniʻoni sputtered i ka substrate.
(3) ʻO ke kiʻekiʻe o ka uhi sputter, ka liʻiliʻi o nā pinholes, a me ka maʻemaʻe kiʻekiʻe o ka papa kiʻiʻoniʻoni no ka mea ʻaʻohe haumia ipuhao, kahi mea hiki ʻole ke pale ʻia i ka waiho ʻana o ka mahu vacuum i ka wā o ke kaʻina hana uhi sputter.
(4) Maikaʻi ka hoʻokele a me ka hana hou ʻana o ka mānoanoa o ke kiʻiʻoniʻoni. ʻOiai hiki ke hoʻokele kaʻawale ʻia ke au hoʻokuʻu a me ke au i manaʻo ʻia i ka wā o ka uhi ʻana o ka sputter, hiki ke hoʻokele ʻia ka mānoanoa o ke kiʻiʻoniʻoni ma o ka hoʻokele ʻana i ke au i manaʻo ʻia, no laila, maikaʻi ka hoʻokele ʻana o ka mānoanoa o ke kiʻiʻoniʻoni a me ka hana hou ʻana o ka mānoanoa o ke kiʻiʻoniʻoni ma o ka sputtering pinepine ʻana o ka uhi sputter, a hiki ke uhi pono ʻia ke kiʻiʻoniʻoni o ka mānoanoa i hoʻoholo mua ʻia. Eia kekahi, hiki i ka uhi sputter ke loaʻa kahi mānoanoa like o ke kiʻiʻoniʻoni ma luna o kahi ākea. Eia nō naʻe, no ka ʻenehana uhi sputter maʻamau (ʻo ka dipole sputtering nui), he paʻakikī nā lako a koi ʻia kahi mea hana kiʻekiʻe; haʻahaʻa ka wikiwiki o ka hoʻokumu ʻana o ke kiʻiʻoniʻoni o ka waiho ʻana o ka sputter, ʻo ka wikiwiki o ka waiho ʻana o ka vacuum evaporation he 0.1 ~ 5nm / min, ʻoiai ʻo ka wikiwiki o ka sputtering he 0.01 ~ 0.5nm / min; kiʻekiʻe ka piʻi ʻana o ka mahana o ka substrate a he palupalu i ke kinoea haumia, a pēlā aku. Eia naʻe, ma muli o ka hoʻomohala ʻana o ka RF sputtering a me ka ʻenehana magnetron sputtering, ua loaʻa ka holomua nui i ka hoʻokō ʻana i ka waiho ʻana o ka sputtering wikiwiki a me ka hoʻemi ʻana i ka mahana o ka substrate. Eia kekahi, i nā makahiki i hala iho nei, ke noiʻi ʻia nei nā ʻano uhi sputter hou - ma muli o ka planar magnetron sputtering - e hōʻemi i ke kaomi ea sputtering a hiki i ka sputtering zero-pressure kahi e lilo ai ke kaomi o ke kinoea intake i ka wā sputtering i ka zero.