1, Features na sputter shafi
Idan aka kwatanta da na gargajiya injin tururi shafi, sputtering shafi yana da wadannan siffofin:
(1) Duk wani abu za a iya fitar da shi, musamman ma'aunin narkewa mai yawa, abubuwan da ke haifar da tururi mai ƙarancin ƙarfi da mahaɗan. Muddin yana da ƙarfi, ko ƙarfe ne, semiconductor, insulator, mahaɗan da cakuda, da sauransu, ko tubali ne, ana iya amfani da kayan granular azaman kayan da aka nufa. Tunda ƙaramin rugujewa da rarrabuwa yana faruwa lokacin da ake amfani da kayan rufi da ƙarfe kamar oxides, ana iya amfani da su don shirya fina-finai masu siriri da fina-finan gami tare da kayan haɗin kai iri ɗaya kamar na kayan da aka nufa, har ma da fina-finan superconductor tare da abubuwan haɗin kai masu rikitarwa. Bugu da ƙari, ana iya amfani da hanyar sputtering mai amsawa don samar da fina-finan mahadi daban-daban da kayan da aka nufa, kamar oxides, nitrides, carbide da silicide.
(2) Kyakkyawan mannewa tsakanin fim ɗin da aka fesa da kuma substrate. Tunda kuzarin atom ɗin da aka fesa ya fi girma sau 1-2 fiye da na atom ɗin da aka fesa, canza kuzarin ƙwayoyin da aka fesa a kan substrate yana haifar da ƙarin kuzarin zafi, wanda ke haɓaka mannewar atom ɗin da aka fesa zuwa substrate. Za a allura wani ɓangare na atom ɗin da aka fesa mai ƙarfi zuwa matakai daban-daban, wanda ke samar da abin da ake kira Layer ɗin da aka fesa a kan substrate inda atom ɗin da aka fesa da atom ɗin kayan substrate za su "mirgina" da juna. Bugu da ƙari, yayin fashewar ƙwayoyin da aka fesa, substrate koyaushe ana tsaftace shi kuma ana kunna shi a yankin plasma, wanda ke cire atom ɗin da aka fesa da kyau, yana tsarkakewa da kunna saman substrate. Sakamakon haka, mannewar Layer ɗin da aka fesa zuwa substrate yana ƙaruwa sosai.
(3) Yawan rufewar sputter mai yawa, ƙarancin ramukan fil, da kuma mafi girman tsarkin Layer ɗin fim saboda babu gurɓataccen gurɓataccen abu, wanda ba makawa bane a cikin ajiyar tururi na injin yayin aikin rufe sputter.
(4) Kyakkyawan sarrafawa da kuma maimaita kauri na fim. Tunda ana iya sarrafa kwararar fitarwa da kuma kwararar manufa daban-daban yayin shafa sputter, ana iya sarrafa kauri na fim ɗin ta hanyar sarrafa kwararar manufa, don haka, ikon sarrafa kauri na fim ɗin da sake haifar da kauri na fim ɗin ta hanyar fesawa da yawa na fenti sputter suna da kyau, kuma ana iya shafa fim ɗin da aka ƙayyade kauri yadda ya kamata. Bugu da ƙari, murfin sputter na iya samun kauri iri ɗaya a kan babban yanki. Duk da haka, don fasahar shafa sputter gabaɗaya (galibi sputtering dipole), kayan aikin suna da rikitarwa kuma suna buƙatar na'urar matsi mai ƙarfi; saurin ƙirƙirar fim ɗin na fesa sputter yana da ƙasa, ƙimar zubar da iskar gas shine 0.1~5nm/min, yayin da ƙimar sputtering shine 0.01~0.5nm/min; ƙaruwar zafin substrate yana da yawa kuma yana da sauƙin kamuwa da iskar gas mara kyau, da sauransu. Duk da haka, saboda ci gaban fasahar sputtering RF da magnetron sputtering, an sami babban ci gaba wajen cimma saurin fesa sputtering da rage zafin substrate. Bugu da ƙari, a cikin 'yan shekarun nan, ana binciken sabbin hanyoyin rufe sputter - bisa ga planar magnetron sputtering - don rage matsin lamba na iska har sai sifili sputtering inda matsin lamba na iskar shaka yayin sputtering ba zai zama sifili ba.
Lokacin Saƙo: Nuwamba-08-2022