1. Features na sputter shafi
Idan aka kwatanta da na al'ada injin evaporation shafi, sputtering shafi yana da wadannan fasali:
(1) Duk wani abu za a iya sputtered, musamman high narkewa, low tururi abubuwa da mahadi. Muddin yana da ƙarfi, ko ƙarfe ne, semiconductor, insulator, fili da cakudawa, da dai sauransu, ko toshe ne, ana iya amfani da kayan granular azaman abin manufa. Tun da ƙananan bazuwa da raguwa yana faruwa a lokacin da ake zubar da kayan insulating da gami irin su oxides, ana iya amfani da su don shirya fina-finai na bakin ciki da fina-finai na allo tare da abubuwan da suka dace daidai da na kayan da aka yi niyya, har ma da fina-finai masu ban mamaki tare da hadaddun abubuwan haɗin gwiwa.' Bugu da ƙari, ana iya amfani da hanyar yin sputtering mai amsawa don samar da fina-finai na mahadi gaba ɗaya daban-daban daga abubuwan da aka yi niyya, oxides, kamar sitrides.
(2) Kyakkyawan mannewa tsakanin fim ɗin sputtered da substrate. Tunda makamashin atom ɗin da aka watsar yana da umarni 1-2 na girma sama da na atom ɗin da aka ƙafe, jujjuyawar makamashi na barbashi masu ƙarfi da aka ajiye akan mashin ɗin yana haifar da mafi girman makamashin thermal, wanda ke haɓaka mannewar atom ɗin sputtered a cikin substrate. Za a yi allurar wani yanki na manyan kuzarin zarra zuwa nau'o'i daban-daban, suna samar da abin da ake kira Layer-diffusion Layer akan substrate inda kwayoyin zarra masu sputtered da kuma atom na kayan substrate "miscible" da juna. Bugu da kari, a lokacin bam na sputtering barbashi, da substrate ne ko da yaushe tsabtace da kuma kunna a cikin plasma yankin, wanda ya kawar da talauci riko atoms, tsarkakewa da kuma kunna substrate surface. A sakamakon haka, adhesion na fim ɗin da aka zubar da shi a cikin ma'auni yana haɓaka sosai.
(3) Babban yawa na suturar sputter, ƙarancin pinholes, da mafi girman tsaftar fim ɗin fim saboda babu gurɓataccen gurɓataccen abu, wanda ba zai yuwu ba a cikin ɓoyewar tururi yayin aikin suturar sputter.
(4) Kyakkyawan sarrafawa da maimaitawa na kauri na fim. Tun da fitarwa halin yanzu da manufa halin yanzu za a iya sarrafa daban a lokacin sputter shafi, da fim kauri za a iya sarrafa ta sarrafa manufa halin yanzu, don haka, da controllability na fim kauri da reproducibility na fim kauri ta mahara sputtering na sputter shafi ne mai kyau, da kuma fim na predetermined kauri za a iya yadda ya kamata mai rufi. Bugu da ƙari, suturar sputter na iya samun kauri na fim ɗin iri ɗaya a kan babban yanki. Koyaya, don fasahar suturar sputter gabaɗaya (yafi sputtering dipole), kayan aikin yana da rikitarwa kuma yana buƙatar na'urar matsa lamba; saurin samar da fim na ƙaddamarwa sputter yana da ƙasa, ƙimar ƙaƙƙarfan ƙazamin ƙura shine 0.1 ~ 5nm / min, yayin da ƙimar sputtering shine 0.01 ~ 0.5nm / min; haɓakar zafin jiki na substrate yana da girma kuma yana da rauni ga iskar gas mai ƙazanta, da sauransu. Duk da haka, saboda haɓakar fasahar RF sputtering da fasahar sputtering magnetron, an sami babban ci gaba wajen samun saurin sputtering ajiya da rage yawan zafin jiki. Bugu da ƙari, a cikin 'yan shekarun nan, ana binciken sababbin hanyoyin suturar sputter - bisa tsarin magnetron sputtering - don rage girman iska mai watsawa har sai da sifili-matsananciyar sputtering inda matsa lamba na iskar gas a lokacin sputtering zai zama sifili.
Lokacin aikawa: Nuwamba-08-2022