Ukubuka Konke Kobuchwepheshe Bokumboza Ingilazi Ngezimbobo Ze-TGV No.1
Ukugqoka Ngengilazi Ngezimbobo ze-TGV ubuchwepheshe obusha bokupakisha be-microelectronic obuhilela ukudala imigodi edlulayo ezisekelweni zengilazi nokwenza izindonga zazo zangaphakathi zibe ngensimbi ukuze kufezwe ukuxhumana kukagesi okunobukhulu obuphezulu. Uma kuqhathaniswa ne-TSV yendabuko (Through Silicon Via) kanye nezisekelweni eziphilayo, ingilazi ye-TGV inikeza izinzuzo ezifana nokulahlekelwa kwesignali okuphansi, ukubonakala okuphezulu, kanye nokuzinza okuhle kakhulu kokushisa. Lezi zakhiwo zenza i-TGV ifaneleke ukusetshenziswa kokuxhumana kwe-5G, ukupakisha kwe-optoelectronic, izinzwa ze-MEMS, nokuningi.
Amathemba Emakethe Enombolo 2: Kungani Ingilazi Ye-TGV Ithola Ukunakwa?
Ngokuthuthuka okusheshayo kokuxhumana okuvamise kakhulu, ukuhlanganiswa kwe-optoelectronic, kanye nobuchwepheshe obuphambili bokupakisha, isidingo sengilazi ye-TGV sikhula kancane kancane:
Ukuxhumana kwe-5G kanye ne-Millimeter-Wave: Izici zokulahlekelwa okuncane kwengilazi ye-TGV zenza ifaneleke kakhulu kumadivayisi e-RF asebenza imvamisa ephezulu njenge-antenna kanye nezihlungi.
Ukupakishwa kwe-Optoelectronic: Ukucaca okuphezulu kwengilazi kunenzuzo ezinhlelweni zokusebenza ezifana ne-silicon photonics kanye ne-LiDAR.
Ukupakishwa Kwezinzwa ze-MEMS: Ingilazi ye-TGV ivumela ukuxhumana okunobuningi obukhulu, okuthuthukisa ukwenziwa kube kuncane kanye nokusebenza kwezinzwa.
Ukupakishwa Kwe-Semiconductor Okuthuthukisiwe: Ngokukhula kobuchwepheshe be-Chiplet, ama-substrate engilazi ye-TGV anamandla amakhulu ekupakishweni okunobuningi obukhulu.
Inqubo Eningiliziwe Yokumboza Ingilazi ye-PVD ye-TGV No.3
Ukwenziwa kwensimbi kwe-TGV Glass PVD Coating kuhilela ukufaka izinto eziqhubayo ezindongeni zangaphakathi ze-vias ukuze kufezwe ukuxhumana kukagesi. Ukugeleza kwenqubo okuvamile kuhlanganisa:
1. Ukwakheka Kwemigodi Yengilazi Ye-TGV: Ukubhoboza nge-laser (ama-laser e-UV/CO₂), ukugoba okumanzi, noma ukugoba okomile kusetshenziswa ukudala ama-vias e-TGV, kulandelwe ukuhlanza.
2. Ukwelashwa Komphezulu: Kusetshenziswa ukwelashwa nge-plasma noma ngamakhemikhali ukuze kuthuthukiswe ukunamathelana phakathi kwengilazi kanye nesendlalelo sokwenza insimbi.
3. Ukufakwa Kwengqimba Yembewu: I-PVD (Ukufakwa Kwengqalasizinda Yomswakama Ongokwenyama) noma i-CVD (Ukufakwa Kwengqalasizinda Yomswakama Omakhemikhali) isetshenziselwa ukufaka ungqimba lwembewu yensimbi (isb., ithusi, i-titanium/ithusi, i-palladium) engilazini ngezindonga zemigodi.
4. Ukufaka i-Electroplating: Ithusi eliqhubayo lifakwa ongqimbeni lwembewu ngokusebenzisa i-electroplating ukuze kufezwe ukuxhumana okumelana kancane.
5. Ngemva kokwelashwa: Insimbi eningi iyasuswa, bese kwenziwa ukunyakaza kobuso ukuze kuthuthukiswe ukuthembeka.
Izinselele Zenqubo Ezinenombolo 4: Izinselele Zomshini Wokumboza I-TGV Glass Deep Hole
Naphezu kwamathemba ayo athembisayo, uMshini Wokumboza I-TGV Glass Deep Hole ubhekene nezinselele eziningana zobuchwepheshe:
1. Ukufana kwe-TGV Glass Hole Coating: I-Glass Deep Hole enezilinganiso eziphezulu (5:1 kuya ku-10:1) ivame ukuba nezinkinga zokunqwabelana kwensimbi emnyango kanye nokuntuleka kokugcwalisa okwanele phansi.
2. Ukufakwa Kwesendlalelo Sembewu: Ingilazi iyisivikelo, okwenza kube nzima ukufaka isendlalelo sembewu esithwala umoya esisezingeni eliphezulu odongeni oluhamba nge-via.
3. Ukulawula Ukucindezeleka: Umehluko kuma-coefficients okwandisa ukushisa kwensimbi nengilazi ungaholela ekugobeni noma ekuqhekekeni.
4. Ukunamathela Kwezingqimba Zokumboza Ezijulile Zengilazi: Ubuso obubushelelezi bengilazi bubangela ukunamathela kwensimbi okubuthakathaka, okudinga izinqubo zokwelapha ubuso ezilungiselelwe kahle.
5. Ukukhiqizwa Okukhulu Nokulawulwa Kwezindleko: Ukuthuthukisa ukusebenza kahle kwensimbi nokunciphisa izindleko kubalulekile ekuthengisweni kobuchwepheshe be-TGV.
Isixazululo Semishini Yokumboza Ingilazi ye-PVD ye-Zhenhua Vacuum No.5 – I-Horizontal Coating In-line Coater
Izinzuzo Zemishini:
1. Ubuchwepheshe obukhethekile bokumboza nge-Glass Through-Hole Metallization Coating
Ubuchwepheshe be-Glass Through-Hole Metallization Coating be-Zhenhua Vacuum bungakwazi ukusingatha i-Glass Through-Hole ngezilinganiso zobukhulu obufika ku-10:1, ngisho nasezimbotsheni ezincane ezincane njenge-30 microns.
2. Kungenziwa ngezifiso ngosayizi abahlukene
Isekela izingqimba zengilazi ezinobukhulu obuhlukahlukene, okuhlanganisa u-600×600mm, 510×515mm, noma ngaphezulu.
3. Ukuzivumelanisa Nezimo Kwenqubo
Iyahambisana nezinto ezisebenzisa ugesi noma ezisebenza kahle njenge-Cu, Ti, W, Ni, kanye ne-Pt, ihlangabezana nezidingo ezahlukahlukene zokusebenzisa ugesi kanye nokumelana nokugqwala.
4. Ukusebenza Okuzinzile Nokulungiswa Okulula
Ifakwe uhlelo lokulawula oluhlakaniphile lokulungisa amapharamitha ngokuzenzakalelayo kanye nokuqapha ngesikhathi sangempela ukufana kobukhulu befilimu. Umklamo we-modular uqinisekisa ukulungiswa okulula kanye nesikhathi esincishisiwe sokungasebenzi.
Ububanzi Bokusetshenziswa: Kufanelekela ukupakishwa okuthuthukisiwe kwe-TGV/TSV/TMV, ingafinyelela ukumbozwa kwengqimba yembewu embobeni ngesilinganiso sokujula kwembobo ≥ 10:1.
–Lesi sihloko sikhishwe yi-Umkhiqizi Womshini Wokumboza Ingilazi Ngezimbobo ze-TGVI-Zhenhua Vacuum
Isikhathi sokuthunyelwe: Mashi-07-2025