Isishwankathelo seTekhnoloji yokuCoating iGlasi ye-TGV yeNombolo 1
Ukwaleka kweGlasi yeTGV ngokusebenzisa imingxunya yiteknoloji entsha yokupakisha ye-microelectronic equka ukudala imingxunya edlulayo kwi-substrates zeglasi kunye nokwenza iindonga zazo zangaphakathi zibe yintsimbi ukuze kufezekiswe unxibelelwano lombane oluxineneyo. Xa kuthelekiswa ne-TSV yendabuko (Through Silicon Via) kunye ne-substrates zendalo, iglasi ye-TGV inika izibonelelo ezifana nokulahleka kwesignali ephantsi, ukubonakala okuphezulu, kunye nokuzinza okugqwesileyo kobushushu. Ezi mpawu zenza i-TGV ifaneleke kwizicelo zonxibelelwano lwe-5G, ukupakisha kwe-optoelectronic, ii-sensors ze-MEMS, nokunye.
Amathuba eMarike yeNombolo 2: Kutheni iGlasi yeTGV ifumana ingqwalasela?
Ngophuhliso olukhawulezileyo lonxibelelwano olusebenzisa amaxesha amaninzi, ukuhlanganiswa kwe-optoelectronic, kunye nobuchwepheshe obuphambili bokupakisha, imfuno yeglasi ye-TGV iyanda ngokuthe chu:
Unxibelelwano lwe-5G kunye ne-Millimeter-Wave: Iimpawu zeglasi ye-TGV ezinciphisa ukulahleka ziyenza ifaneleke kakhulu kwizixhobo ze-RF ezisebenzisa i-frequency ephezulu ezifana nee-antenna kunye nezihluzi.
Ukupakishwa kwe-Optoelectronic: Ukukhanya okuphezulu kweglasi kuluncedo kwizicelo ezifana ne-silicon photonics kunye ne-LiDAR.
Ukupakishwa kweSensor ye-MEMS: Iglasi ye-TGV ivumela uqhagamshelo oluphezulu, nto leyo ephucula ukwenziwa kwe-miniaturization kunye nokusebenza kwe-sensors.
Ukupakisha i-Semiconductor ePhambili: Ngokukhula kwetekhnoloji yeChiplet, ii-substrates zeglasi zeTGV zinamandla amakhulu ekupakisheni okuxineneyo.
Inkqubo eneenkcukacha zeNombolo 3 yeTGV Glass PVD Coating
Ukwenziwa kwesinyithi kwe-TGV Glass PVD Coating kubandakanya ukufaka izinto eziqhuba umbane kwiindonga zangaphakathi zee-vias ukuze kufezekiswe uqhagamshelo lombane. Indlela eqhelekileyo yokusebenza ibandakanya:
1. Ukwenziwa kweMingxunya yeGlasi yeTGV: Ukubhola ngeLaser (ii-laser ze-UV/CO₂), ukukrola okumanzi, okanye ukukrola okomileyo kusetyenziswa ukwenza ii-vias zeTGV, kulandele ukucoca.
2. Unyango Lomphezulu: Kusetyenziswa iplasma okanye unyango lweekhemikhali ukuphucula ukunamathelana phakathi kweglasi kunye nomaleko wesinyithi.
3. Ukubekwa kweLeya yeMbewu: I-PVD (Physical Vapor Deposition) okanye i-CVD (Chemical Vapor Deposition) isetyenziselwa ukufaka ileya yembewu yesinyithi (umz., ubhedu, i-titanium/ubhedu, i-palladium) kwiglasi ngeendonga zemingxunya.
4. Ukufakelwa nge-Electroplating: Ubhedu oluqhubayo lufakwa kumaleko wembewu ngokusebenzisa ukufakelwa nge-electroplating ukuze kufezekiswe uqhagamshelo oluncinci lokumelana.
5. Emva konyango: Isinyithi esigqithisileyo siyasuswa, kwaye kwenziwa ukuhanjiswa komphezulu ukuphucula ukuthembeka.
Imingeni yeNkqubo yeNombolo 4: Imingeni yoMatshini wokuCoating weGlasi yeTGV Deep Hole
Nangona amathuba ayo athembisayo, umatshini wokugquma i-TGV Glass Deep Hole Coating Machine ujongene nemingeni emininzi yobugcisa:
1. Ukufana kweTGV Glass Deep Hole Coating: IGlass Deep Hole enemilinganiselo ephezulu (5:1 ukuya kwi-10:1) idla ngokuba neengxaki zokuqokelelwa kwesinyithi kwindawo yokungena kunye nokungagcwalisi ngokwaneleyo ezantsi.
2. Ukubekwa kweLeya yeMbewu: Iglasi sisigqubuthelo, nto leyo eyenza kube nzima ukubeka ileya yembewu eqhubayo esemgangathweni ophezulu eludongeni.
3. Ulawulo loxinzelelo: Umahluko kwii-coefficients zokwandiswa kobushushu besinyithi neglasi unokukhokelela ekugobekeni okanye ekuqhekekeni.
4. Ukuncamatheliswa kweeLayers zeGlass Deep Hole coating: Umphezulu ogudileyo weglasi ubangela ukunamathela kwesinyithi okubuthathaka, nto leyo ebangela ukuba kubekho iinkqubo zokunyanga umphezulu ezilungelelanisiweyo.
5. Ukuveliswa kweMizimba kunye noLawulo lweendleko: Ukuphucula ukusebenza kakuhle kwesinyithi kunye nokunciphisa iindleko kubalulekile ekuthengisweni kwetekhnoloji ye-TGV.
Isisombululo seZixhobo zokuNxibelelanisa zeGlasi zePVD zeZhenhua zeNombolo 5 – I-Horizontal Coating In-line Coater
Iingenelo zezixhobo:
1. Itekhnoloji yokugquma i-Glass Through-Hole Metallization Coating ekhethekileyo
Itekhnoloji ye-Glass Through-Hole Metallization Coating ye-Zhenhua Vacuum inokusingatha i-Glass Through-Hole enemilinganiselo yobungakanani obufikelela kwi-10:1, nokuba ziindawo ezincinci ezingaphantsi kwe-30 microns.
2. Yenzelwe ubungakanani obahlukeneyo
Ixhasa ii-substrates zeglasi zobukhulu obahlukeneyo, kuquka i-600×600mm, 510×515mm, okanye ezinkulu.
3. Ukuguquguquka kwenkqubo
Iyahambelana nezixhobo zefilimu encinci eziqhuba umbane okanye ezisebenzayo ezifana neCu, Ti, W, Ni, kunye nePt, ihlangabezana neemfuno ezahlukeneyo zokusetyenziswa kombane kunye nokumelana nokugqwala.
4. Ukusebenza Okuzinzileyo Nokulungiswa Okulula
Ixhotyiswe ngenkqubo yokulawula ekrelekrele yokulungelelanisa iiparameter ngokuzenzekelayo kunye nokujonga ngexesha langempela ukufana kobukhulu befilimu. Uyilo lweModular luqinisekisa ukulungiswa okulula kunye nexesha lokungasebenzi elincitshisiweyo.
Ububanzi bokusetyenziswa: Ifanelekile kwiipakethe eziphambili ze-TGV/TSV/TMV, inokufikelela ekugqumeni kwembewu enomngxuma ophakathi ngomlinganiselo wobunzulu bemingxuma ≥ 10:1.
–Eli nqaku likhutshwe nguUmenzi womatshini wokugquma iglasi ngemingxunya ye-TGVI-Zhenhua Vacuum
Ixesha leposi: Matshi-07-2025