No.1 TGV Glass Through Hole Coating Technology Uhlolojikelele
I-TGV Glass Through Hole Coating ubuchwepheshe bokupakisha obusafufusa be-microelectronic obuhlanganisa ukudala izimbobo ku-substrate yengilazi kanye nokwenza insimbi izindonga zabo zangaphakathi ukuze kuzuzwe ukuxhumana kukagesi okuminyanisa kakhulu. Uma kuqhathaniswa ne-TSV yendabuko (Nge-Silicon Via) nama-substrates e-organic, ingilazi ye-TGV inikeza izinzuzo ezinjengokulahlekelwa kwesignali ephansi, ukukhanya okuphezulu, nokuzinza okuhle kakhulu okushisayo. Lezi zakhiwo zenza i-TGV ilungele izinhlelo zokusebenza ekuxhumaneni kwe-5G, ukupakishwa kwe-optoelectronic, izinzwa ze-MEMS, nokuningi.
No.2 Amathemba Emakethe: Kungani i-TGV Glass Ithola Ukunakwa?
Ngokuthuthuka okusheshayo kokuxhumana kwe-high-frequency, ukuhlanganiswa kwe-optoelectronic, kanye nobuchwepheshe bokupakisha obuthuthukile, isidingo sengilazi ye-TGV sikhula kancane kancane:
I-5G ne-Millimeter-Wave Communication: Izici ezilahlekelwa kancane zengilazi ye-TGV ziyenza ifaneleke kumadivayisi e-RF anemvamisa ephezulu njengama-antenna nezihlungi.
I-Optoelectronic Packaging: Ukucaca okuphezulu kwengilazi kunenzuzo ezinhlelweni ezifana ne-silicon photonics ne-LiDAR.
I-MEMS Sensor Packaging: Ingilazi ye-TGV inika amandla ukuxhumana okuminyanisa okuphezulu, ithuthukisa ukwenziwa kancane kanye nokusebenza kwezinzwa.
Ukupakisha Okuthuthukisiwe Kwe-Semiconductor: Ngokukhuphuka kobuchwepheshe be-Chiplet, ama-substrates engilazi e-TGV anamandla amakhulu ekupakishweni okuminyana kakhulu.
No.3 TGV Glass PVD Coating Inqubo enemininingwane
Ukwenziwa kwensimbi kwe-TGV Glass PVD Coating kuhilela ukufaka izinto ezisetshenziswayo ezindongeni zangaphakathi ze-vias ukuze kuzuzwe ukuxhumana kukagesi. Ukugeleza kwenqubo okujwayelekile kuhlanganisa:
1. I-TGV Glass Through Hole Formation: I-Laser drilling (ama-lasers we-UV/CO₂), i-etching emanzi, noma i- dry etching isetshenziselwa ukudala i-TGV vias, okulandelwa ukuhlanza.
2. Ukwelapha Okungaphezulu: I-Plasma noma ukwelashwa kwamakhemikhali kusetshenziswa ukuze kuthuthukiswe ukunamathela phakathi kwengilazi nongqimba lwe-metalization.
3. Ukubekwa Kwesendlalelo Sembewu: I-PVD (Physical Vapor Deposition) noma i-CVD (Chemical Vapor Deposition) isetshenziselwa ukufaka ungqimba lwembewu yensimbi (isb, ithusi, i-titanium/ithusi, i-palladium) engilazini ngokusebenzisa izindonga zembobo.
4. I-Electroplating: I-copper e-conductive ifakwa kungqimba lwembewu ngokusebenzisa i-electroplating ukuze kuzuzwe ukuxhumana okunokumelana okuphansi.
5. Ngemva kokwelashwa: Insimbi eyeqile iyasuswa, futhi i-surface passivation yenziwa ukuthuthukisa ukwethembeka.
No.4 Izinselele Zenqubo: Izinselele Zomshini Wokuhlanganisa we-TGV Glass Deep Hole
Naphezu kwamathemba ayo athembisayo, i-TGV Glass Deep Hole Coating Machine ibhekene nezinselelo zobuchwepheshe ezimbalwa:
1.I-Uniformity ye-TGV Glass Deep Hole Coating : I-Glass Deep Hole enezilinganiso eziphezulu (5:1 ukuya ku-10:1) ngokuvamile ihlushwa ukunqwabelana kwensimbi emnyango ngokungena kanye nokugcwaliswa okunganele phansi.
2. Ukubekwa Kwesendlalelo Sembewu: Ingilazi iyisivikelo, okwenza kube inselele ukufaka ungqimba lwembewu oluqhutshwayo lwekhwalithi ephezulu ezindongeni.
3. Ukulawula Ukucindezeleka: Umehluko kuma-coefficients wokunweba okushisayo kwensimbi nengilazi kungaholela ekuphikeni noma ekuqhekekeni.
4. Ukunamathela Kwezendlalelo Zokuhlanganisa I-Glass Deep Hole: Ingaphezulu elibushelelezi lengilazi liphumela ekunamatheleni kwensimbi okubuthakathaka, okudinga izinqubo zokwelashwa ezilungiselelwe phezulu.
5. Ukukhiqizwa Okuningi Nokulawulwa Kwezindleko: Ukuthuthukisa ukusebenza kahle kwe-metallization nokunciphisa izindleko kubalulekile ekuhwebeni kobuchwepheshe be-TGV.
No.5 Zhenhua Vacuum's TGV Glass PVD Coating Equipment Solution – Horizontal Coating In-line Coater
Izinzuzo zesisetshenziswa:
1. Ubuchwepheshe Be-Glass Exclusive Through-Hole Metallization Coating
Ubuchwepheshe be-Zhenhua Vacuum bobunikazi be-Glass Through-Hole Metallization Coating bungaphatha i-Glass Through-Hole nge-aspect ratios efika ku-10:1, ngisho nama-apertures amancane ama-microns angu-30.
2. I-Customizable for Different Sizes
Isekela ama-glass substrates anobukhulu obuhlukahlukene, kufaka phakathi 600×600mm, 510×515mm, noma ngaphezulu.
3. Ukuguquguquka Kwenqubo
Ihambisana nezinto ezisebenzayo noma ezisebenzayo zefilimu elincanyana njenge-Cu, Ti, W, Ni, kanye ne-Pt, ihlangabezana nezidingo ezihlukene zohlelo lokusebenza lwe-conductivity nokumelana nokugqwala.
4. Ukusebenza Okuzinzile kanye Nokugcinwa Okulula
Ifakwe isistimu yokulawula ehlakaniphile yokulungiswa kwepharamitha okuzenzakalelayo kanye nokuqapha kwesikhathi sangempela sokufana kwefilimu. Idizayini ye-modular iqinisekisa ukugcinwa okulula nokunciphisa isikhathi sokuphumula.
Ububanzi bohlelo lokusebenza: Ifanele ukupakishwa okuthuthukile kwe-TGV/TSV/TMV, ingafinyelela ungqimba lwembewu ngembobo enesilinganiso sokujula kwembobo ≥ 10:1.
-Le ndatshana ikhishwe nguI-TGV Glass Through Hole Coating Machine ManufacturerI-Vacuum ye-Zhenhua
Isikhathi sokuthumela: Mar-07-2025