Ukuphalaza kwe-magnetron okusebenzayo kusho ukuthi igesi esabelayo inikezwa ukuze isabele nezinhlayiya ezichithekile enkambisweni yokuphalaza ukuze ikhiqize ifilimu ehlanganisiwe. Ingahlinzeka ngegesi esabelayo ukuze isabele nethagethi ye-compound echithekayo ngesikhathi esifanayo, futhi ingahlinzeka ngegesi esabelayo ukuze isabele nethagethi yensimbi ethelayo noma ye-alloy ngesikhathi esifanayo ukuze ilungiselele ifilimu ehlanganisiwe enesilinganiso samakhemikhali esinikeziwe. Izici zokuphalaza kwe-magnetron okusebenzayo ukulungiselela amafilimu ehlanganisiwe yilezi:
(1) Izinto eziqondiwe ezisetshenziselwa ukusputtering kwe-magnetron esabelayo (ithagethi yento eyodwa noma ithagethi yezinto eziningi) kanye namagesi okusabela kulula ukuthola ubumsulwa obuphezulu, okuhambisana nokulungiswa kwamafilimu e-compound ahlanzekile kakhulu.
(2) Ekuqhumeni kwe-magnetron okusebenzayo, ngokulungisa amapharamitha enqubo yokufaka, isilinganiso samakhemikhali noma isilinganiso esingesona samakhemikhali samafilimu ahlanganisiwe singalungiswa, ukuze kufezwe injongo yokulawula izici zefilimu ngokulungisa ukwakheka kwefilimu.
(3) Izinga lokushisa le-substrate ngokuvamile aliphezulu kakhulu ngesikhathi senqubo yokufaka i-reactive magnetron sputtering, futhi inqubo yokwakha ifilimu ngokuvamile ayidingi ukuthi i-substrate ishiswe kuze kufike emazingeni okushisa aphezulu kakhulu, ngakho-ke kunemikhawulo embalwa ezintweni ze-substrate.
(4) Ukusputtering kwe-magnetron esebenzayo kufanelekile ekulungiseleleni amafilimu amancane alinganayo endaweni enkulu, futhi kungafeza ukukhiqizwa kwezimboni ngomkhiqizo waminyaka yonke wamamitha-skwele ayisigidi wokumboza kusuka emshinini owodwa. Ezimweni eziningi, uhlobo lwefilimu lungashintshwa ngokushintsha nje isilinganiso segesi esabelayo kuya kugesi engasebenzi ngesikhathi sokusputtering. Isibonelo, ifilimu ingashintshwa kusuka ensimbini iye kwi-semiconductor noma engeyona eyensimbi.
——Lesi sihloko sinayoumenzi womshini wokumboza nge-vacuumI-Guangdong Zhenhua ikhishwe
Isikhathi sokuthunyelwe: Agasti-31-2023

