No.1 TGV Glass ngokusebenzisa umngxuma Coating Technology Overview
Iglasi ye-TGV ngokusebenzisa i-Hole Coating Bubuchwephesha bokupakisha obusakhulayo be-microelectronic obubandakanya ukudala imingxunya kwiinxalenye zeglasi kunye nokudibanisa iindonga zabo zangaphakathi ukuphumeza uqhagamshelo lombane oluxinana kakhulu. Xa kuthelekiswa ne-TSV yemveli (Nge-Silicon Via) kunye ne-organic substrates, iglasi ye-TGV ibonelela ngezinto eziluncedo ezinjengokulahleka komqondiso ophantsi, ukukhanya okuphezulu, kunye nokuzinza okuhle kakhulu kwe-thermal. Ezi zakhiwo zenza i-TGV ifaneleke kwizicelo kunxibelelwano lwe-5G, ukupakishwa kwe-optoelectronic, i-MEMS sensors, kunye nokunye.
No.2 Amathuba eMarike: Kutheni i-TGV Glass ifumana ingqalelo?
Ngophuhliso olukhawulezayo lonxibelelwano lwe-high-frequency, indibaniselwano ye-optoelectronic, kunye nobuchwepheshe bokupakisha obuphambili, imfuno yeglasi ye-TGV ikhula ngokuthe ngcembe:
I-5G kunye ne-Millimeter-Wave Communication: Iimpawu eziphantsi zelahleko zeglasi ye-TGV zenza ukuba zilungele izixhobo ze-RF eziphezulu ezifana ne-eriyali kunye nezihlungi.
Ukupakishwa kwe-Optoelectronic: Ukucaca okuphezulu kweglasi kunenzuzo kwizicelo ezifana ne-silicon photonics kunye ne-LiDAR.
I-MEMS Sensor Packaging: Iglasi ye-TGV yenza uxhulumaniso oluphezulu, luphucule i-miniaturization kunye nokusebenza kweenzwa.
Ukupakishwa kweSemiconductor ekwinqanaba eliphezulu: Ngokunyuka kwetekhnoloji ye-Chiplet, ii-substrates zeglasi ze-TGV zibambe amandla amakhulu ekupakishweni koxinaniso oluphezulu.
No.3 TGV Glass PVD Coating Inkqubo eneenkcukacha
I-metallization ye-TGV Glass PVD Coating ibandakanya ukubeka izinto zokuqhuba kwiindonga zangaphakathi ze-vias ukuphumeza uqhagamshelo lombane. Inkqubo eqhelekileyo yokuhamba ibandakanya:
1. I-Glass ye-TGV ngokusebenzisa i-Hole Formation: I-Laser drilling (i-UV / CO₂ lasers), i-etching emanzi, okanye i-etching eyomileyo isetyenziselwa ukudala i-TGV vias, ilandelwa ngokucoca.
2. Unyango lwe-Surface: I-Plasma okanye unyango lwekhemikhali lusetyenziselwa ukuphucula ukunamathela phakathi kweglasi kunye ne-metallization layer.
3. Ukubekwa koMaleko wembewu: I-PVD (i-Physical Vapor Deposition) okanye i-CVD (i-Chemical Vapor Deposition) isetyenziselwa ukufaka umaleko wembewu yesinyithi (umzekelo, ubhedu, i-titanium/ubhedu, i-palladium) kwiglasi ngokusebenzisa iindonga zemingxuma.
4. I-Electroplating: Ubhedu oluqhubayo lufakwe kwi-seed layer ngokusebenzisa i-electroplating ukuphumeza ukudityaniswa kwe-low-resistance interconnections.
5. Emva kokunyanga: Isinyithi esigqithisileyo sisusiwe, kwaye i-surface passivation yenziwa ukuphucula ukuthembeka.
No.4 Inkqubo imingeni: Imingeni ye-TGV Glass Deep Hole Coating Machine
Ngaphandle kwamathemba ayo athembisayo, iTGV Glass Deep Hole Coating Machine ijongene nemingeni emininzi yobugcisa:
I-1.I-Uniformity ye-TGV ye-Glass ye-Deep Hole Coating : I-Glass Deep Hole ene-aspect ratios ephezulu (5: 1 ukuya kwi-10: 1) ihlala ihlupheka ngenxa yokuqokelela isinyithi ekungeneni ngokungena kunye nokuzaliswa okunganeleyo phantsi.
2. I-Seed Layer Deposition: Iglasi sisigqumatheli, nto leyo eyenza kube nzima ukufaka umaleko wembewu okumgangatho ophezulu kwiindonga.
3. Ukulawula uxinzelelo: Ukwahluka kwi-coefficients yokwandiswa kwe-thermal yentsimbi kunye neglasi kunokukhokelela ekugqithiseni okanye ekuqhekekeni.
4. Ukubambelela kwi-Glass Deep Hole Coating Layers: Umphezulu ogudileyo weglasi uphumela ekunamatheleni kwentsimbi ebuthathaka, efuna iinkqubo zonyango eziphuculweyo.
5. Ukuveliswa kweMisa kunye noLawulo lweNdleko: Ukuphucula ukusebenza kakuhle kwe-metallization kunye nokunciphisa iindleko zibalulekile ekuthengiseni iteknoloji ye-TGV.
No.5 iZhenhua Vacuum's TGV Glass PVD isiXhobo seSiXhobo sokuTyala – iCoater eHorizontal in-line
Izixhobo eziluncedo:
1. I-Glass eKhethekileyo nge-Hole Metallization Coating technology
Itekhnoloji ye-Zhenhua Vacuum yomnini weGlass nge-Hole Metallization Coating iyakwazi ukuphatha iGlass through-Hole enomlinganiselo wokuya kuthi ga kwi-10:1, nakwimingxuma emincinci emalunga ne-30 microns.
2. Customizable for ezahlukeneyo Ubungakanani
Ixhasa ii-substrates zeglasi ezinobungakanani obahlukeneyo, kubandakanya 600×600mm, 510×515mm, okanye ngaphezulu.
3. Inkqubo yokuguquguquka
Iyahambelana nezixhobo zefilimu eziqhubayo okanye ezisebenzayo ezifana neCu, Ti, W, Ni, kunye nePt, ukuhlangabezana neemfuno ezahlukeneyo zesicelo sokuqhuba kunye nokumelana nokubola.
4. Ukusebenza okuZinzile kunye noLondolozo olulula
Ixhotyiswe ngenkqubo yokulawula ekrelekrele yohlengahlengiso lweparameter oluzenzekelayo kunye nokujongwa kwexesha lokwenyani lokufana kobunzima befilimu. Uyilo lwemodyuli luqinisekisa ukugcinwa lula kunye nokunciphisa ixesha lokuphumla.
Umda weSicelo: Ifanelekile kwi-TGV/TSV/TMV yokupakisha ephucukileyo, inokufikelela ngomngxuma wembewu umaleko wokugquma ngomlinganiselo wobunzulu bomngxuma ≥ 10:1.
–Eli nqaku likhutshwa nguIglasi ye-TGV Ngokusebenzisa uMenzi woMashini wokuTyala umngxumaIvacuum yaseZhenhua
Ixesha lokuposa: Mar-07-2025