No.1 TGV Glass Ka Hole Coating Technology Overview
Khalase ea TGV ka Ho roala Hole ke thekenoloji e ntseng e tsoela pele ea ho paka ka li-microelectronic e kenyelletsang ho theha masoba ka har'a li-substrates tsa khalase le ho tiisa mabota a tsona a ka hare ho fihlela likhokahano tsa motlakase tse matla haholo. Ha ho bapisoa le TSV ea setso (Ka Silicon Via) le li-substrates tsa organic, khalase ea TGV e fana ka melemo e kang tahlehelo ea matšoao a tlase, pepeneneng e phahameng, le botsitso bo botle ba mocheso. Thepa ena e etsa hore TGV e loketse lits'ebetso tsa puisano ea 5G, packaging ea optoelectronic, li-sensor tsa MEMS, le tse ling.
No.2 Melemo ea 'Maraka: Ke Hobane'ng ha TGV Glass e Fumana Tlhokomelo?
Ka nts'etsopele e potlakileng ea puisano ea maqhubu a holimo, kopanyo ea optoelectronic, le mahlale a tsoetseng pele a ho paka, tlhoko ea khalase ea TGV e ntse e eketseha butle-butle:
Puisano ea 5G le Millimeter-Wave: Litšobotsi tsa tahlehelo tse tlase tsa khalase ea TGV li etsa hore e be e loketseng lisebelisoa tse phahameng tsa RF tse kang li-antenna le li-filters.
Packaging ea Optoelectronic: Ponaletso e phahameng ea khalase e molemo bakeng sa lits'ebetso tse kang silicon photonics le LiDAR.
MEMS Sensor Packaging: Khalase ea TGV e thusa ho hokahanya ha methapo e phahameng, ho ntlafatsa miniaturization le ts'ebetso ea li-sensor.
Packaging e tsoetseng pele ea Semiconductor: Ka ho phahama ha thekenoloji ea Chiplet, likaroloana tsa khalase tsa TGV li na le monyetla o moholo oa ho paka ka bongata bo boholo.
No.3 TGV Glass PVD Coating Detailed Process
Metallization ea TGV Glass PVD Coating e kenyelletsa ho kenya lisebelisoa tse tsamaisang mabota a kahare a li-vias ho fihlela likhokahano tsa motlakase. Mokhoa o tloaelehileng oa ho phalla o kenyelletsa:
1. TGV Glass Through Hole Formation: Ho phunya Laser (UV/CO₂ lasers), etching e metsi, kapa etching e omeletseng e sebelisetsoa ho etsa TGV vias, e lateloa ke ho hloekisa.
2. Phekolo ea Bokaholimo: Phekolo ea plasma kapa ea lik'hemik'hale e sebelisoa ho matlafatsa ho khomarela pakeng tsa khalase le lera la metallization.
3. Peo Layer Deposition: PVD (Physical Vapor Deposition) kapa CVD (Chemical Vapor Deposition) e sebelisoa ho beha lera la peo ea tšepe (mohlala, koporo, titanium/copper, palladium) holim'a khalase ka har'a mabota a lesoba.
4. Electroplating: Koporo e tsamaisang e kenngoa holim'a lera la peo ka electroplating ho finyella li-interconnections tse fokolang.
5. Ka mor'a ho phekoloa: tšepe e feteletseng e tlosoa, 'me ho etsoa ka holimo ho etsoa ho ntlafatsa ho tšepahala.
No.4 Mathata a Ts'ebetso: Mathata a TGV Glass Deep Hole Coating Machine
Leha ho na le tebello e ts'episang, TGV Glass Deep Hole Coating Machine e tobane le liphephetso tse 'maloa tsa tekheniki:
1.Uniformity ea TGV Glass Deep Hole Coating : Glass Deep Hole e nang le likarolo tse phahameng (5: 1 ho 10: 1) hangata e na le bothata ba ho bokella tšepe monyako le ho tlatsa ho sa lekaneng ka tlase.
2. Peo Layer Deposition: Glass ke insulator, e leng se etsang hore ho be thata ho beha peo ea boleng bo holimo leboteng ka tsela.
3. Ho Laola Khatello ea Maikutlo: Ho se tšoane ha li-coefficients tsa ho atolosa mocheso oa tšepe le khalase ho ka lebisa ho warping kapa ho senya.
4. Ho khomarela ha Glass Deep Hole Coating Layers: Sebaka se boreleli sa khalase se fella ka ho khomarela tšepe e fokolang, e hlokang mekhoa e ntlafetseng ea phekolo ea holim'a metsi.
5. Tlhahiso ea Boima le Taolo ea Litšenyehelo: Ho ntlafatsa katleho ea metallization le ho fokotsa litšenyehelo ke tsa bohlokoa bakeng sa khoebo ea theknoloji ea TGV.
No.5 Zhenhua Vacuum's TGV Glass PVD Coating Equipment Solution – Horizontal Coating In-line Coater
Melemo ea Lisebelisoa:
1. Theknoloji e ikhethang ea Glass Through-Hole Metallization Coating
Theknoloji e sebetsang ea Glass Through-Hole Metallization Coating ea Zhenhua Vacuum e khona ho sebetsana le Glass Through-Hole e nang le likarolo tse fihlang ho 10:1, esita le liphahlo tse nyane tse ka bang 30 microns.
2. Customizable bakeng sa Sizes fapaneng
E ts'ehetsa likarolo tsa khalase tsa boholo bo fapaneng, ho kenyeletsoa 600×600mm, 510×515mm, kapa ho feta.
3. Mokhoa oa ho Fetolana
E lumellana le lisebelisoa tsa filimi tse tšesaane tse tsamaisang kapa tse sebetsang tse kang Cu, Ti, W, Ni, le Pt, tse kopanang le litlhoko tse fapaneng tsa kopo bakeng sa conductivity le ho hanyetsa kutu.
4. Ts'ebetso e tsitsitseng le Tlhokomelo e Bonolo
E na le sistimi e bohlale ea taolo bakeng sa tokiso ea paramethara ea othomathike le tlhokomelo ea nako ea 'nete ea ho lumellana ha botenya ba filimi. Moralo oa modular o netefatsa tlhokomelo e bonolo le ho fokotsa nako.
Sebaka sa Kopo: E loketse liphutheloana tse tsoetseng pele tsa TGV/TSV/TMV, e ka fihlella ka sekoting sa lera la peo e nang le sekhahla sa botebo ba lesoba ≥ 10:1.
-Sengoliloeng sena se lokolloa keTGV Glass Ka Hole Coating Machine ManufacturerPhula ea Zhenhua
Nako ea poso: Mar-07-2025