No.1 TGV iav Los Ntawm Qhov Txheej Txheej Tshuab Txheej Txheem
TGV iav los ntawm qhov txheej yog ib qho tshiab microelectronic ntim tshuab uas koom nrog tsim los ntawm qhov hauv cov iav substrates thiab metallizing lawv cov phab ntsa sab hauv kom ua tiav high-density hluav taws xob sib cuam tshuam. Piv nrog rau TSV tsoos (Los ntawm Silicon Via) thiab cov organic substrates, TGV iav muaj qhov zoo xws li cov teeb liab poob qis, siab transparency, thiab zoo thermal stability. Cov khoom no ua rau TGV haum rau kev siv hauv 5G kev sib txuas lus, ntim optoelectronic, MEMS sensors, thiab lwm yam.
No.2 Market Prospects: Vim li cas TGV iav tau txais kev saib xyuas?
Nrog rau txoj kev loj hlob sai ntawm kev sib txuas lus siab, kev sib koom ua ke ntawm optoelectronic, thiab cov txheej txheem ntim khoom siab heev, qhov kev thov rau TGV iav yog tsis tu ncua:
5G thiab Millimeter-Wave Kev Sib Txuas Lus: Cov yam ntxwv qis ntawm TGV iav ua rau nws zoo tagnrho rau cov khoom siv RF zaus xws li kav hlau txais xov thiab cov ntxaij lim dej.
Optoelectronic Ntim: Lub siab pob tshab ntawm iav yog qhov zoo rau kev siv xws li silicon photonics thiab LiDAR.
MEMS Sensor Ntim: TGV iav ua kom muaj kev sib txuas siab ceev, txhim khu kev ua haujlwm me me thiab kev ua haujlwm ntawm cov sensors.
Advanced Semiconductor Ntim: Nrog kev nce ntawm Chiplet thev naus laus zis, TGV iav substrates tuav lub peev xwm tseem ceeb hauv cov ntim ntim siab.
No.3 TGV iav PVD txheej txheej txheej txheem
Lub metallization ntawm TGV iav PVD txheej yuav tso cov khoom siv hluav taws xob rau ntawm phab ntsa sab hauv ntawm lub vias kom ua tiav kev sib txuas hluav taws xob. Cov txheej txheem nquag muaj xws li:
1. TGV iav los ntawm qhov tsim: Laser drilling (UV / CO₂ lasers), ntub etching, los yog qhuav etching yog siv los tsim TGV vias, ua raws li kev ntxuav.
2. Kev kho deg: Kev kho ntshav los yog tshuaj lom neeg yog siv los txhim kho qhov adhesion ntawm iav thiab txheej metallization.
3. Seed Layer Deposition: PVD (Physical Vapor Deposition) los yog CVD (Chemical Vapor Deposition) yog siv los tso cov txheej txheej hlau (xws li tooj liab, titanium / tooj liab, palladium) rau ntawm iav los ntawm lub qhov phab ntsa.
4. Electroplating: Conductive tooj liab yog tso rau ntawm cov noob txheej los ntawm electroplating kom ua tiav cov kev sib tshuam tsis tshua muaj siab.
5. Tom qab kev kho mob: Cov hlau ntau dhau raug tshem tawm, thiab kev ua pa ntawm qhov chaw ua haujlwm los txhim kho kev ntseeg tau.
No.4 Txheej Txheem Kev Sib Tw: Cov Kev Sib Tw ntawm TGV iav Deep Qhov Txheej Tshuab
Txawm hais tias nws qhov kev cia siab zoo, TGV iav Deep Qhov Txheej Tshuab ntsib ntau yam kev sib tw:
1.Uniformity ntawm TGV iav Deep Qhov Txheej: iav qhov tob nrog qhov sib piv siab (5: 1 txog 10: 1) feem ntau raug kev txom nyem los ntawm hlau tsub zuj zuj ntawm qhov nkag thiab tsis txaus sau rau hauv qab.
2. Noob Layer Deposition: iav yog ib qho insulator, ua rau nws nyuaj rau tso ib tug zoo-zoo conductive noob txheej rau ntawm phab ntsa.
3. Kev tswj kev ntxhov siab: Qhov sib txawv ntawm thermal expansion coefficients ntawm hlau thiab iav tuaj yeem ua rau warping lossis tawg.
4. Adhesion of Glass Deep Hole Txheej Txheej: Lub ntsej muag du ntawm iav ua rau cov hlau tsis muaj zog adhesion, yuav tsum tau ua kom zoo rau kev kho deg txheej txheem.
5. Kev Tsim Khoom Loj thiab Kev Tswj Tus Nqi: Txhim kho metallization efficiency thiab txo cov nqi yog qhov tseem ceeb rau kev lag luam ntawm TGV thev naus laus zis.
No.5 Zhenhua Nqus Tsev TGV iav PVD Txheej Khoom Siv Tshuaj - Kab rov tav txheej In-line Coater
Cov Khoom Siv Khoom Zoo:
1. Tshwj xeeb iav hla-qhov Metallization txheej tshuab
Zhenhua Lub Tshuab Nqus Tsev Cov Khoom Siv Hluav Taws Xob Los Ntawm Lub Qhov Metallization Txheej thev naus laus zis tuaj yeem tuav iav hla-qhov nrog qhov sib piv txog li 10: 1, txawm tias me me apertures me me li 30 microns.
2. Customizable rau ntau qhov sib txawv
Txhawb iav substrates ntawm ntau qhov ntau thiab tsawg, suav nrog 600 × 600mm, 510 × 515mm, lossis loj dua.
3. Txheej Txheem Yooj Yim
Tau tshaj cov khoom siv hluav taws xob lossis ua haujlwm nyias-zaj duab xis xws li Cu, Ti, W, Ni, thiab Pt, ua tau raws li cov ntawv thov sib txawv rau kev siv hluav taws xob thiab kev tiv thaiv corrosion.
4. Kev ua haujlwm ruaj khov thiab kev saib xyuas yooj yim
Nruab nrog lub ntse tswj qhov system rau kev hloov pauv tsis siv neeg thiab lub sijhawm saib xyuas cov yeeb yaj kiab thickness uniformity. Modular tsim kom yooj yim txij nkawm thiab txo downtime.
Daim ntawv thov Scope: Haum rau TGV / TSV / TMV siab ntim ntim, nws tuaj yeem ua tiav los ntawm lub qhov txheej txheej txheej nrog qhov qhov tob piv ≥ 10: 1.
– Zaj lus no yog tso tawm los ntawmTGV iav Los Ntawm Qhov Txheej Tshuab Chaw Tsim TshuajZhenhua Vacuum
Post lub sij hawm: Mar-07-2025