No.1 TGV Glass Through Hole Coating Technology Overview
Panianiani TGV ma o ka uhi puka he ʻenehana hoʻopili microelectronic e puka mai ana e pili ana i ka hana ʻana i nā lua i loko o nā pani aniani a me ka hoʻoheheʻe ʻana i ko lākou mau paia i loko e hoʻokō i nā pilina uila kiʻekiʻe. Hoʻohālikelike ʻia me TSV kuʻuna (Ma o Silicon Via) a me nā substrates organik, hāʻawi ke aniani TGV i nā mea maikaʻi e like me ka haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa, ʻikea kiʻekiʻe, a me ke kūpaʻa wela maikaʻi loa. Hoʻohana kēia mau waiwai iā TGV i kūpono no nā noi ma ke kamaʻilio 5G, optoelectronic packaging, MEMS sensors, a me nā mea hou aku.
No.2 Market Prospects: No ke aha e loaʻa ai ka manaʻo o TGV Glass?
Me ka hoʻomohala wikiwiki ʻana o ke kamaʻilio kiʻekiʻe, ka hoʻohui ʻana optoelectronic, a me nā ʻenehana hoʻopihapiha kiʻekiʻe, ke piʻi mau nei ka noi no ke aniani TGV:
5G a me Millimeter-Wave Communication: ʻO nā hiʻohiʻona haʻahaʻa haʻahaʻa o ke aniani TGV e kūpono ia no nā polokalamu RF kiʻekiʻe e like me nā antennas a me nā kānana.
Optoelectronic Packaging: ʻO ke aniani kiʻekiʻe o ke aniani he mea maikaʻi no nā noi e like me nā kiʻi kiʻi silika a me LiDAR.
MEMS Sensor Packaging: Hiki i ke aniani TGV ke hoʻopili i nā pilina kiʻekiʻe, hoʻonui i ka miniaturization a me ka hana o nā mea ʻike.
Advanced Semiconductor Packaging: Me ka piʻi ʻana o ka ʻenehana Chiplet, paʻa nā substrate aniani TGV i ka mana koʻikoʻi i loko o ka ʻeke kiʻekiʻe.
No.3 TGV Glass PVD Coating Detailed Process
ʻO ka metallization o TGV Glass PVD Coating e pili ana i ka waiho ʻana i nā mea conductive ma nā paia o loko o nā vias e hoʻokō i nā pilina uila. Aia i loko o ke kaʻina hana maʻamau:
1. TGV Glass Through Hole Formation: Hoʻohana ʻia ka ʻeli ʻana laser (UV/CO₂ lasers), etching wet, a i ʻole etching maloʻo e hana i TGV vias, a ma hope o ka hoʻomaʻemaʻe.
2. Lapaʻau ʻili: Hoʻohana ʻia ka Plasma a i ʻole ka lāʻau lapaʻau e hoʻomaikaʻi i ka pili ʻana ma waena o ke aniani a me ka papa metallization.
3. Hoʻomoe ʻia ka Layer Seed: PVD (Physical Vapor Deposition) a i ʻole CVD (Chemical Vapor Deposition) i hoʻohana ʻia e waiho i kahi papa hua metala (e laʻa, keleawe, titanium/copper, palladium) ma ke aniani ma nā paia puka.
4. Electroplating: Hoʻokomo ʻia ke keleawe conductive ma ka papa hua ma o ka electroplating e hoʻokō i nā interconnections haʻahaʻa.
5. Ma hope o ka lapaʻau ʻana: Wehe ʻia ka metala keu, a hana ʻia ka passivation ili e hoʻomaikaʻi i ka hilinaʻi.
No.4 Kaʻina Kaʻina Paʻakikī: Nā Luʻi o TGV Glass Deep Hole Coating Machine
ʻOiai ʻo kāna mau manaʻo hoʻohiki, ke alo nei ʻo TGV Glass Deep Hole Coating Machine i nā pilikia ʻenehana:
1.Uniformity o ka TGV Glass Deep Hole Coating : Glass Deep Hole me ke kiʻekiʻe hiʻohiʻona lākiō (5: 1 i 10: 1) pinepine pilikia mai metala accumulation ma ke ala komo a me ka lawa ole ka hoopiha ana ma ka lalo.
2. Hoʻomoe ʻana i nā hua: He insulator ke aniani, he mea paʻakikī ke waiho ʻana i kahi papa hua conductive kiʻekiʻe ma nā paia.
3. Ka Mana Manawa: ʻO nā ʻokoʻa o ka hoʻonui wela o ka metala a me ke aniani hiki ke alakaʻi i ka warping a i ʻole ka pohā.
4. Adhesion o Glass Deep Hole coating Layers: ʻO ka maʻemaʻe o ke aniani ka hopena i ka nawaliwali o ka metala adhesion, e koi ana i nā kaʻina hana lapaʻau optimized.
5. Hana Nui a me ka Mana Kūʻai: ʻO ka hoʻomaikaʻi ʻana i ka pono metala a me ka hōʻemi ʻana i nā kumukūʻai he mea koʻikoʻi ia no ka hoʻolaha ʻana o ka ʻenehana TGV.
No.5 Zhenhua Vacuum's TGV Glass PVD Coating Equipment Solution – Horizontal Coating In-line Coater
Nā Pono Mea Hana:
1. ʻenehana hoʻoheheʻe ʻia ke aniani ma o ka lua
Hiki iā Zhenhua Vacuum's Glass Through-Hole Metallization Coating Technology ke lawelawe i ka Glass Through-Hole me nā hi'ohi'ona a hiki i ka 10:1, no nā puka li'ili'i e like me 30 microns.
2. Hoʻopilikino ʻia no nā ʻano nui like ʻole
Kākoʻo i nā substrate aniani o nā nui like ʻole, me 600 × 600mm, 510 × 515mm, a i ʻole ka nui.
3. Hoʻololi i ke kaʻina hana
Hoʻohālikelike me nā mea hana kiʻiʻoniʻoni lahilahi e like me Cu, Ti, W, Ni, a me Pt, e hālāwai ana i nā koi noi like ʻole no ka conductivity a me ka pale ʻana i ka corrosion.
4. Hana Paʻa a mālama maʻalahi
Hoʻolako ʻia me kahi ʻōnaehana hoʻokele naʻauao no ka hoʻoponopono ʻana i nā ʻāpana a me ka nānā ʻana i ka manawa maoli o ka like ʻana o ka mānoanoa kiʻiʻoniʻoni. ʻO ka hoʻolālā modular e hōʻoia i ka mālama maʻalahi a hoʻemi i ka downtime.
Ka Papa Hoʻohana: He kūpono no ka TGV/TSV/TMV hoʻopili holomua, hiki iā ia ke hoʻokō i ka uhi ʻana o nā hua ma waena o ka lua me ka hohonu o ka lua ≥ 10:1.
-Ua hoʻokuʻu ʻia kēia ʻatikala eʻO ke aniani ʻo TGV ma o ka mīkini hoʻopaʻa ʻana i ka pukaZhenhua Vacuum
Ka manawa hoʻouna: Mar-07-2025