I-tungsten filament ishiselwa ezingeni lokushisa eliphezulu elikhipha ama-electron ashisayo ukuze likhiphe umfudlana we-electron wokuminyana okuphezulu, futhi ngesikhathi esifanayo i-electrode esheshayo isethelwe ukusheshisa ama-electron ashisayo ibe umfudlana we-electron wamandla aphezulu. High-density, high-energy electron flow kungaba ngaphezulu chlorine ionization, more metal ifilimu ungqimba ama-athomu ionized ukuze uthole ion chloride ngaphezulu ukuze kuthuthukiswe izinga sputtering, ngaleyo ndlela andise izinga deposition: kungaba ionization metal more ukuthuthukisa izinga ionization metal, kuvumelana ukusabela deposition of the ifilimu kwakwakhe; ama-ion wengqimba yefilimu yensimbi ukuze afinyelele ucezu lokusebenza ukuze kuthuthukiswe ukuminyana kwamanje kwesiqephu somsebenzi, ngaleyo ndlela kukhuphule izinga lokubeka.
Ku-magnetron sputtering coating eqinile, Khulisa ukuminyana kwamanje kanye nenhlangano yefilimu ye-workpiece ngaphambili nangemuva kwe-cathodizing eshisayo. I-TiSiCN ngaphambi kokwengezwa kwe-hot cathode, ukuminyana kwamanje ku-workpiece yi-0.2mA / mm kuphela, ngemva kokunyuka kwe-hot cathode ku-4.9mA / mm2, okulingana nokwanda kwezikhathi ezingu-24 noma ngaphezulu, futhi inhlangano yefilimu iminyene kakhulu. Kungabonakala ukuthi ku-magnetron sputtering coating technology, ukungezwa kwe-cathode eshisayo kuphumelela kakhulu ekuthuthukiseni izinga lokubeka i-magnetron sputtering kanye nomsebenzi wezinhlayiya zefilimu. Lobu buchwepheshe bungathuthukisa kakhulu impilo yama-turbine blades, ama-punch pump odaka, nezingxenye zokugaya.
-Le ndatshana ikhishwe nguumenzi womshini we-vacuum coatingI-Guangdong Zhenhua
Isikhathi sokuthumela: Oct-11-2023