(4) Target material. Target material is the key to sputtering coating, in general, as long as the target material meets the requirements, and strict control of the process parameters can be required to get the film layer. Impurities in the target material and surface oxides and other impure substances are an important source of film contamination, so in order to get a high purity layer, in addition to the use of high purity target material, in each sputtering should be the first target for pre-sputtering in order to clean the surface of the target, to remove the target surface of the oxide layer.
(5) Background vacuum. The level of the background vacuum directly reflects the amount of residual gas in the system, and residual gas is also an important source of contamination of the film layer, so the background vacuum should be improved as much as possible. On the pollution of another problem is the oil diffusion pump back to the oil, resulting in carbon doping in the membrane, the more stringent requirements of the membrane should take appropriate measures or the use of oil-free high-vacuum pumping system.
(6) sputtering air pressure. The working air pressure directly affects the deposition rate of the membrane.
In addition, due to the different sputtering devices in the electric field, atmosphere, target material, substrate temperature and geometric structure of the parameters of the interaction between the membrane to produce the requirements, it is necessary to do experiments on the parameters of the process, from which the best process conditions.
–This article is released by vacuum coating machine manufacturer Guangdong Zhenhua
Post time: Jan-05-2024