Cov txheej txheem nqus tsev feem ntau suav nrog cov pa nqus tsev, cov txheej txheem sputtering thiab cov txheej txheem ion, txhua yam no yog siv los tso ntau yam hlau thiab cov yeeb yaj kiab tsis yog hlau rau ntawm qhov chaw ntawm cov khoom yas los ntawm kev distillation lossis sputtering hauv qab cov xwm txheej nqus tsev, uas tuaj yeem tau txais cov txheej txheem nyias nyias nrog qhov zoo tshaj plaws ntawm kev nplaum sai, tab sis tus nqi kuj siab dua, thiab cov hom hlau uas tuaj yeem ua haujlwm tsawg dua, thiab feem ntau yog siv rau kev ua haujlwm ntawm cov khoom qib siab dua.
Kev siv lub tshuab nqus tsev vacuum deposition yog ib txoj kev ua kom cov hlau sov hauv qab lub tshuab nqus tsev siab, ua rau nws yaj, ua pa, thiab tsim ib daim hlau nyias nyias rau ntawm qhov chaw ntawm cov qauv tom qab txias, nrog rau qhov tuab ntawm 0.8-1.2 um. Nws sau cov khoom me me concave thiab convex rau ntawm qhov chaw ntawm cov khoom tsim kom tau txais qhov chaw zoo li daim iav. Thaum lub tshuab nqus tsev vacuum deposition ua tiav los ntawm kev ua kom tau txais qhov cuam tshuam ntawm daim iav lossis los nqus tsev vaporize cov hlau uas tsis lo rau, qhov chaw hauv qab yuav tsum tau coated.
Sputtering feem ntau yog hais txog magnetron sputtering, uas yog ib txoj kev kub ceev qis-kub sputtering. Cov txheej txheem yuav tsum tau lub tshuab nqus tsev txog li 1 × 10-3Torr, uas yog 1.3 × 10-3Pa lub xeev nqus tsev puv nrog inert roj argon (Ar), thiab ntawm cov yas substrate (anode) thiab lub hom phiaj hlau (cathode) ntxiv rau high-voltage ncaj qha tam sim no, vim yog lub electron excitation ntawm inert roj tsim los ntawm glow discharge, tsim plasma, cov plasma yuav tawg tawm cov atoms ntawm lub hom phiaj hlau thiab tso lawv rau ntawm cov yas substrate. Feem ntau ntawm cov hlau coatings siv DC sputtering, thaum cov khoom siv ceramic tsis-conductive siv RF AC sputtering.
Txheej ion yog ib txoj kev uas siv cov pa roj los ua kom cov pa roj lossis cov khoom uas tau evaporated ion nyob rau hauv lub tshuab nqus tsev, thiab cov khoom uas tau evaporated lossis nws cov reactants raug tso rau ntawm lub substrate los ntawm kev foob pob ntawm cov pa roj lossis cov ions ntawm cov khoom uas tau evaporated. Cov no suav nrog magnetron sputtering ion txheej, reactive ion txheej, hollow cathode discharge ion txheej (hollow cathode vapor deposition method), thiab multi-arc ion txheej (cathode arc ion txheej).
Ntsug ob sab magnetron sputtering txheej txheem tas mus li hauv kab
Siv tau dav, siv tau rau cov khoom siv hluav taws xob xws li lub plhaub phau ntawv EMI tiv thaiv txheej, cov khoom tiaj tus, thiab txawm tias txhua yam khoom khob teeb uas nyob hauv qee qhov siab tuaj yeem tsim tau. Muaj peev xwm thauj khoom loj, clamping me me thiab staggered clamping ntawm cov khob teeb conical rau ob sab txheej, uas tuaj yeem muaj peev xwm thauj khoom ntau dua. Zoo ruaj khov, zoo sib xws ntawm cov txheej zaj duab xis los ntawm ib pawg mus rau ib pawg. Qib siab ntawm automation thiab tsawg tus nqi khiav haujlwm.
– Tsab xov xwm no yog tso tawm los ntawmlub tshuab nqus tsev txheej tshuab chaw tsim khoomGuangdong Zhenhua
Lub sijhawm tshaj tawm: Lub Ib Hlis-23-2025