Magnetron sputtering txheej yog nqa tawm nyob rau hauv glow paug, uas tsis tshua muaj paug tam sim no ceev thiab tsawg plasma ceev nyob rau hauv lub txheej chamber. Qhov no ua rau magnetron sputtering thev naus laus zis muaj qhov tsis zoo xws li zaj duab xis substrate bonding quab yuam, qis hlau ionization tus nqi, thiab qis deposition npaum li cas. Nyob rau hauv lub magnetron sputtering txheej tshuab, ib tug arc paug ntaus ntawv yog ntxiv, uas yuav siv tau lub high-density electron txaus nyob rau hauv lub arc plasma generated los ntawm arc paug los ntxuav lub workpiece, Nws kuj muaj peev xwm koom nyob rau hauv txheej thiab auxiliary deposition.
Ntxiv ib qho hluav taws xob tawm hluav taws xob hauv lub tshuab magnetron sputtering txheej, uas tuaj yeem yog qhov chaw me me, lub kaum sab xis planar arc qhov chaw, lossis lub cylindrical cathode arc qhov chaw. Lub high-density electron flow generated los ntawm cathode arc qhov chaw tuaj yeem ua lub luag haujlwm hauv qab no hauv tag nrho cov txheej txheem ntawm magnetron sputtering txheej:
1. Ntxuav lub workpiece. Ua ntej txheej, tig rau cathode arc qhov chaw, thiab lwm yam, ionize cov pa nrog arc electron txaus, thiab ntxuav lub workpiece nrog tsawg zog thiab siab ceev argon ions.
2. Lub hom phiaj arc thiab magnetic tswj lub hom phiaj yog coated ua ke. Thaum lub hom phiaj magnetron sputtering nrog glow tawm yog qhib rau txheej, cathode arc qhov chaw kuj tau qhib, thiab ob qho tib si txheej txheej yog ib txhij coated. Thaum muaj pes tsawg leeg ntawm cov khoom siv magnetron sputtering lub hom phiaj thiab cov khoom siv arc lub hom phiaj sib txawv, ntau txheej txheej ntawm zaj duab xis tuaj yeem plated, thiab cov yeeb yaj kiab txheej tso los ntawm cathode arc qhov chaw yog interlayer hauv ntau txheej zaj duab xis.
3. Tus Cathode arc qhov chaw muab siab-ceev hluav taws xob cov pa yeeb yaj kiab, txhim kho cov pa dej sib tsoo, ua kom muaj zog tso pa, thiab siv lub luag haujlwm ntawm cov kev pabcuam.
Lub cathode arc qhov chaw teeb tsa nyob rau hauv lub tshuab magnetron sputtering txheej tshuab integrates ib tug tu qhov chaw, txheej qhov chaw, thiab ionization qhov chaw, ua si lub luag hauj lwm zoo nyob rau hauv kev txhim kho qhov zoo ntawm magnetron sputtering txheej los ntawm kev siv lub arc electron txaus nyob rau hauv lub arc plasma.
Post lub sij hawm: Jun-21-2023