Halayen suturar magnetron sputtering Babi na 2

Halayen magnetron sputtering shafi

(3) Karancin kuzari. Saboda ƙarancin ƙarfin lantarki na cathode da aka yi amfani da shi a kan manufa, plasma yana ɗaure da filin maganadisu a cikin sararin samaniya kusa da cathode, don haka yana hana barbashi mai ƙarfi mai ƙarfi zuwa gefen substrate da mutane suka harbe. Don haka, girman lalacewar da ake samu kamar na'urorin semiconductor da ke haifar da cajin bama-bamai ya yi ƙasa da wanda wasu hanyoyin sputtering ke haifarwa.

(4) Low substrate zafin jiki. Magnetron sputtering sputtering rate ne high, saboda cathode manufa a cikin Magnetic filin a cikin yankin, wato, manufa fitarwa titin jirgin sama a cikin wani karamin fili yanki na electron maida hankali ne high, yayin da a cikin Magnetic sakamako a waje da yankin, musamman daga Magnetic filin na substrate surface a kusa, da electron maida hankali saboda watsawa na da yawa kasa, kuma yana iya zama ma ya zama ƙasa da gas mai aiki (matsa lamba biyu). na tsari mai girma). Don haka, a ƙarƙashin yanayi sputtering magnetron, taro na electrons bombarding surface na substrate ya yi ƙasa da wanda a cikin talakawa diode sputtering, da kuma wuce kima karuwa a substrate zafin jiki da aka kauce masa saboda rage yawan electrons faruwa a kan substrate. Bugu da kari, a cikin hanyar sputtering magnetron, da anode na magnetron sputtering na'urar za a iya located a kusa da cathode kusanci, da kuma substrate mariƙin kuma iya zama ungrounded kuma a dakatar m, sabõda haka, electrons ba zai iya wucewa ta cikin ƙasa substrate mariƙin da gudana ta cikin anode, game da shi yin high-makamashi sputtering na'urar za a iya located a kusa da cathode kusa, da kuma substrate mariƙin kuma iya zama ungrounded kuma a dakatar m, sabõda haka, da electrons ba zai wuce ta cikin ƙasa substrate mariƙin da kuma gudana ta cikin anode, game da shi yin high-makamashi sputtering na'urar haifar da substrate da electrons rage substrate da electrons substrated da electrons. da matuƙar attenuating na biyu electron bombardment na substrate sakamakon da zafi samar.

(5) Rashin daidaituwar abin da aka sa a gaba. A cikin al'ada magnetron sputtering manufa, da yin amfani da wani m Magnetic filin, don haka plasma zai samar da wani gida convergence sakamako, zai sa manufa a kan gida matsayi na sputtering etching kudi ne mai girma, sakamakon shi ne cewa manufa za ta samar da wani gagarumin m etching. Matsakaicin amfani da manufa gabaɗaya kusan 30%. Don haɓaka ƙimar amfani da kayan da aka yi niyya, zaku iya ɗaukar matakan haɓaka iri-iri, kamar haɓaka sifa da rarraba filin maganadisu, ta yadda maganadisu a cikin motsi na ciki na cathode da sauransu.

Wahala wajen sputtering abubuwan maganadisu. Idan maƙasudin sputtering an yi shi da wani abu mai girma da ƙarfin maganadisu, layukan maganadisu na ƙarfi za su wuce kai tsaye ta cikin abin da ake hari don faruwar wani abu na gajeriyar yanayi, don haka zai sa fitar da magnetron ke da wahala. Don samar da filin maganadisu na sararin samaniya, mutane sun gudanar da bincike iri-iri, alal misali, don cika filin maganadisu a cikin abin da aka yi niyya, da barin gibi da yawa a cikin abin da ake nufi don haɓaka haɓakar haɓakar haɓakar haɓakar haɓakar yanayin zafin maganadisu, ko don rage ƙarfin maganadisu na abin da ake nufi.

–An fitar da wannan labarininjin shafa injin injinGuangdong Zhenhua