Ngesikhathi sokubhoboza i-PCB ngomshini, i-micro-drill eyodwa kumele iqhubeke ingena ezintweni eziningi, okuhlanganisa i-copper foil, i-resin, i-glass fiber kanye nama-filler asebenzayo. Nakuba inqubo ingase ibonakale ihilela ukubhoboza okuphindaphindiwe kuphela, imiphetho yokusika ye-micro-drill iqhubeka nokuguguleka okubangelwa yizinhlayiya eziqinile, ukushisa okungqubuzanayo kanye nemithwalo yemishini ejikelezayo.
Njengoba ukukhiqizwa kwe-PCB kuqhubeka nokuthuthuka kuya ekuxineni okuphezulu kwesekethe, ukubalwa kwezingqimba okukhulu kanye namajiyometri amahle, ububanzi bemigodi ebholiwe buya ngokuya buncipha. Okwamanje, ama-laminate okunzima ukuwasebenzisa ngomshini, kufaka phakathi izinto ezine-Tg ephezulu kanye nezinto ezigcwalisa kakhulu, asetshenziswa kabanzi. Ikakhulukazi uma ububanzi be-micro-drill bungaphansi kuka-0.1 mm, izidingo eziqinile kakhulu zibekwa emandleni okubhoboza, ukumelana nokuguguleka okuphambili, ukuphuma kwe-chip kanye nokuqina kokubhoboza okuphelele.
Uma kwenzeka ukuguguleka okukhulu, umthelela udlulela ngale kokuncipha kwesikhathi sokuphila kwamathuluzi. Kungase futhi kuholele ekukhuleni kokuqina kwemigodi nodonga, ama-burrs okungena nokuphuma, ukuncipha kokuqina kobubanzi bemigodi kanye nokuphuka kwebhobo.
Ngakho-ke, ukuthuthukisa ukumelana nokuguguleka kwama-micro-drill nokunciphisa ukungqubuzana ngokusebenzisa izembozo zangaphezulu sekuba yindlela ebalulekile yobuchwepheshe yokuthuthukisa ikhwalithi yokubhoboza ye-PCB.
1. Ukuguguleka kwe-Micro-Drill Kuthinta Okungaphezu Kokuphila Kwamathuluzi
Ama-laminate e-PCB ngokuvamile akhiwa nge-foil yethusi, i-resin, i-fiber yengilazi kanye nezitsha zokugcwalisa ezahlukahlukene ezisebenzayo. Ngesikhathi sokubhoboza ngesivinini esikhulu, i-micro-drill kumele inqume ngokuphindaphindiwe izinto ezinezakhiwo ezihlukile kakhulu zemishini nezokushisa. Imicu yengilazi kanye nezitsha zokugcwalisa ezithile eziqinile zihlala zibangela ukuguguleka okukhulu endaweni yokubhoboza kanye nemiphetho yokusika, kuyilapho i-resin inganamathela endaweni yokubhoboza noma ama-flute e-helical ngaphansi kwemiphumela ehlangene yokungqubuzana nokushisa okusikayo, okuthinta kabi ukuphuma kwe-chip okulandelayo.
Njengoba inani lemigodi ebholiwe landa, imiphetho yokusika ye-micro-drill iba buthuntu kancane kancane. Ukuphonswa kwe-axial okudingekayo ukuze kungene i-laminate kuyanda ngokufanele, kuyilapho ukungqubuzana kanye nokukhiqizwa kokushisa kunganda kakhulu. Ngaphansi kwalezi zimo, isenzo sokusika ku-copper foil, i-resin kanye ne-glass fiber siyawohloka kancane kancane, okuholela ekucindezelweni, ekuklwebheni noma ekudabukeni kunokususwa kwezinto ezihlanzekile. Lokhu kungandisa ubulukhuni bemigodi, kukhiqize ama-burrs okungena nokuphuma abonakala kakhulu futhi kunciphise ukuqina kobubanzi bemigodi. Kuma-PCB aqondile kanye namabhodi okuxhumana aphezulu, noma i-HDI, la maphutha angandisa nobunzima bokwenziwa kwensimbi kwemigodi okulandelayo kanye nokulawulwa kwekhwalithi.
Ngaphezu kwalokho, uma ububanzi be-micro-drill buncane, kulapho amandla okufaka i-chip-accommodation yama-helical flute ayo ancishiswa khona. Lapho ama-chip eqoqana noma i-resin inamathela endaweni yokubhoboza, imiphetho yokusika noma ama-chip flute, ukumelana kokubhoboza kungashintshashintsha kakhulu. Uma kuhlanganiswa nokuguguleka kwe-micro-drill, ukugeleza kwe-spindle noma imingcele yokubhoboza engafanele, ukugoba kanye nemithwalo yokugoba esebenza ku-micro-drill inganda, ngaleyo ndlela kukhuphule izingozi zokuphambuka nokuphuka kwe-drill.
2. Izimbozo ze-Micro-Drill Ziyithuthukisa Kanjani I-PCB Drilling?
Izembozo eziqinile ezifana ne-ta-C, i-AlTiN, i-AlCrN kanye ne-CrN zingafakwa kuma-micro-drill e-PCB. Phakathi kwalezi zinto, i-tetrahedral amorphous carbon, noma i-ta-C, ihlanganisa ubulukhuni obuphezulu ne-coefficient ephansi yokungqubuzana, okusiza ekunciphiseni ukuguguleka okuphambili kanye nokumelana nokubhoboza ngenkathi kuvikela indawo yokubhoboza kanye nemiphetho yokusika. Ekusetshenzisweni okungokoqobo, izembozo ze-micro-drill zithuthukisa ukusebenza kokubhoboza ikakhulukazi ngokubambezela ukuguguleka okuphambili, ukunciphisa ukungqubuzana kanye nokumelana nokuphuma kwe-chip, kanye nokuqinisa ikhwalithi yemigodi.
Izembozo zokuqina okuphezulu zinciphisa ukuxhumana okuqondile phakathi kwemicu yengilazi, ama-filler aqinile kanye ne-substrate ye-carbide eqinisiwe. Lokhu kusiza ekunciphiseni ukuguguleka endaweni yokubhoboza, imiphetho yokusika eyinhloko kanye nemingcele, okuvumela i-micro-drill ukuthi igcine isimo esizinzile sokusika phezu kwemijikelezo eminingi yokubhoboza.
Izimbozo eziphansi ziyasiza ekunciphiseni ukungqubuzana phakathi kwe-micro-drill, i-PCB laminate kanye nama-chips akhiqizwe. Zinganciphisa nokuthambekela kwama-chips kanye ne-resin ekunamatheleni endaweni yokubhoboza kanye nama-helical flutes, okudala izimo zobuso ezingcono kakhulu zokususa ama-chip.
Uma izinga lokuguguleka kwemiphetho yokusika lilawulwa ngempumelelo, ukwehluka kwesimo somphetho osezingeni eliphezulu ngesikhathi sezigaba ezahlukene zomshini kungancishiswa. Lokhu kusiza ukuthuthukisa ikhwalithi yodonga lwemigodi kanye nokuvumelana kobubanzi bemigodi ngenkathi kunciphisa ukwakheka kwama-burrs okungena nokuphuma.
Kodwa-ke, izembozo azikwazi ukuqeda ngokuphelele ukuphuka kwebholi. Ukwehluleka kwebholi kuhlobene nobubanzi bebholi encane, uhlobo lwe-laminate, ukuphakama kwe-stack, isimo se-spindle kanye nemingcele yokubholi. Ngokunciphisa ukuguguleka, ukunciphisa ukungqubuzana kanye nokuthuthukisa ukuphuma kwe-chip, isembozo esakhiwe kahle singanciphisa imithwalo yokusika engavamile futhi ngaleyo ndlela sinciphise ingozi yokuphuka kwebholi.
3. Ama-Micro-Drill Amancane Adinga Izinqubo Zokumboza Ezinembile Kakhulu
Uma kuqhathaniswa namathuluzi okusika avamile, ama-PCB micro-drill anobukhulu obuncane kakhulu kanye ne-drill-point ebucayi kakhulu kanye nama-geometri asezingeni eliphezulu. Ngakho-ke, izembozo ze-micro-drill azikwazi ukugxila kuphela ekufinyeleleni ubulukhuni obuphezulu. Ubukhulu befilimu, ikhwalithi yobuso kanye nokunamathela kwe-coating-substrate nakho kumele kulawulwe ngokucophelela.
Uma isembozo sincane kakhulu, ukuvikelwa kwaso ekugugeni okunamandla kungase kunganele. Uma sijiyile kakhulu, singashintsha iphrofayili encane kakhulu yomphetho wokusika futhi sibangele ukugoba noma ukufiphala komphetho. Uma ububanzi be-micro-drill buncane, ukusebenza kwaso kokusika kuba bucayi kakhulu ekujikeni kwesembozo.
Ukufakwa kwe-arc ye-cathodic evamile nakho kungadala ama-macroparticles. Uma la ma-macroparticles ebekwe eduze kwendawo yokubhoboza, unqenqema lokusika noma umkhawulo, angandisa ukugoba kobuso be-coating futhi aphazamise ubukhali bonqenqema lokusika. Kuma-micro-drill amancane kakhulu anama-diameter angaphansi kuka-0.1 mm, izinhlayiya ezinobukhulu obufanayo zingaba nomthelela omkhulu kakhulu ku-geometry yokusika.
Ama-Micro-drill aqukethe nezici eziyinkimbinkimbi ezinezinhlangothi ezintathu, okuhlanganisa indawo yokubhoboza, imiphetho yokusika, imiphetho kanye nama-helical chip flute. Ngesikhathi sokumboza nge-batch, ukwakheka kwe-fixture, ubuningi bokulayisha kanye nokunyakaza kwe-substrate kumele kulungiselelwe ngokuphelele ukuze kufezwe ukumbozwa okwanele kokumboza ezindaweni ezahlukene zokusebenza ngenkathi kugcinwa ukuvumelana phakathi kwama-micro-drill ngamanye.
4. Isixazululo Sokumboza Esincane Se-Zhenhua PCB — Uhlelo Lokumboza Oluqinile lwe-FMA0605
Ukuze kuhlangatshezwane nezidingo zokusebenza kwe-coating kanye nekhwalithi ephezulu ye-micro-drills kanye namanye amathuluzi okusika ngokunemba, i-Zhenhua Vacuum FMA0605 Hard-Coating System isebenzisa ubuchwepheshe be-arc cathodic ehlungiwe nge-magnetic. Lobu buchwepheshe buhlunga ama-macroparticles akhiqizwa ngesikhathi se-cathodic arc deposition, okuvumela i-ta-C coating ukuthi ifinyelele kokubili ukufakwa okusebenzayo kanye nokusebenza kahle kwe-coating.
Izembozo ze-ta-C ezibekwe yisistimu zingafinyelela ubulukhuni obumaphakathi obufika ku-63 GPa ngenkathi zigcina izici zokungqubuzana okuphansi. Ubulukhuni obuphezulu buyasiza ekumelaneni nokuguguleka okubangelwa imicu yengilazi kanye nama-filler aqinile kuma-laminate e-PCB. I-coefficient ephansi yokungqubuzana iyasiza ekunciphiseni ukumelana phakathi kwe-micro-drill, i-laminate nama-chips, ngenkathi inciphisa ukunamathela kwama-chip futhi idala izimo zobuso ezingcono kakhulu zokubhoboza okuqhubekayo kanye nokuphuma kwama-chip.
Ngaphezu kokwembozwa kwe-ta-C, uhlelo lungaphinde lufake izembozo ezimelana nokushisa okuphezulu neziqinile njenge-AlTiN, AlCrN, TiCrAlN, TiAlSiN kanye ne-CrN. Lezi zembozo zisetshenziswe ezikhumbeni, amathuluzi okusika, izibhakela, izingxenye zezimoto, ama-piston kanye neminye imikhiqizo engagugi.
5. Isiphetho
Njengoba ukubhoboza kwe-PCB kuqhubeka nokuthuthuka kuya kuma-diameter amancane emigodi kanye nokunemba okuphezulu komshini, inani lezingubo zokubhoboza ezincane alisagcini ekwandiseni impilo yamathuluzi. Okubaluleke kakhulu, izingubo zokubhoboza zisiza ukugcina isimo esisezingeni eliphezulu, ukuthuthukisa ikhwalithi yemigodi nokuthuthukisa ukuzinza ngesikhathi sokubhoboza okuqhubekayo. Isixazululo sokumboza esisebenzayo kumele sicabangele ngokuphelele ubulukhuni bokumboza, ukusebenza kokungqubuzana, ukujiya kwefilimu, ikhwalithi yendawo kanye nokunamathela kwe-substrate yokumboza, kuyilapho futhi kuhambisana nokucaciswa kwe-micro-drill, uhlobo lwe-PCB laminate kanye nezimo zangempela zokubhoboza.
Ngobuchwepheshe be-arc cathodic ehlungiwe nge-magnetic, i-Zhenhua Vacuum FMA0605 Hard-Coating System inciphisa imiphumela emibi yama-macroparticles akhiqizwe yi-arc emaphethelweni okusika amahle kakhulu. Izembozo ze-ta-C ezinobunzima obuphezulu, eziphansi ziyasiza ekubambezeleni ukuguguleka kwe-micro-drill, ziqinise ikhwalithi yemigodi ye-PCB futhi zinciphise ingozi yokuphuka kwe-drill okungavamile, zinikeze ukwesekwa okuthembekile kwemishini yokuthuthukiswa kwenqubo ye-PCB micro-drill coating kanye nokukhiqizwa okuphezulu.
-Lesi sihloko sishicilelwe nguumenzi wemishini yokumboza nge-vacuumI-Zhenhua Vacuum
Isikhathi sokuthunyelwe: Julayi-25-2026