Magnetron sputtering yafi hada da fitarwa plasma sufuri, manufa etching, bakin ciki film jijjiga da sauran matakai, da Magnetic filin a kan magnetron sputtering tsari zai yi tasiri. A cikin magnetron sputtering tsarin da orthogonal Magnetic filin, da electrons ne batun da rawar da Lorentz karfi da kuma yin karkace yanayin motsi, dole ne sha akai akai karo don matsawa zuwa anode, saboda karo da ke sa wani ɓangare na electrons isa ga anode bayan da makamashi ne kananan, zafi na bombardment a kan substrate kuma ba babba. Bugu da kari, saboda electron da manufa Magnetic filin ƙuntatawa, a cikin manufa surface na Magnetic sakamako na yankin da yake a cikin fitarwa titin jirgin sama wannan gida kananan kewayon electron maida hankali ne sosai high, da kuma a cikin Magnetic sakamako na yankin a waje da substrate surface, musamman daga Magnetic filin kusa da surface, da electron maida hankali ne saboda watsawa da yawa kasa da kuma in mun gwada da iri yanayi rarraba gas, kuma ko da sputter kasa da kasa da kuma matsa lamba na yanayi daban-daban iri iri, da kuma ko da m fiye da gas. na tsari mai girma). Ƙananan yawa na electrons suna bombarding surface na substrate, sabõda haka, bam na substrate lalacewa ta hanyar da ƙananan zafin jiki tashin, wanda shi ne babban inji magnetron sputtering substrate zafin tashi ne low. Bugu da kari, idan akwai kawai lantarki filin, da electrons isa ga anode bayan wani ɗan gajeren nesa, da yiwuwar karo da aiki gas ne kawai 63.8%. Kuma ƙara da Magnetic filin, electrons a cikin aiwatar da motsi zuwa anode yi karkace motsi, da Magnetic filin daure da kuma mika yanayin electrons, ƙwarai inganta yiwuwar karo na electrons da kuma aiki gas, wanda ƙwarai inganta abin da ya faru na ionization, ionization sa'an nan kuma sake samar da electrons kuma shiga cikin tsari na karo na iya kara karo da dama electrons. girma, da tasiri amfani da makamashi na electrons, don haka a cikin samuwar high-yawan Plasma yawa karuwa a anomalous haske fitarwa na plasma. Hakanan ana haɓaka ƙimar fitar da ƙwayoyin zarra daga abin da aka yi niyya, kuma ɗimbin sputter da ke haifar da bam na maƙasudin ta hanyar ions masu kyau ya fi tasiri, wanda shine dalilin haɓakar ƙimar magnetron sputtering. Bugu da kari, gaban Magnetic filin kuma iya sa sputtering tsarin aiki a ƙananan iska matsa lamba, low 1 domin iska matsa lamba na iya sa ions a cikin kwasfa Layer yankin don rage karo karo, bombardment na manufa tare da in mun gwada da manyan motsin motsi makamashi, da kuma ranar da za a iya rage sputtered manufa atom da tsaka tsaki gas karo, don hana manufa atoms daga tarwatsa na'urar zuwa tarwatsa na'urar zuwa bangon da aka watsar da manufa, ko don tarwatsa na'urar. ƙimar da ingancin jigon fim ɗin bakin ciki.
Filin maganadisu da aka yi niyya zai iya danne yanayin yanayin electrons yadda ya kamata, wanda hakan ke shafar kaddarorin plasma da fitar da ions akan manufa.
Trace: ƙara daidaitaccen filin maganadisu na manufa na iya haɓaka daidaitaccen etching da aka yi niyya, don haka inganta amfani da abin da aka yi niyya; Rarraba filin lantarki mai ma'ana kuma yana iya inganta ingantaccen tsarin sputtering. Saboda haka, don maƙasudin sputtering magnetron, girman da rarraba filin maganadisu yana da mahimmanci.
–An fitar da wannan labarininjin shafa injin injinGuangdong Zhenhua
Lokacin aikawa: Dec-14-2023