He kūpono loa ka hoʻoheheʻe ʻana o ka magnetron vacuum no nā uhi hoʻoheheʻe reactive. ʻO ka ʻoiaʻiʻo, hiki i kēia kaʻina hana ke waiho i nā kiʻiʻoniʻoni lahilahi o nā mea oxide, carbide, a me nitride. Eia kekahi, ua kūpono loa ke kaʻina hana no ka waiho ʻana o nā hale kiʻiʻoniʻoni multilayer, e pili ana i nā hoʻolālā optical, nā kiʻi ʻoniʻoni, nā lole pale pale, nano-laminates, superlattice coatings, insulating films, a me nā mea ʻē aʻe. Aia kēia mau mea i nā mea conductive transparent, semiconductors, polymers, oxides, carbide, a me nitrides, aʻo nā fluoride e hoʻohana ʻia i nā kaʻina hana e like me ka uhi ʻana.
ʻO ka pōmaikaʻi nui o ka magnetron sputtering kaʻina hana e hoʻohana ana i nā kaʻina hoʻopiʻi reactive a i ʻole reactive e waiho i nā papa o kēia mau mea a me ka hoʻomalu maikaʻi ʻana i ka papa hana, ka mānoanoa kiʻiʻoniʻoni, ka like ʻana o ka mānoanoa film a me nā waiwai mechanical o ka papa. Aia nā ʻano o ke kaʻina hana penei.
1、Ka nui o ka waiho ʻana. Ma muli o ka hoʻohana ʻana i nā electrodes magnetron kiʻekiʻe, hiki ke loaʻa kahi kahe ion nui, hoʻomaikaʻi maikaʻi i ka helu deposition a me ka wikiwiki o ka sputtering o kēia kaʻina hana uhi. Ke hoʻohālikelike ʻia me nā kaʻina hana hoʻoheheʻe sputtering, loaʻa i ka magnetron sputtering kahi mana kiʻekiʻe a me nā hua kiʻekiʻe, a hoʻohana nui ʻia i nā ʻano hana ʻoihana.
2、Ka mana kiʻekiʻe. E koho maʻamau ka mākaʻikaʻi ʻo Magnetron sputtering i ka uila i loko o ka laulā o 200V-1000V, maʻamau ʻo 600V, no ka mea, ʻo ka volta o 600V aia wale nō i loko o ka pae kiʻekiʻe o ka mana o ka mana.
3. Haʻahaʻa sputtering ikehu. Hoʻohana haʻahaʻa ka volta magnetron target, a hoʻopaʻa ka māla magnetic i ka plasma kokoke i ka cathode, ka mea e pale ai i nā ʻāpana i hoʻonui ʻia i ka ikehu mai ka hoʻokuʻu ʻana i ka substrate.
4、Ka wela substrate haʻahaʻa. Hiki ke hoʻohana ʻia ka anode e alakaʻi i nā electrons i hana ʻia i ka wā o ka hoʻokuʻu ʻana, ʻaʻole pono ke kākoʻo substrate e hoʻopau, hiki ke hoʻemi pono i ka pōʻino electron o ka substrate. No laila he haʻahaʻa ka mahana o ka substrate, he mea kūpono loa ia no kekahi mau substrate plastic i kū ʻole i ka uhi wela kiʻekiʻe.
5, Magnetron sputtering target surface etching 'aʻole like. ʻO Magnetron sputtering target surface etching uneven ua kumu ʻia e ke kahua magnetic uneven o ka pahu hopu. ʻOi aku ka nui o ka wahi o ka helu etching target, no laila ʻoi aku ka haʻahaʻa o ka hoʻohana pono ʻana o ka pahuhopu (ʻo 20-30% wale nō ka helu hoʻohana). No laila, no ka hoʻomaikaʻi ʻana i ka hoʻohana ʻana i ka pahuhopu, pono e hoʻololi ʻia ka hoʻokaʻawale ʻana o ke kahua magnetic e kekahi mau ala, a i ʻole ka hoʻohana ʻana i nā magnet e neʻe ana i ka cathode hiki ke hoʻomaikaʻi i ka hoʻohana ʻana.
6、Hui hui. Hiki ke hana i kahi kiʻiʻoniʻoni hoʻoheheʻe hoʻohuihui. I kēia manawa, ua hoʻopili maikaʻi ʻia ka hoʻohana ʻana i ke kaʻina sputtering pahuhopu magnetron composite ma ke kiʻi ʻoniʻoni alloy Ta-Ti, (Tb-Dy) -Fe a me Gb-Co. He ʻehā ʻano ʻano o ka hoʻolālā pahu hoʻohuihui, ʻo ia ka pahu pahu i hoʻopili ʻia, ʻo ka pahu pahu i hoʻopaʻa ʻia, ʻo ka pahu pahu pahu liʻiliʻi a me ka pahu pahu pahu. ʻOi aku ka maikaʻi o ka hoʻohana ʻana i ka ʻāpana inlaid target structure.
7. Laulā o nā noi. Hiki i ke kaʻina hana sputtering Magnetron ke waiho i nā mea he nui, ʻo nā mea maʻamau: Ag, Au, C, Co, Cu, Fe, Ge, Mo, Nb, Ni, Os, Cr, Pd, Pt, Re, Rh, Si, Ta, Ti, Zr, SiO, AlO, GaAs, U, W, SnO, etc.
ʻO ka Magnetron sputtering kekahi o nā kaʻina hana uhi hoʻohana nui ʻia e kiʻi i nā kiʻiʻoniʻoni kiʻekiʻe. Me kahi cathode hou, loaʻa iā ia ka hoʻohana kiʻekiʻe kiʻekiʻe a me ka helu deposition kiʻekiʻe. Ua hoʻohana nui ʻia ʻo Guangdong Zhenhua Technology vacuum magnetron sputtering coating process i ka uhi ʻana o nā substrates nui. ʻAʻole hoʻohana wale ʻia ke kaʻina hana no ka waiho ʻana o ke kiʻi ʻoniʻoni hoʻokahi, akā no ka uhi ʻana i nā kiʻiʻoniʻoni multi-layer, ʻo ia hoʻi, ua hoʻohana ʻia i loko o ka ʻōwili e ʻōwili i ke kaʻina no ka paʻi kiʻi ʻoniʻoni, kiʻi optical, lamination a me nā kiʻi ʻoniʻoni ʻē aʻe.
Ka manawa hoʻouna: Mei-31-2024