Embonini yesimanje yama-elekthronikhi, ama-substrate e-ceramic asetshenziswa kabanzi njengezinto ezibalulekile zokupakisha ze-elekthronikhi kuma-semiconductor kagesi, ukukhanyisa kwe-LED, amamojula kagesi, nakwezinye izinkambu. Ukuze kuthuthukiswe ukusebenza nokuthembeka kwama-substrate e-ceramic, inqubo ye-DPC (Direct Plating Copper) ivele njengobuchwepheshe bokumboza obusebenza kahle kakhulu futhi obunembile, yaba inqubo eyinhloko ekukhiqizweni kwama-substrate e-ceramic.
Cha. 1 KuyiniInqubo Yokumboza i-DPC?
Njengoba igama lisikisela, inqubo yokumboza i-DPC ihilela ukumboza ngqo ithusi phezu kobuso be-substrate ye-ceramic, kunqotshwe imikhawulo yobuchwepheshe yezindlela zokunamathisela i-foil yethusi yendabuko. Uma kuqhathaniswa namasu okubopha avamile, inqubo yokumboza i-DPC ithuthukisa kakhulu ukunamathela phakathi kwesendlalelo sethusi kanye ne-substrate ye-ceramic ngenkathi inikeza ukusebenza kahle okuphezulu kokukhiqiza kanye nokusebenza kukagesi okuphezulu.
Enqubweni yokumboza ye-DPC, ungqimba lokumboza lethusi lwakhiwa ku-substrate ye-ceramic ngokusebenzisa ukusabela kwamakhemikhali noma kwe-electrochemical. Le ndlela inciphisa izinkinga zokuhlukanisa ezivame ukubonakala ezinqubweni zokubopha zendabuko futhi ivumela ukulawulwa okunembile kokusebenza kukagesi, okuhlangabezana nezidingo zezimboni eziqinile.
Ukugeleza Kwenqubo Yokumboza ye-DPC No.2
Inqubo ye-DPC inezinyathelo eziningana ezibalulekile, ngasinye sibalulekile kwikhwalithi kanye nokusebenza komkhiqizo wokugcina.
1. Ukubhoboza nge-laser
Ukubhoboza nge-laser kwenziwa ku-substrate ye-ceramic ngokwezidingo zomklamo, kuqinisekiswa ukubekwa kwemigodi okunembile kanye nobukhulu bayo. Lesi sinyathelo sisiza ukwakheka kwephethini yesekethe ngokulandelayo.
2. Ukugqoka kwe-PVD
Ubuchwepheshe be-Physical Vapor Deposition (PVD) busetshenziselwa ukufaka ifilimu yethusi elincane ku-substrate ye-ceramic. Lesi sinyathelo sithuthukisa ukuhanjiswa kukagesi nokushisa kwe-substrate ngenkathi sithuthukisa ukunamathela kwendawo, okuqinisekisa ikhwalithi yesendlalelo sethusi esifakwe ngogesi esilandelayo.
3. Ukuqina kwe-Electroplating
Ngokwakhela phezu kwengubo ye-PVD, i-electroplating isetshenziselwa ukujiya ungqimba lwethusi. Lesi sinyathelo siqinisa ukuqina kanye nokuqhuba kwengqimba yethusi ukuze kuhlangatshezwane nezidingo zezicelo zamandla aphezulu. Ubukhulu bengqimba yethusi bungalungiswa ngokusekelwe ezidingweni ezithile.
4. Ukuhlela Amaphethini Esekethe
Amasu okuthwebula izithombe kanye nokuqopha amakhemikhali asetshenziswa ukudala amaphethini wesekethe anembile kungqimba yethusi. Lesi sinyathelo sibalulekile ekuqinisekiseni ukuhanjiswa kukagesi kanye nokuzinza kwesekethe.
5. Imaski Yokusonga Nokumaka
Kusetshenziswa isendlalelo semaski esisodayo ukuvikela izindawo ezingahambisani nogesi zesekethe. Lesi sendlalelo sivimbela amasekethe amafushane futhi sithuthukisa izakhiwo zokuvikela ze-substrate.
6. Ukwelashwa Komphezulu
Ukuhlanza indawo, ukupholisha, noma ukugqoka kwenziwa ukuqinisekisa ukuthi indawo ibushelelezi futhi kususwe noma yikuphi ukungcola okungathinta ukusebenza kahle. Ukwelashwa kwendawo nakho kuthuthukisa ukumelana nokugqwala kwe-substrate.
7. Ukubumba Nge-Laser
Okokugcina, ukucubungula nge-laser kusetshenziselwa ukuqedela okuningiliziwe, okuqinisekisa ukuthi i-substrate ihlangabezana nemininingwane yomklamo ngokwesimo nosayizi. Lesi sinyathelo sinikeza imishini enembile kakhulu, ikakhulukazi ezingxenyeni ezibunjwe ngendlela eyinkimbinkimbi ezisetshenziswa ezisetshenziswayo ze-elekthronikhi nezangaphakathi.
Izinzuzo ze-DPC Coating Process No.3
Inqubo yokumboza i-DPC inikeza izinzuzo eziningana ezibalulekile ekukhiqizweni kwe-ceramic substrate, okuhlanganisa:
1. Amandla Okunamathela Aphezulu
Inqubo ye-DPC idala isibopho esiqinile phakathi kwesendlalelo sethusi kanye ne-ceramic substrate, okuthuthukisa kakhulu ukuqina kanye nokumelana nokuqhekeka kwesendlalelo sethusi.
2. Ukusebenza Okuphezulu Kagesi
Izisekelo ze-ceramic ezimbozwe ngethusi zibonisa ukuhanjiswa kukagesi nokushisa okuhle kakhulu, okuthuthukisa ukusebenza kwezingxenye ze-elekthronikhi ngempumelelo.
3. Ukulawula Okunembile Kakhulu
Inqubo ye-DPC ivumela ukulawulwa okunembile kokujiya kanye nekhwalithi yengqimba yethusi, ihlangabezana nezidingo eziqinile zikagesi nezemishini zemikhiqizo ehlukahlukene.
4. Ubungane Bemvelo
Uma kuqhathaniswa nezindlela zokubopha zendabuko ze-copper foil, inqubo ye-DPC ayidingi amakhemikhali amaningi ayingozi, okwenza kube yisisombululo sokumboza esinobungani nemvelo.
4. Isixazululo Sokumboza I-Substrate Se-Ceramic sika-Zhenhua Vacuum
I-DPC Horizontal Inline Coater, Uhlelo Lokumboza Oluhambisana Ne-PVD Oluzenzakalelayo Ngokugcwele
Izinzuzo Zemishini:
Umklamo Ohlanganisiwe: Umugqa wokukhiqiza usebenzisa umklamo ohlanganisiwe, ovumela ukwanda okuguquguqukayo noma ukunciphisa izindawo ezisebenzayo njengoba kudingeka.
Ithagethi Elijikelezayo Eline-Sputtering Encane: Lobu buchwepheshe bulungele ukufaka izendlalelo zefilimu ezincane ngaphakathi kwemigodi emincane, okuqinisekisa ukufana kanye nekhwalithi.
Ukuhlanganiswa Okungenamthungo Namarobhothi: Uhlelo lungahlanganiswa kalula nezingalo zamarobhothi, okuvumela ukusebenza komugqa wokuhlanganisa okuqhubekayo nokuzinzile ngokuzenzakalelayo okuphezulu.
Uhlelo Lokulawula Nokuqapha Oluhlakaniphile: Luhlonyiswe ngohlelo lokulawula nokuqapha oluhlakaniphile, luhlinzeka ngokutholwa okuphelele kwezingxenye kanye nedatha yokukhiqiza, okuqinisekisa ikhwalithi kanye nokusebenza kahle.
Ububanzi Bokusetshenziswa:
Iyakwazi ukufaka izinhlobo ezahlukene zamafilimu ensimbi ayisisekelo, njenge-Ti, Cu, Al, Sn, Cr, Ag, Ni, njll. Lawa mafilimu asetshenziswa kabanzi ezingxenyeni ze-elekthronikhi ze-semiconductor, kufaka phakathi ama-substrates e-ceramic, ama-capacitor e-ceramic, ama-bracket e-ceramic e-LED, nokuningi.
— Lesi sihloko sikhishwe ngumkhiqizi womshini wokumboza we-DPC copper depositionI-Zhenhua Vacuum
Isikhathi sokuthunyelwe: Feb-24-2025