Kwishishini le-elektroniki lanamhlanje, ii-substrates ze-ceramic zisetyenziswa kakhulu njengezixhobo zokupakisha ze-elektroniki ezibalulekileyo kwi-power semiconductors, izibane ze-LED, iimodyuli zamandla, kunye nezinye iinkalo. Ukuphucula ukusebenza kunye nokuthembeka kwee-substrates ze-ceramic, inkqubo ye-DPC (Direct Plating Copper) ivele njengetekhnoloji yokugquma esebenza kakuhle kakhulu nechanekileyo, yaba yinkqubo ephambili kwimveliso ye-ceramic substrates.
No.1 YintoniInkqubo yokuGcoba i-DPC?
Njengoko igama lisitsho, inkqubo yokugquma i-DPC ibandakanya ukugquma ngokuthe ngqo ubhedu phezu komphezulu wesiseko se-ceramic, ukoyisa imida yobuchwephesha yeendlela zokuncamathisela i-copper foil yendabuko. Xa kuthelekiswa neendlela zesiqhelo zokuqhobosha, inkqubo yokugquma i-DPC iphucula kakhulu ukunamathelana phakathi komaleko wobhedu kunye nesiseko se-ceramic ngelixa inika ukusebenza kakuhle kwemveliso kunye nokusebenza kombane okuphezulu.
Kwinkqubo yokugquma i-DPC, umaleko wokugquma wekopolo wenziwa kwi-ceramic substrate ngokusebenzisa ii-chemical okanye ii-electrochemical reactions. Le ndlela inciphisa imiba yokuqhekeka kwe-delamination ebonakala kwiinkqubo zendabuko zokubopha kwaye ivumela ulawulo oluchanekileyo lokusebenza kombane, ukuhlangabezana neemfuno ezingqongqo zemizi-mveliso.
I-No.2 DPC Coating Process Flow
Inkqubo ye-DPC inamanyathelo aliqela abalulekileyo, ngalinye libalulekile kumgangatho kunye nokusebenza kwemveliso yokugqibela.
1. Ukubhola ngeLaser
Ukubhola nge-laser kwenziwa kwi-ceramic substrate ngokweemfuno zoyilo, kuqinisekiswa ukuba imingxunya ibekwe njani kunye nobukhulu bayo. Eli nyathelo lenza kube lula ukwenziwa kwe-electroplating kunye nokwakheka kwesekethe.
2. Ukwaleka kwePVD
Itekhnoloji yePhysical Vapor Deposition (PVD) isetyenziselwa ukufaka ifilimu yobhedu ebhityileyo kwi-ceramic substrate. Eli nyathelo liphucula ukuhanjiswa kombane kunye nobushushu be-substrate ngelixa liphucula ukunamathela komphezulu, liqinisekisa umgangatho womaleko wobhedu ofakwe nge-electroplated olandelayo.
3. Ukuqina kwe-Electroplating
Ngokwakha phezu kwe-PVD coating, i-electroplating isetyenziselwa ukwenza umaleko wobhedu ube mkhulu. Eli nyathelo lomeleza ukuqina kunye nokuqhuba komgangatho womaleko wobhedu ukuze kuhlangatyezwane neemfuno zezicelo zamandla aphezulu. Ubukhulu bomaleko wobhedu bunokulungiswa ngokusekelwe kwiimfuno ezithile.
4. Ukupeyinta iipatheni zesekethe
Iindlela zokusebenzisa i-photolithography kunye neendlela zokugrumba iikhemikhali zisetyenziselwa ukudala iipateni zesekethe ezichanekileyo kumaleko wobhedu. Eli nyathelo libalulekile ekuqinisekiseni ukuhanjiswa kombane kunye nokuzinza kwesekethe.
5. Imaski yeSolder kunye nokuMakisha
Umaleko wemaski yesolder usetyenziswa ukukhusela iindawo ezingahambisi umbane kwisekethe. Olu maleko luthintela ii-short circuits kwaye luphucula iipropati zokukhusela ze-substrate.
6. Unyango Lomphezulu
Ukucoca umphezulu, ukupolisha, okanye ukugquma kwenziwa ukuqinisekisa ukuba umphezulu uthambile kwaye kususwe naziphi na izinto ezingcolisayo ezinokuchaphazela ukusebenza. Unyango lomphezulu lukwaphucula ukumelana nokugqwala kwesiseko.
7. Ukubumba ngeLaser
Okokugqibela, ukucubungula nge-laser kusetyenziswa ukugqiba ngokweenkcukacha, ukuqinisekisa ukuba i-substrate iyahlangabezana neemfuno zoyilo ngokwemilo nobukhulu. Eli nyathelo libonelela ngomatshini wokulungisa ngokuchanekileyo, ngakumbi kwizinto ezimile ngendlela entsonkothileyo ezisetyenziswa kwizicelo ze-elektroniki nezangaphakathi.
Inzuzo ye-3 yeNkqubo yokuGcoba i-DPC
Inkqubo yokugquma i-DPC inikezela ngeenzuzo ezininzi ezibalulekileyo kwimveliso ye-ceramic substrate, kuquka:
1. Amandla Okuncamathela Aphezulu
Inkqubo ye-DPC idala unxibelelwano oluqinileyo phakathi komaleko wobhedu kunye nesiseko se-ceramic, nto leyo ephucula kakhulu ukuqina kunye nokumelana nokukrazuka komaleko wobhedu.
2. Ukusebenza koMbane okuBalaseleyo
Ii-substrates ze-ceramic ezifakwe nge-copper zibonisa ukuhanjiswa kombane kunye nobushushu okugqwesileyo, okuphucula ukusebenza kwezixhobo ze-elektroniki ngempumelelo.
3. Ulawulo oluPhezulu oluchanekileyo
Inkqubo ye-DPC ivumela ulawulo oluchanekileyo kubukhulu kunye nomgangatho womaleko wobhedu, ihlangabezana neemfuno ezingqongqo zombane kunye nezoomatshini kwiimveliso ezahlukeneyo.
4. Ubuhlobo kwiNdalo
Xa kuthelekiswa neendlela zendabuko zokubopha i-copper foil, inkqubo ye-DPC ayifuni zininzi iikhemikhali eziyingozi, nto leyo eyenza ukuba ibe sisisombululo sokugquma esinobuhlobo nokusingqongileyo.
4. Isisombululo se-Zhenhua Vacuum's Ceramic Substrate Coating Solution
I-DPC Horizontal Inline Coater, Inkqubo Yokugquma Eyi-PVD Ezenzekelayo Ngokupheleleyo
Iingenelo zezixhobo:
Uyilo lweModular: Umgca wemveliso usebenzisa uyilo lweModular, ovumela ukwandiswa okuguquguqukayo okanye ukunciphisa iindawo ezisebenzayo njengoko kufuneka.
Ithagethi Ejikelezayo Ene-Engile Encinci Yokutshiza: Le teknoloji ifanelekile ekufakeni iileya zefilimu ezincinci ngaphakathi kwimingxuma enobubanzi obuncinci, ukuqinisekisa ukufana kunye nomgangatho.
Ukuhlanganiswa Okungenamthungo NeeRobhothi: Le nkqubo inokudityaniswa ngokungenamthungo neengalo zerobhothi, nto leyo evumela ukusebenza komgca wokuhlanganisa okuqhubekayo nokuzinzileyo kunye nokuzinza okuphezulu.
Inkqubo yoLawulo nokubeka iliso ekrelekrele: Ixhotyiswe ngenkqubo yokulawula nokubeka iliso ekrelekrele, ibonelela ngokuchongwa okubanzi kwezixhobo kunye nedatha yemveliso, iqinisekisa umgangatho kunye nokusebenza kakuhle.
Ububanzi besicelo:
Iyakwazi ukufaka iintlobo ngeentlobo zeefilimu zesinyithi ezisisiseko, ezifana neTi, Cu, Al, Sn, Cr, Ag, Ni, njl. Ezi filimu zisetyenziswa kakhulu kwiinxalenye ze-elektroniki ze-semiconductor, kubandakanya ii-substrates ze-ceramic, ii-capacitors ze-ceramic, ii-brackets ze-ceramic ze-LED, nokunye.
— Eli nqaku likhutshwe ngumvelisi womatshini wokugquma i-DPC copper depositionI-Zhenhua Vacuum
Ixesha leposi: Februwari-24-2025