Ngophuhliso olukhawulezileyo lwetekhnoloji yokupakisha ephucukileyo, i-TGV (Through Glass Via) kancinci kancinci iba sisisombululo esiphambili sokudibanisa izixhobo zeglasi. Isebenzisa iingenelo zayo zokulahleka okuphantsi kwe-dielectric, uzinzo oluhle kakhulu lobushushu, ukuchaneka okuphezulu koomatshini, kunye neempawu zobushushu ezinamandla, i-TGV ibonakalise ukusebenza okugqwesileyo kunxibelelwano lwe-optical, i-MEMS, ii-sensors, kunye nee-interconnects zesantya esiphezulu, kwaye ngoku iyanda ukuya kwiimeko zokusetyenziswa okuphezulu.
Nangona kunjalo, ukuguquka kwezakhiwo ze-TGV kuzisa nemingeni emitsha yokuvelisa: encinci nge-diameters, i-geometries eyinkimbinkimbi ngakumbi, kunye nokwanda rhoqo kwe-aspect ratios. Ngokukodwa, phantsi kweemeko ze-30 μm nge-diameter kunye ne-aspect ratios ezidlula i-10:1, ukufikelela kwi-seed layer deposition efanayo ngaphakathi kwi-through-via kuye kwaqatshelwa njengenye yezona ngxaki zibalulekileyo. Nangona ingabonakali kangako kwikhonkco lenkqubo, eli nyathelo limisela ngokuthe ngqo ukusebenza kombane wesixhobo kunye nokuthembeka kwexesha elide.
Imingeni yangoku yeNombolo 1 kwiMicro-Via Coating
Kwiinkqubo ze-TGV kunye ne-TSV, ii-diameters eziqhelekileyo zingaba ncinci njenge-30 μm, kunye neemfuno zomlinganiselo wobungakanani obungaphezulu kwe-10:1. Phantsi kwezi meko, iindlela zokugquma eziqhelekileyo zijongene nemida eliqela:
Iindawo ezingasebenziyo: Iziphumo ezinamandla zokufihla umthunzi ecaleni kweendonga zihlala zikhokelela kwiifilimu ezingaqhubekiyo, nto leyo eyonakalisa ukuhanjiswa komoya kunye nokungatshisi komoya.
Ukungalingani kobukhulu befilimu: Umahluko omkhulu phakathi kweendawo ezivulekileyo nezisezantsi kubangela iingxaki zokumelana nendawo.
Ukuhambelana kwezinto ezininzi okwaneleyo: Xa ubeka izinto ezininzi ezifana neCu, Ti, W, Ni, kunye nePt kwiglasi okanye kwi-silicon substrates, kunzima ukuqinisekisa ukunamathela kunye nokufana kuzo zonke iileya.
Ezi ngxaki zichaphazela ngokuthe ngqo isivuno, zonyusa umngcipheko wokuphinda usebenze kunye neendleko zenkqubo, kwaye zithintela ukusebenza kakuhle kokuvelisa ngomthamo omkhulu.
Isisombululo se-ZHENHUA Vacuum Deep-Via Coating
Iingenelo zezixhobo:
Ukulungiswa kweDeep-Via Coating
Ngobuchwepheshe be-ZHENHUA bokugquma nge-deep-via, ukufakwa kwembewu efanayo kunokufezekiswa nakwii-vias ezincinci njenge-30 μm ububanzi, kunye nomlinganiselo wobungakanani odlula i-10:1—ukunqoba imingeni yexesha elide kwi-deep-via coating enzima.
Ukwenziwa ngokwezifiso xa kufuneka, Inkxaso yeSubstrate yobukhulu obuninzi
Iyakwazi ukucubungula ubungakanani obahlukeneyo bezinto zeglasi, kuquka i-600×600 mm, i-510×515 mm, kunye neefomathi ezinkulu.
Ukuguquguquka kwenkqubo kunye nokuhambelana kwezinto ezininzi
Le nkqubo ixhasa iifilimu ezibhityileyo nezisebenzayo ezifana neCu, Ti, W, Ni, kunye nePt, nto leyo evumela izisombululo ezenzelwe iimfuno zombane kunye nokumelana nokugqwala.
Ukusebenza kweZixhobo eziZinzileyo kunye noLondolozo oluLula
Ixhotyiswe ngenkqubo yokulawula ekrelekrele, esi sixhobo senza ukuba kube lula ukulungelelanisa iiparameter ngokuzenzekelayo kunye nokujonga ubunye befilimu ngexesha langempela. Uyilo lweModular luqinisekisa ukuba kulula ukugcinwa kwaye lunciphisa ixesha lokungasebenzi.
Ububanzi besicelo:
Isebenza kwiinkqubo zokupakisha eziphambili ze-TGV/TSV/TMV, ivumela ukugqunywa komaleko wembewu kwizakhiwo ezinzulu ezinemilinganiselo yobungakanani ukuya kuthi ga kwi-10:1.
Njengoko imakethi yokupakisha ephucukileyo iqhubeka nokukhula, imfuno yee-micro-vias kunye nezakhiwo ezinomlinganiselo ophezulu wobungakanani iya kwanda ngakumbi. Itekhnoloji yokupakisha enzulu ye-ZHENHUA Vacuum ibonelela ngesisombululo esinokwandiswa, esilungele ukuveliswa ngobuninzi kwimingeni ebalulekileyo yokupakisha kwi-TGV nakwezinye iinkqubo zokupakisha zesizukulwana esilandelayo, nto leyo ephucula ukusebenza kakuhle kokupakisha kunye nokuhambelana kwemveliso.
—Eli nqaku lipapashwe ngu izixhobo zokugquma nge-vacuum umenzi we-Zhenhua Vacuum
Ixesha lokuthumela: Agasti-18-2025