Kwishishini lale mihla le-elektroniki, ii-substrates ze-ceramic zisetyenziswa ngokubanzi njengezinto eziyimfuneko zokupakishwa kwe-elektroniki kwii-semiconductors zamandla, ukukhanya kwe-LED, iimodyuli zamandla, kunye namanye amacandelo. Ukuphucula ukusebenza kunye nokuthembeka kwee-substrates ze-ceramic, inkqubo ye-DPC (i-Direct Plating Copper) iye yavela njengobugcisa obuphezulu kunye nobuchwephesha bokugquma, ibe yinkqubo engundoqo kwimveliso ye-ceramic substrate.
No.1 Yintoni iInkqubo yoKwaleka iDPC?
Njengoko igama libonisa, inkqubo yokugquma i-DPC ibandakanya ukugquma ubhedu ngokuthe ngqo kumphezulu we-ceramic substrate, ukoyisa imida yobugcisa yeendlela zokuncamathisela zefoyile yobhedu. Xa kuthelekiswa neendlela eziqhelekileyo zokudibanisa, inkqubo yokugqoka i-DPC iphucula ngokuphawulekayo ukunamathela phakathi komgangatho wobhedu kunye ne-substrate ye-ceramic ngelixa inikezela ngokusebenza okuphezulu kwemveliso kunye nokusebenza kombane okuphezulu.
Kwinkqubo yokugqoka i-DPC, i-copper layering layer yenziwe kwi-ceramic substrate ngokusebenzisa iikhemikhali okanye ukuphendula kwe-electrochemical. Le ndlela inciphisa imiba ye-delamination edla ngokubonwa kwiinkqubo zekhonkco zemveli kwaye ivumela ulawulo oluchanekileyo ekusebenzeni kombane, ukuhlangabezana neemfuno ezingqongqo zemizi-mveliso.
No.2 DPC Coating Process Flow
Inkqubo yeDPC inamanyathelo angundoqo aliqela, ngalinye libalulekile kumgangatho kunye nokusebenza kwemveliso yokugqibela.
1. ILaser Drilling
I-Laser drilling iyenziwa kwi-substrate ye-ceramic ngokwemigaqo yoyilo, ukuqinisekisa ukubekwa komngxuma ochanekileyo kunye nemilinganiselo. Eli nyathelo liququzelela i-electroplating elandelayo kunye nokwakheka kwephethini yesekethe.
2. PVD Coating
Itekhnoloji ye-Physical Vapor Deposition (PVD) isetyenziselwa ukufaka ifilimu yobhedu ebhityileyo kwisiseko seceramic. Eli nyathelo liphucula umbane kunye ne-thermal conductivity ye-substrate ngelixa iphucula ukunamathela komphezulu, iqinisekisa umgangatho we-electroplated copper layer elandelayo.
3. Electroplating Thickening
Ukwakha phezu kwePVD yokwambathisa, i-electroplating isetyenziselwa ukutyebisa umaleko wobhedu. Eli nyathelo liqinisa ukuqina kunye nokuhamba komgangatho wobhedu ukuhlangabezana neemfuno zezicelo zamandla aphezulu. Ubunzima bomgangatho wobhedu bunokulungelelaniswa ngokusekelwe kwiimfuno ezithile.
4. Ipateni yeSekethe
I-Photolithography kunye neendlela zokudibanisa iikhemikhali zisetyenziselwa ukudala iipateni zesekethe ezichanekileyo kumgangatho wobhedu. Eli nyathelo libalulekile ekuqinisekiseni ukuhanjiswa kombane kunye nokuzinza kwesekethe.
5. IMaski yeSolder kunye nokuMakisha
I-mask layer ye-solder isetyenziselwa ukukhusela iindawo ezingaqhubekiyo zesekethe. Olu luhlu luthintela iisekethe ezimfutshane kwaye luphucula iimpawu ze-insulation ze-substrate.
6. Unyango loMphezulu
Ukucocwa komphezulu, ukupolisha, okanye unyango lokugquma luyenziwa ukuze kuqinisekiswe indawo egudileyo kwaye kususwe naziphi na izinto ezingcolisayo ezinokuchaphazela ukusebenza. Unyango lwakumphezulu lukwaphucula ukuxhathisa umhlwa kwi-substrate.
7. Ukubunjwa kweLaser
Ekugqibeleni, ukusetyenzwa kwe-laser kusetyenziselwa ukugqitywa okuneenkcukacha, ukuqinisekisa ukuba i-substrate ihlangabezana neenkcukacha zoyilo ngokwemilo kunye nobukhulu. Eli nyathelo libonelela ngoomatshini bokuchaneka okuphezulu, ngakumbi kwizinto ezinokwakheka okuntsokothileyo ezisetyenziswa kwi-elektroniki kunye nezicelo zangaphakathi.
No.3 Izinto eziluncedo kwiNkqubo ye-DPC yoKutyabeka
Inkqubo yokugquma i-DPC ibonelela ngeenzuzo ezininzi ezibalulekileyo kwimveliso ye-ceramic substrate, kuquka:
1. Amandla aphezulu okubambelela
Inkqubo ye-DPC idala ibhondi eyomeleleyo phakathi komgangatho wobhedu kunye ne-ceramic substrate, iphucula kakhulu ukuqina kunye nokumelana ne-peel ye-copper layer.
2. Ukusebenza okuPhezulu koMbane
Ii-substrates ze-ceramic ze-Copper-plated zibonisa i-conductivity egqwesileyo yombane kunye ne-thermal, iphucula ngokufanelekileyo ukusebenza kwamacandelo e-elektroniki.
3. Ulawulo oluchanekileyo oluphezulu
Inkqubo ye-DPC ivumela ulawulo oluchanekileyo phezu kobunzima kunye nomgangatho wobhedu, ukuhlangabezana neemfuno ezingqongqo zombane kunye nezomatshini zeemveliso ezahlukeneyo.
4. UkuLungelana kwendalo
Xa kuthelekiswa neendlela zokudibanisa i-foil ye-copper yendabuko, inkqubo ye-DPC ayifuni inani elikhulu leekhemikhali ezinobungozi, okwenza kube isisombululo sokugubungela indalo.
4. Isisombululo seCeramic Substrate Coating yeZhenhua Vacuum
DPC Horizontal Inline Coater, Ngokupheleleyo oluzenzekelayo PVD Inline Coating System
Izixhobo eziluncedo:
Uyilo lweModyuli: Umgca wokuvelisa wamkela uyilo lwemodyuli, ukuvumela ukwandiswa okuguquguqukayo okanye ukunciphisa iindawo ezisebenzayo njengoko kufuneka.
Ithagethi ejikelezayo kunye ne-Sputtering-Angle-Angle Small: Le teknoloji ifanelekile ukubeka iileya zefilimu ezincinci ngaphakathi kwemingxunya emincinci, iqinisekisa ukufana kunye nomgangatho.
Ukuhlanganiswa okungenamthungo kunye neeRobhothi: Inkqubo inokudityaniswa ngokungenamthungo kunye neengalo zerobhothi, ivumela umgca wokuhlanganisa oqhubekayo kunye nozinzile kunye ne-automation ephezulu.
Inkqubo yoLawulo lweNgcali kunye nokuHlola: Ukuxhotyiswa ngenkqubo yokulawula kunye nokubeka iliso ehlakaniphile, inika ukufumanisa okubanzi kwamacandelo kunye nedatha yokuvelisa, ukuqinisekisa umgangatho kunye nokusebenza kakuhle.
Umda weSicelo:
Iyakwazi ukufaka iindidi zeefilimu zentsimbi, ezifana neTi, Cu, Al, Sn, Cr, Ag, Ni, njl. Ezi filimu zisetyenziswa ngokubanzi kwi-semiconductor electronic components, kuquka i-ceramic substrates, i-ceramic capacitors, izibiyeli ze-ceramic ze-LED, kunye nokunye.
— Eli nqaku likhutshwe ngumvelisi womatshini wokugquma umatshini we-DPCIvacuum yaseZhenhua
Ixesha lokuposa: Feb-24-2025