Indastering ea sejoale-joale ea elektroniki, li-substrates tsa ceramic li sebelisoa haholo e le lisebelisoa tsa bohlokoa tsa ho paka tsa elektroniki ho li-semiconductors tsa matla, mabone a LED, li-module tsa motlakase le likarolo tse ling. Ho matlafatsa ts'ebetso le ts'epahalo ea li-substrates tsa ceramic, ts'ebetso ea DPC (Direct Plating Copper) e hlahile e le theknoloji e sebetsang hantle haholo le e nepahetseng ea ho roala, e fetoha ts'ebetso ea mantlha tlhahisong ea li-ceramic substrate.
No.1 Ke engMokhoa oa ho roala oa DPC?
Joalo ka ha lebitso le fana ka maikutlo, ts'ebetso ea ho roala ha DPC e kenyelletsa ho roala koporo ka kotloloho holim'a substrate ea ceramic, ho hlola mefokolo ea tekheniki ea mekhoa ea sehokelo ea koporo ea setso. Ha ho bapisoa le mekhoa e tloaelehileng ea ho kopanya, mokhoa oa ho roala oa DPC o ntlafatsa haholo ho khomarela pakeng tsa lera la koporo le substrate ea ceramic ha e ntse e fana ka katleho e phahameng ea tlhahiso le ts'ebetso e phahameng ea motlakase.
Ts'ebetsong ea ho roala ha DPC, lesela la ho roala la koporo le thehoa holim'a substrate ea ceramic ka lik'hemik'hale kapa tsa electrochemical. Mokhoa ona o fokotsa litaba tsa delamination tse atisang ho bonoa lits'ebetsong tsa setso tsa tlamahano mme o lumella taolo e nepahetseng holim'a ts'ebetso ea motlakase, ho fihlela litlhoko tse matla tsa indasteri.
No.2 DPC Coating Process Flow
Ts'ebetso ea DPC e na le mehato e 'maloa ea bohlokoa, e' ngoe le e 'ngoe e le ea bohlokoa ho boleng le ts'ebetso ea sehlahisoa sa ho qetela.
1. Ho phunya Laser
Ho cheka ka laser ho etsoa holim'a substrate ea ceramic ho latela litlhaloso tsa moralo, ho netefatsa boemo bo nepahetseng ba lesoba le boholo. Mohato ona o thusa ho latela mokhoa oa electroplating le sebopeho sa potoloho.
2. Ho roala ha PVD
Theknoloji ea Physical Vapor Deposition (PVD) e sebelisoa ho beha filimi e tšesaane ea koporo holim'a substrate ea ceramic. Mohato ona o ntlafatsa conductivity ea motlakase le ea mocheso oa substrate ha e ntse e ntlafatsa ho khomarela holimo, ho netefatsa boleng ba lera la koporo le latelang la electroplated.
3. Electroplating Thickening
Ho aha holim'a seaparo sa PVD, electroplating e sebelisetsoa ho tiisa lera la koporo. Mohato ona o matlafatsa nako e telele le conductivity ea lera la koporo ho finyella litlhoko tsa lisebelisoa tse phahameng tsa matla. Botenya ba lera la koporo bo ka fetoloa ho latela litlhoko tse itseng.
4. Sebopeho sa Potoloho
Photolithography le mekhoa ea etching ea lik'hemik'hale li sebelisoa ho theha mekhoa e nepahetseng ea potoloho holim'a lera la koporo. Mohato ona ke oa bohlokoa bakeng sa ho netefatsa hore motlakase o tsamaisana le botsitso le botsitso ba potoloho.
5. Solder Mask le Ho tšoaea
Ho sebelisoa mask a solder ho sireletsa libaka tse se nang conductive tsa potoloho. Lera lena le thibela lipotoloho tse khutšoane le ho ntlafatsa thepa ea ho kenya letsoho ea substrate.
6. Kalafo ea Bokaholimo
Ho hloekisa holim'a metsi, ho bentša, kapa ho etsa liphekolo tsa ho roala holim'a metsi ho etsa bonnete ba hore sebaka se boreleli le ho tlosa litšila tse ka amang ts'ebetso. Liphekolo tse ka holim'a metsi li boetse li ntlafatsa ho hanyetsa ho bola ha substrate.
7. Laser Shaping
Qetellong, ts'ebetso ea laser e sebelisoa bakeng sa ho phethela ka botlalo, ho netefatsa hore substrate e kopana le litlhaloso tsa moralo ho latela sebopeho le boholo. Mohato ona o fana ka machining a holimo-limo, haholo-holo bakeng sa likarolo tse rarahaneng tse sebelisoang lits'ebetsong tsa elektronike le tsa ka hare.
No.3 Melemo ea Ts'ebetso ea ho Coating ea DPC
Ts'ebetso ea ho roala ha DPC e fana ka melemo e mengata ea bohlokoa tlhahisong ea substrate ea ceramic, ho kenyelletsa:
1. Matla a Ho khomarela a Phahameng
Ts'ebetso ea DPC e theha maqhama a matla pakeng tsa lera la koporo le substrate ea ceramic, e ntlafatsang haholo ho tšoarella le ho hanyetsa peel ea lera la koporo.
2. Ts'ebetso e Phahameng ea Motlakase
Li-substrates tsa ceramic tse entsoeng ka koporo li bonts'a ts'ebetso e ntle ea motlakase le ea mocheso, e ntlafatsang ts'ebetso ea likarolo tsa elektronike ka katleho.
3. Taolo e nepahetseng e phahameng
Ts'ebetso ea DPC e lumella taolo e nepahetseng holim'a botenya le boleng ba koporo, ho fihlela litlhoko tse thata tsa motlakase le tsa mochini tsa lihlahisoa tse fapaneng.
4. Botsoalle ba Tikoloho
Ha ho bapisoa le mekhoa e tloaelehileng ea ho tlama ha foil ea koporo, ts'ebetso ea DPC ha e hloke lik'hemik'hale tse ngata tse kotsi, e leng se etsang hore e be tharollo ea ho roala e sireletsang tikoloho.
4. Tharollo ea ho Koaheloa ka Letlapa la Ceramic ea Zhenhua Vacuum
DPC Horizontal Inline Coater, PVD Inline Coating System e Ikemetseng ka Botlalo
Melemo ea Lisebelisoa:
Moralo oa Modular: Mohala oa tlhahiso o nka moralo oa modular, o lumellang katoloso e bonolo kapa phokotso ea libaka tsa ts'ebetso ha ho hlokahala.
Sepheo sa ho Potoloha ka Sputtering ea Li-Angle tse Nyenyane: Theknoloji ena e loketse bakeng sa ho kenya likarolo tse tšesaane tsa filimi ka har'a masoba a bophara bo nyane, ho netefatsa ho tšoana le boleng.
Khokahano e sa Feleng le Liroboto: Sistimi e ka kopanngoa ka mokhoa o se nang moeli le matsoho a robotiki, e nolofalletsang ts'ebetso e tsoelang pele le e tsitsitseng ea mohala oa kopano ka boiketsetso bo phahameng.
Sistimi e Bohlale ea Taolo le Tlhokomelo: E na le sistimi e bohlale ea ho laola le ho beha leihlo, e fana ka tlhahlobo e felletseng ea likarolo le data ea tlhahiso, ho netefatsa boleng le ts'ebetso.
Sebaka sa Kopo:
E khona ho kenya mefuta e fapaneng ea lifilimi tsa tšepe tsa tšepe, tse kang Ti, Cu, Al, Sn, Cr, Ag, Ni, joalo-joalo Lifilimi tsena li sebelisoa haholo likarolong tsa elektronike tsa semiconductor, ho akarelletsa le li-ceramic substrates, li-ceramic capacitors, li-brackets tsa ceramic tsa LED, le tse ling.
- Sengoliloeng sena se lokollotsoe ke moetsi oa mochini oa koporo oa DPCPhula ea Zhenhua
Nako ea poso: Feb-24-2025