Nekukura nekukurumidza kwetekinoroji yepamusoro yekurongedza, TGV (Kuburikidza neGlass Via) iri kuva mhinduro yakakosha yekubatanidza magirazi. Ichishandisa mabhenefiti ayo ekurasikirwa nemagetsi mashoma, kugadzikana kwakanyanya kwekupisa, kunyatsogadzira michina, uye hunhu hwakasimba hwekuputira, TGV yakaratidza kushanda kwakanaka mukutaurirana kwemaziso, MEMS, masensa, uye maconnections ekumhanya kwepamusoro, uye ikozvino iri kuwedzera mune mamwe mashandisirwo emhando yepamusoro.
Zvisinei, kushanduka kwezvimiro zveTGV kunounzawo matambudziko matsva ekugadzira: kudiki kuburikidza nedhayamita, geometries dzakaoma, uye kuwedzera nguva dzose kweaspect ratios. Kunyanya, pasi pemamiriro e30 μm kuburikidza nedhayamita uye aspect ratios dzinopfuura 10:1, kuwana seed layer deposition yakafanana mukati methrough-via kwagara kuchizivikanwa seimwe yezvinetso zvakakosha. Kunyangwe zvisingaonekwe zvakanyanya mu process chain, danho iri rinotarisa zvakananga mashandiro emagetsi emudziyo uye kuvimbika kwenguva refu.
Nhamba 1 Matambudziko Aripo Pari Zvino muMicro-Via Coating
Mumaitiro eTGV neTSV, dhayamita dzakajairika dzinogona kuva diki kusvika 30 μm, nezvinodiwa neaspect ratio zvinopfuura 10:1. Pasi pemamiriro ezvinhu aya, nzira dzemazuva ano dzekuputira dzinosangana nemiganhu yakati wandei:
Nzvimbo dzisina kudzika: Mhedzisiro yakasimba yemumvuri kuburikidza nemadziro emativi inowanzo tungamira kumafirimu asina kuenderera mberi, zvichikanganisa kufambisa kwemhepo uye kupenya kwemhepo.
Kusafanana kweukobvu hwefirimu: Kusiyana kukuru kwehuwandu hwekuiswa kwechinhu pakati pemaburi nemaburi kunokonzera matambudziko ekudzivirira kwenzvimbo yacho.
Kusakwana kwekubatana kwezvinhu zvakawanda: Pakuisa zvinhu zvakawanda zvakaita seCu, Ti, W, Ni, uye Pt pagirazi kana silicon substrates, zvakaoma kuona kuti zvinonamira uye zvakafanana pazvikamu zvese.
Matambudziko aya anokanganisa zvakananga goho, anowedzera njodzi yekugadzirisa patsva uye mutengo wekugadzirisa, uye anoderedza kushanda zvakanaka kwekugadzira zvinhu zvakawanda.
Nhamba 2. ZHENHUA Vacuum Deep-Via Coating Solution
Zvakanakira Midziyo:
Yakagadziridzwa Yakadzika-Kupinda Nekuputira
Nekushandisa tekinoroji yeZHENHUA yekuisa mbeu muzvikamu zvakasiyana-siyana, kuisa mbeu muzvikamu zvakafanana kunogona kuitwa kunyangwe muzvikamu zvidiki se30 μm mudhayamita, neaspect ratios dzinopfuura 10:1—kukunda matambudziko enguva refu mukuisa mbeu muzvikamu zvakaoma.
Kugadzirisa Zvinhu Paunenge Uchida, Rutsigiro rweSubstrate Dzakawanda
Inokwanisa kugadzirisa saizi dzakasiyana dzemagirazi, kusanganisira 600×600 mm, 510×515 mm, uye mafomati akakura.
Kuchinjika Kwemaitiro Nekuenderana Kwezvinhu Zvakawanda
Sisitimu iyi inotsigira mafirimu matete anofambisa magetsi uye anoshanda zvakanaka akadai seCu, Ti, W, Ni, uye Pt, zvichiita kuti zvigadziriswe zvinoenderana nezvinodiwa zvemagetsi uye zvinodzivirira ngura.
Kushanda Kwemidziyo Yakagadzikana uye Kugadzirisa Zviri Nyore
Yakashongedzerwa nehurongwa hwekudzora hwakangwara, michina iyi inobvumira kugadzirisa otomatiki maparamita uye kutarisa kufanana kweukobvu hwefirimu panguva chaiyo. Dhizaini yemodular inoita kuti kugadzirisa kuve nyore uye inoderedza nguva yekushanda.
Mashandisirwo Ekushandisa:
Inoshanda kune maitiro epamusoro eTGV/TSV/TMV ekurongedza, zvichiita kuti kuputira kwembeu muzvikamu zvakadzika zvine aspect ratios inosvika 10:1.
Sezvo musika wekurongedza wepamusoro uchiramba uchikura, kudiwa kwema micro-vias uye ma high aspect ratio structures kuchawedzera zvakanyanya. Tekinoroji yeZHENHUA Vacuum ye deep-via coating inopa mhinduro inokwenenzverwa, yakagadzirira kugadzirwa kwakawanda kumatambudziko akakosha ekuputira muTGV nedzimwe nzira dzekuputira dzechizvarwa chinotevera, zvichiwedzera kushanda zvakanaka kwekuputira uye kugara zvakanaka kwechigadzirwa.
—Nyaya iyi yakaburitswa na midziyo yekunamira ye vacuum mugadziri Zhenhua Vacuum
Nguva yekutumira: Nyamavhuvhu-18-2025