Iingubo zePVD (Physical Vapor Deposition) zisetyenziswa ngokubanzi iindlela zokwenza iifilimu ezibhityileyo kunye nokwaleka komhlaba. Phakathi kweendlela eziqhelekileyo, i-thermal evaporation kunye ne-sputtering ziinkqubo ezimbini ezibalulekileyo ze-PVD. Nalu ulwahlulo lwento nganye:
1. I-Thermal Evaporation
- Umgaqo:Izinto eziphathekayo zifudunyezwa kwigumbi le-vacuum de zibe ngumphunga okanye i-sublimates. Isixhobo esiphuhliweyo emva koko sijiya kwi-substrate ukwenza ifilimu encinci.
- Inkqubo:
- Isixhobo somthombo (isinyithi, i-ceramic, njl.) sifudunyezwa, ngokuqhelekileyo sisebenzisa ukufudumeza okuxhasiweyo, i-electron beam, okanye i-laser.
- Nje ukuba izinto zifikelele kwindawo yokuphuphuma kwayo, iiathomu okanye iiathomu zishiya umthombo kwaye zihambe nge-vacuum ukuya kwi-substrate.
- I-athomu ephuhliweyo ijiya kumphezulu we-substrate, yenze umaleko omncinci.
- Usetyenziso:
- Ngokuqhelekileyo isetyenziselwa ukubeka isinyithi, i-semiconductors, kunye ne-insulators.
- Izicelo zibandakanya iingubo zamehlo, ukugqiba ukuhombisa, kunye ne-microelectronics.
- Izinto eziluncedo:
- Amazinga aphezulu okubekwa.
- Ilula kwaye inexabiso elisebenzayo kwizinto ezithile.
- Inokuvelisa iifilimu ezisulungekileyo kakhulu.
- Izinto ezingeloncedo:
- Kukhawulelwe kwizinto eziphathekayo ezinamaqondo aphantsi okunyibilika okanye uxinzelelo oluphezulu lomphunga.
- Inyathelo elingalunganga lokugubungela imiphezulu entsonkothileyo.
- Ukulawulwa okuncinci kokubunjwa kwefilimu kwii-alloys.
2. Ukutshiza
- UmGaqo: Ii-ion ezisuka kwiplasma zikhawuleza ukuya kwinto ekujoliswe kuyo, nto leyo ebangela ukuba ii-athomu zikhutshwe (zitshiswe) ukusuka koko kujoliswe kuko, zize ke zifake kwi-substrate.
- Inkqubo:
- Isixhobo esijoliswe kuyo (isinyithi, i-alloy, njl.) sifakwe kwigumbi, kwaye igesi (ngokuqhelekileyo i-argon) ifakwe.
- Umbane ophezulu usetyenziswa ukwenza iplasma, eyenza i-ionize igesi.
- Iiyoni ezichajiwe kakuhle ezisuka kwiplasma zikhawuleza ukuya kwindawo ekujongwe kuyo kakubi, zikhupha iiathomu ngokwasemzimbeni.
- Ezi athom ke zifaka kwi-substrate, zenze ifilimu encinci.
- Usetyenziso:
- Isetyenziswa kakhulu kwimveliso ye-semiconductor, iglasi yokugquma, kunye nokudala iingubo zokunxiba ezixhathisayo.
- Ilungele ukwenza i-alloy, i-ceramic, okanye ifilimu ezinqabileyo ezinqabileyo.
- Izinto eziluncedo:
- Ingafaka uluhlu olubanzi lwezinto, kubandakanywa isinyithi, i-alloys, kunye nee-oxides.
- Ukufana kwefilimu okugqwesileyo kunye nokugubungela ngamanyathelo, nakwimilo entsonkothileyo.
- Ulawulo oluchanekileyo kubukhulu befilimu kunye nokwakheka.
- Izinto ezingeloncedo:
- Amazinga okubekwa kancinci xa kuthelekiswa nokuvela kobushushu bobushushu.
- Ixabiso elithe kratya ngenxa yokuntsonkotha kwezixhobo kunye nesidingo samandla aphezulu.
Umahluko oPhambili:
- Umthombo wokubekwa:
- Ukufudumala kwe-Thermal kusebenzisa ubushushu ukukhupha izinto, ngelixa ukutshiza kusebenzisa ibhobho ye-ion ukukhupha iiathomu ngokwasemzimbeni.
- Amandla ayafuneka:
- Ubushushu bobushushu bufuna amandla amancinci kunokutshiza kuba buxhomekeke ekufudumezeni endaweni yemveliso yeplasma.
- Izixhobo:
- Ukutshiza kungasetyenziselwa ukufaka uluhlu olubanzi lwezixhobo, kubandakanywa nezo zineendawo eziphezulu zokunyibilika, ekunzima ukuzikhupha zibe ngumphunga.
- Umgangatho wefilimu:
- I-Sputtering ngokubanzi ibonelela ngolawulo olungcono kubukhulu befilimu, ukufana, kunye nokwakheka.
Ixesha lokuposa: Sep-27-2024