Rufin PVD (Physical Vapor Deposition) dabarun da ake amfani da su sosai wajen ƙirƙirar siraran fina-finai da rufin saman. Daga cikin hanyoyin da aka saba amfani da su, ƙafewar zafi da kuma fesawa akwai muhimman hanyoyin PVD guda biyu. Ga taƙaitaccen bayani game da kowannensu:
1. Ƙazantawar Zafi
- Ka'ida:Ana dumama kayan a cikin ɗakin injin dumama har sai ya ƙafe ko ya yi laushi. Sannan kayan da aka tururi ya narke a kan wani abu mai kama da sirara don samar da fim mai sirara.
- Tsarin aiki:
- Ana dumama kayan tushe (ƙarfe, yumbu, da sauransu), yawanci ana amfani da dumama mai jurewa, hasken lantarki, ko laser.
- Da zarar kayan ya kai inda yake ƙafewa, ƙwayoyin halitta ko ƙwayoyin halitta suna barin tushen kuma suna tafiya ta cikin injin zuwa wurin da aka yi amfani da shi.
- Kwayoyin halittar da suka ƙafe suna taruwa a saman substrate ɗin, suna samar da sirara mai kauri.
- Aikace-aikace:
- Ana amfani da shi sosai wajen saka karafa, semiconductors, da insulators.
- Aikace-aikace sun haɗa da fenti na gani, ƙarewar ado, da microelectronics.
- Fa'idodi:
- Babban ƙimar saka hannun jari.
- Mai sauƙi kuma mai araha ga wasu kayan aiki.
- Zai iya samar da fina-finai masu tsafta sosai.
- Rashin amfani:
- An iyakance ga kayan da ke da ƙarancin narkewar abinci ko matsin lamba mai yawa.
- Rashin kyawun ɗaukar matakai a saman abubuwa masu rikitarwa.
- Ƙarancin iko akan tsarin fim don ƙarfe.
2. Watsawa
- Ka'ida: Ana hanzarta ions daga cikin plasma zuwa ga abin da aka nufa, wanda ke sa a fitar da atoms (zubar da su) daga abin da aka nufa, sannan su zuba a kan substrate.
- Tsarin aiki:
- Ana sanya kayan da aka yi niyya (ƙarfe, ƙarfe, da sauransu) a cikin ɗakin, sannan a shigar da iskar gas (yawanci argon).
- Ana amfani da babban ƙarfin lantarki don ƙirƙirar plasma, wanda ke ionizes da iskar gas.
- Ana hanzarta ions ɗin da aka caji da kyau daga cikin plasma zuwa ga abin da aka yi niyya na cajin da ba shi da kyau, suna fitar da ƙwayoyin halitta daga saman.
- Waɗannan ƙwayoyin zarra suna zuba a kan substrate, suna samar da siririn fim.
- Aikace-aikace:
- Ana amfani da shi sosai a masana'antar semiconductor, gilashin shafi, da ƙirƙirar murfin da ke jure lalacewa.
- Ya dace don ƙirƙirar fina-finai masu sirara, yumbu, ko fina-finai masu rikitarwa.
- Fa'idodi:
- Zai iya sanya nau'ikan kayan aiki iri-iri, gami da karafa, gami da oxides.
- Kyakkyawan daidaiton fim da kuma ɗaukar matakai, har ma a kan siffofi masu rikitarwa.
- Daidaitaccen iko kan kauri da abun da ke ciki na fim ɗin.
- Rashin amfani:
- Rage yawan ajiyar kaya idan aka kwatanta da ƙafewar zafi.
- Ya fi tsada saboda sarkakiyar kayan aiki da kuma buƙatar ƙarin makamashi.
Babban Bambanci:
- Tushen Gabatarwa:
- Tururin zafi yana amfani da zafi don ƙafe kayan, yayin da sputtering yana amfani da ion bombardment don kawar da atoms ta jiki.
- Makamashin da ake buƙata:
- Ƙarfin zafi yawanci yana buƙatar ƙarancin kuzari fiye da fesawa domin yana dogara ne akan dumama maimakon samar da plasma.
- Kayan aiki:
- Ana iya amfani da sputtering don ajiye kayayyaki iri-iri, gami da waɗanda ke da wuraren narkewa masu yawa, waɗanda ke da wahalar ƙafewa.
- Ingancin Fim:
- Sputtering gabaɗaya yana ba da iko mafi kyau akan kauri fim, daidaito, da abun da ke ciki.
Lokacin Saƙo: Satumba-27-2024