Equipment Advantage
1.Scalable Functional Configuration
Ichishandisa modular architecture dhizaini, inotsigira kukurumidza kukurumidza nzira dzekugadzira, ichibvumira kukurumidza kuwedzera, kubviswa, uye kurongekazve kwemakamuri anoshanda. Iyo marongerwo emutsetse wekugadzira inogona kuchinjika kuchinjika zvinoenderana nezvinodiwa zvekugadzira.
2.Precision Coating Technology Solution
Nekuvandudza kushandisa diki-angle inotenderera yakanangana neiyo sputtering tekinoroji yakasanganiswa neyakagadziridzwa magineti mhinduro kuti iwane kunyatsozadzwa kwe kuburikidza-gomba zvimiro.
3.Kugamuchirwa kweKutenderera Target Structure
Ichi chimiro chinochengetedza kurasikirwa kwezvinhu uye chinovandudza chinangwa chekushandiswa kwezvinhu. Iyo zvakare inoderedza chinangwa chekutsiva kutenderera, nekudaro ichisimudzira kugadzirwa kwakanaka.
4.Process Control Advantages
Kuburikidza nekugadzirisa kwemagnetron sputtering parameters uye kaviri-sided synchronous deposition tekinoroji, iko kuvharisa kwezvakaomarara zvimiro zvemukati kunovandudzwa zvakanyanya, ukuwo kurasikirwa kwezvinhu kuchideredzwa.
Application:Inokwanisa kugadzirira zvakasiyana-siyana-element metal film layers dzakadai seTi, Cu, Al, Sn, Cr, Ag, Ni, etc. Inoshandiswa zvakanyanya mu semiconductor electronic components, zvakadai seDPC ceramic substrates, ceramic capacitors, thermistors, LED ceramic brackets, nezvimwewo.