PVD txheej: Thermal evaporation thiab sputtering

PVD (Physical Vapor Deposition) txheej txheej yog siv dav siv los tsim cov yeeb yaj kiab nyias thiab cov txheej txheej saum npoo. Ntawm cov txheej txheem, thermal evaporation thiab sputtering yog ob qho tseem ceeb PVD txheej txheem. Ntawm no yog ib qho kev faib ntawm txhua qhov:

1. Thermal Evaporation

• Txoj Cai:Cov khoom yog rhuab nyob rau hauv lub tshuab nqus tsev chamber kom txog thaum nws evaporates los yog sublimates. Cov khoom vaporized ces condenses mus rau ib tug substrate los ua ib tug nyias zaj duab xis.
• Txheej txheem:
• Ib qho khoom siv (hlau, ceramic, thiab lwm yam) yog rhuab, feem ntau yog siv cov cua sov, hluav taws xob, lossis laser.
• Thaum cov khoom mus txog nws qhov chaw evaporation, atoms lossis molecules tawm ntawm qhov chaw thiab taug kev los ntawm lub tshuab nqus tsev mus rau lub substrate.
• Cov evaporated atoms condense rau ntawm qhov chaw ntawm lub substrate, tsim ib txheej nyias.
• Daim ntawv thov:
• Feem ntau siv los tso cov hlau, semiconductors, thiab insulators.
• Cov ntawv thov suav nrog cov txheej txheem kho qhov muag, kho kom zoo nkauj tiav, thiab microelectronics.
• Qhov zoo:
• Siab deposition nqi.
• Yooj yim thiab raug nqi rau qee yam khoom siv.
• Muaj peev xwm tsim tau cov yeeb yaj kiab ntshiab heev.
• Qhov tsis zoo:
• Txwv rau cov khoom uas muaj cov ntsiab lus melting tsawg lossis siab vapor siab.
• Cov kauj ruam tsis zoo ntawm cov txheej txheem nyuaj.
• Tsawg tswj cov yeeb yaj kiab muaj pes tsawg leeg rau alloys.

2. Sputtering

• Lub hauv paus ntsiab lus: Ions los ntawm lub plasma yog nrawm mus rau lub hom phiaj cov khoom, ua rau cov atoms raug tshem tawm (sputtered) ntawm lub hom phiaj, uas tom qab ntawd tso rau hauv lub substrate.
• Txheej txheem:
• Lub hom phiaj cov khoom (hlau, alloy, thiab lwm yam) yog muab tso rau hauv lub chamber, thiab ib tug roj (feem ntau argon) yog qhia.
• Lub high voltage yog siv los tsim ib lub plasma, uas ionizes cov roj.
• Cov txiaj ntsig zoo ions los ntawm cov ntshav ntshav tau nrawm mus rau lub hom phiaj tsis zoo, tshem tawm cov atoms ntawm lub cev.
• Cov atoms no ces tso rau ntawm lub substrate, tsim ib zaj duab xis nyias.
• Daim ntawv thov:
• Dav siv nyob rau hauv semiconductor manufacturing, txheej iav, thiab tsim hnav-resistant coatings.
• Qhov zoo tshaj plaws rau kev tsim cov hlau nplaum, ceramic, lossis cov yeeb yaj kiab nyias nyias.
• Qhov zoo:
• Muaj peev xwm tso tau ntau yam ntaub ntawv, suav nrog hlau, alloys, thiab oxides.
• Zoo heev zaj duab xis uniformity thiab kauj ruam kev pab cuam, txawm nyob rau hauv complex duab.
• Precise tswj ntawm zaj duab xis thickness thiab muaj pes tsawg leeg.
• Qhov tsis zoo:
• Slower deposition tus nqi piv rau thermal evaporation.
• Tus nqi kim dua vim cov cuab yeej siv nyuaj thiab xav tau lub zog ntau dua.

Qhov txawv tseem ceeb:

• Qhov chaw ntawm Deposition:
• Thermal evaporation siv cov cua sov kom evaporate cov khoom, thaum sputtering siv ion bombardment rau lub cev dislodge atoms.
• Yuav tsum muaj zog:
• Thermal evaporation feem ntau xav tau lub zog tsawg dua li sputtering vim nws tso siab rau cua sov ntau dua li cov ntshav plasma.
• Khoom siv:
• Sputtering tuaj yeem siv los tso cov khoom siv dav dav, suav nrog cov ntsiab lus siab melting, uas nyuaj rau evaporate.
• Zaj duab xis zoo:
• Sputtering feem ntau muab kev tswj zoo dua ntawm cov yeeb yaj kiab thickness, uniformity, thiab muaj pes tsawg leeg.