Kubvisa machira, kunozivikanwawo sekutadza kunamatira kana kuti peeling, inyaya inokosha mumhando dzakasiyana dzemachira.maitiro ekubvisa vacuumChiitiko ichi chinoitika kana firimu rakaiswa pasi rikaparadzana nechinhu chiri pasi, zvichikanganisa mashandiro emuviri uye kuvimbika kwechimiro. Kunzwisisa kwakazara kwezvikonzero zvaro kunoda kuongororwa kwakarongeka muzvikamu zvina zvakakosha.
1. Kushaikwa kwekugadzirisa pamusoro pevhu
Simba Repamusoro Risina Kukwana: Zvinhu zvine simba shoma pamusoro (semuenzaniso, PP, PTFE) zvinodzivisa kunyorova zvakanaka, zvichidzivirira kubatana kwakanaka pakati pechiso. Simba repamusoro riri pasi pe40 mN/m rinowanzo da kuti plasma ishande kana kuti chemical priming ishande.
Kuvapo Kwezvinhu Zvinosvibisa: Zvinhu zvinoburitsa tsvina, mafuta, kana hunyoro hwakanyungudutswa zvinogadzira miganhu isina kusimba, zvichiita sezvinhu zvinosvibisa zvinokanganisa kusimba kwekunamatira.
Nzvimbo isina kunaka yekumusoro: Nzvimbo dzakanyatsotsvedzerera hadzina nzvimbo dzinobatanidza michina, nepo nzvimbo dzakanyanya kuomarara dzinogona kusvibisa mafambiro enzvimbo yacho uye kukonzera kushushikana.
2. Nzira dzeKukundikana Dzine chekuita neMaitiro
Kusimba Kwevacuum: Kumanikidzwa kwepasi kunodarika 5×10⁻⁵ Torr inobvumira gasi rinosara, zvichikonzera oxidized interfaces uye kudzikira kwekushanda kwebonding.
Kurapa Plasma Kusina Kukwana: Kushanda kweplasma isina dose yakakwana (simba shoma/nguva pfupi) hakugone kugadzira mapoka akakodzera ekushanda kwepamusoro ekubatanidza makemikari.
Unyanzvi Hwakashata hweInterface: Kusavapo kwezvikamu zvinosimudzira kubatana (semuenzaniso, Cr, Ti, kana SiOₓ yemasisitimu esimbi-polymer) kunodzivirira kuchinja zvishoma nezvishoma kwehunhu hwezvinhu.
3. Matambudziko Ekubatana Kwezvinhu
Kusawirirana kwekuwedzera kwekupisa: Musiyano weCTE >5 ppm/°C pakati pekuputira ne substrate unokonzera kushushikana pakati pechiso panguva yekupisa, zvichikurudzira delamination inokonzerwa nekuneta.
Kusawirirana kweMakemikoro: Kushaikwa kwezvigadzirwa zve interfacial reaction (semuenzaniso, kuumbwa kwecarbide mumasystem esimbi-ceramic) kunoguma nekusungana kwemuviri chete nesimba shoma.
4. Kutyorwa kweParameter yeDeposition
Voltage yeBias isina kunaka: Kukanganiswa kwesubstrate kusina kunaka hakugone kupa maion akakwana ekusanganisa interface uye kugadzira zvikanganiso.
Zvikanganiso Zvinokonzereswa Nechiyero: Kuwanda kwehuwandu hwezvinhu zvinoiswa (>5 nm/s) kunokonzera kukura kwemakona ane miganhu ine maburi, zvichideredza simba rakabatana.
Zvikanganiso paKutarisira Tembiricha: Kutsauka kwetembiricha yemukati mechikamu chepasi pevhu >15% kubva padanho repamusoro kunokanganisa huwandu hwe nucleation uye kupararira kwe interfacial.
Nzira dzekudzivirira
Shandisai real-time plasma diagnostics (OES, Langmuir probes) kuti musimbise kushanda kwenzvimbo
Gadzira ma "interlayers" akarongwa uchishandisa "compositionally modulated deposition"
Chengetedza mitemo yakasimba yekudzora kusvibiswa (nzvimbo yekuchenesa ISO Kirasi 6+)
Shandisa girazi re quartz riri munzvimbo yaro kuti utarise huwandu/ukobvu hwegirazi
Gadzirai nhamba yekudzora maitiro ekuongorora zvinhu zvakakosha (kumanikidzwa, kusarura, tembiricha)
Mhedziso
Kuparadzanisa machira kunobva mukukundikana kwekubatana mumatanho akawanda ekugadzirisa pane kukanganisa kwema parameter akasiyana. Nzira yakasimba yekunamatira inoda kugadziriswa kwakabatana kwegadziriro ye substrate, interface engineering, uye deposition dynamics. Kuburikidza nekudzora kwakarongeka kwe interfacial chemistry uye stress management, maitiro emazuva ano e vacuum deposition anogona kuwana kushanda kwakafanana kwekunamatira kunodarika 50 MPa pamisanganiswa yakawanda yezvinhu.
—Nyaya iyi yakaburitswa na midziyo yekunamira ye vacuummugadziri Zhenhua Vacuum
Nguva yekutumira: Gumiguru-11-2025