Intshayelelo yeNkqubo yeVacuum Coating

Inkqubo yokucoca i-vacuum iteknoloji esetyenziselwa ukusebenzisa ifilimu encinci okanye i-coating ebusweni kwindawo yokucoca. Le nkqubo iqinisekisa umgangatho ophezulu, iyunifomu, kunye nokwaleka ixesha elide, nto leyo ebalulekileyo kumashishini ahlukeneyo afana ne-electronics, optics, automotive, kunye ne-aerospace. Kukho iintlobo ezahlukeneyo zeenkqubo zokugquma i-vacuum, nganye ilungele izicelo ezithile. Nazi iintlobo ezimbalwa eziphambili:
I-Physical Vapor Deposition (PVD): Le nkqubo ibandakanya ukuhanjiswa kwezinto ezibonakalayo ukusuka kumthombo oqinileyo okanye olwelo ukuya kwi-substrate. Iindlela eziqhelekileyo ziquka:

I-Sputtering: Izinto eziphathekayo zikhutshwa kwithagethi kwaye zifakwe kwi-substrate.
Ukuguquka kwamanzi: Isixhobo sifudunyezwa de sibe ngumphunga kwaye sijike kwi-substrate.
I-Chemical Vapor Deposition (CVD): Le nkqubo ibandakanya ukusabela kweekhemikhali phakathi kwe-precursor yesigaba somphunga kunye ne-substrate surface, eyenza ifilimu eqinile. Ukwahluka kubandakanya:

I-Plasma-Enhanced CVD (PECVD): Isebenzisa i-plasma ukuphucula ukuphendula kweekhemikhali.
I-Metal-Organic CVD (MOCVD): Isebenzisa i-metal-organic compounds njenge-precursors.
I-Atomic Layer Deposition (ALD): Inkqubo elawulwa kakhulu ebeka iileya zeatom enye ngexesha, iqinisekisa ubukhulu obuchanekileyo kunye nokwakheka.

I-Magnetron Sputtering: Uhlobo lwe-PVD apho iindawo zemagneti zisetyenziselwa ukuvala i-plasma, ukwandisa ukusebenza kakuhle kwenkqubo yokutshiza.

I-Ion Beam Deposition: Isebenzisa imiqadi ye-ion ukugalela imathiriyeli esuka kwindawo ekujoliswe kuyo kwaye uyifake kwi-substrate.

Usetyenziso:

I-semiconductors: Iingubo zee-microchips kunye namalungu e-elektroniki.
I-Optics: I-anti-reflective coatings, izibuko, kunye neelensi.
Iimoto: Iingubo zamacandelo e-injini kunye nokugqitywa kokuhombisa.
I-Aerospace: I-Thermal barrier barriers kunye nemigangatho yokukhusela.
Izibonelelo:

Iingubo ezifanayo: Ifezekisa ubukhulu obungaguqukiyo kunye nokwakheka kwi-substrate.
Ukubambelela okuphezulu: Iingubo zibambelela kakuhle kwi-substrate, ziphucula ukuqina.
Ukucoceka kunye noMgangatho: Indawo ye-vacuum inciphisa ukungcoliseka, okukhokelela ekugqumeni okuphezulu.

–Eli nqaku likhutshwa nguumenzi womatshini wokugqumaGuangdong Zhenhua